CN101861353B - 导热树脂组合物 - Google Patents
导热树脂组合物 Download PDFInfo
- Publication number
- CN101861353B CN101861353B CN2008801161874A CN200880116187A CN101861353B CN 101861353 B CN101861353 B CN 101861353B CN 2008801161874 A CN2008801161874 A CN 2008801161874A CN 200880116187 A CN200880116187 A CN 200880116187A CN 101861353 B CN101861353 B CN 101861353B
- Authority
- CN
- China
- Prior art keywords
- composition
- polymer
- filler
- volume
- thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US343007P | 2007-11-16 | 2007-11-16 | |
| US61/003430 | 2007-11-16 | ||
| PCT/US2008/083401 WO2009064883A1 (en) | 2007-11-16 | 2008-11-13 | Thermally conductive resin compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101861353A CN101861353A (zh) | 2010-10-13 |
| CN101861353B true CN101861353B (zh) | 2013-07-17 |
Family
ID=40292433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801161874A Expired - Fee Related CN101861353B (zh) | 2007-11-16 | 2008-11-13 | 导热树脂组合物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090152491A1 (enExample) |
| EP (1) | EP2209844A1 (enExample) |
| JP (1) | JP5547644B2 (enExample) |
| CN (1) | CN101861353B (enExample) |
| WO (1) | WO2009064883A1 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP5177089B2 (ja) * | 2008-07-30 | 2013-04-03 | 東レ株式会社 | ポリアリーレンスルフィド樹脂組成物、ポリアリーレンスルフィド樹脂組成物錠剤およびそれらから得られる成形品 |
| DK2350222T3 (da) * | 2008-11-07 | 2020-06-02 | Saint Gobain Performance Plastics Corp | Termoplastisk segl med stor diameter |
| US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
| JP2013545475A (ja) * | 2010-11-30 | 2013-12-26 | クワンタムディーエックス・グループ・リミテッド | マイクロ流体多重温度可撓性反応デバイスの設計、製造及び使用 |
| US20120157600A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Molded thermoplastic articles comprising thermally conductive polymers |
| US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
| CN102070899B (zh) * | 2010-12-30 | 2012-11-07 | 广东银禧科技股份有限公司 | 一种绝缘导热聚酰胺复合材料及制备方法 |
| CN102593338A (zh) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | 薄型高导热金属基板及其制作方法 |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| JP2012238820A (ja) * | 2011-05-13 | 2012-12-06 | Nitto Denko Corp | 熱伝導性シート、絶縁シートおよび放熱部材 |
| JP2012238819A (ja) * | 2011-05-13 | 2012-12-06 | Nitto Denko Corp | 熱伝導性シート、絶縁シートおよび放熱部材 |
| JP5819703B2 (ja) * | 2011-10-27 | 2015-11-24 | 株式会社神戸製鋼所 | 電動機 |
| TWI424014B (zh) * | 2011-11-08 | 2014-01-21 | Kenner Material & System Co Ltd | 阻燃導熱塑膠組成物 |
| CN103160134A (zh) * | 2011-12-14 | 2013-06-19 | 中国钢铁股份有限公司 | 导热性聚合物复合材料 |
| KR101457016B1 (ko) | 2011-12-30 | 2014-11-03 | 제일모직주식회사 | 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품 |
| CN102617886A (zh) * | 2012-01-06 | 2012-08-01 | 上海同立电工材料有限公司 | 导热填料在vpi真空压力浸渍树脂中的应用 |
| KR20130110037A (ko) * | 2012-03-27 | 2013-10-08 | 레미 테크놀러지스 엘엘씨 | 열 전도성 화합물을 갖는 ipm 기계 |
| CN102627937B (zh) * | 2012-03-27 | 2014-04-30 | 合肥工业大学 | 一种双组分导热聚氨酯灌封胶及其制备方法 |
| JP5932480B2 (ja) | 2012-05-02 | 2016-06-08 | デュポン株式会社 | 黒鉛が充填されたポリエステル組成物 |
| US10093069B2 (en) | 2012-05-23 | 2018-10-09 | Saint-Gobain Performance Plastics Corporation | Method of forming large diameter thermoplastic seal |
| KR101596546B1 (ko) * | 2013-02-21 | 2016-03-07 | 제일모직주식회사 | 내충격성이 우수한 열전도성 폴리카보네이트 수지조성물 |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| JP6316556B2 (ja) * | 2013-08-29 | 2018-04-25 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 電気絶縁性および熱伝導性のポリマー組成物 |
| JP2015059130A (ja) * | 2013-09-17 | 2015-03-30 | 明和化成株式会社 | エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材 |
| WO2015189761A1 (en) * | 2014-06-09 | 2015-12-17 | Sabic Global Technologies B.V. | Thermal conductive compositions having good impact performance |
| JP6580851B2 (ja) * | 2015-03-31 | 2019-10-02 | 国立大学法人広島大学 | 高熱伝導性電気絶縁組成物 |
| FR3034771B1 (fr) | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
| FR3034775B1 (fr) | 2015-04-13 | 2018-09-28 | Hutchinson | Materiau pour le stockage thermique |
| CN107787349A (zh) * | 2015-06-29 | 2018-03-09 | 沙特基础工业全球技术公司 | 导热聚合物复合材料 |
| TWI708806B (zh) | 2015-08-17 | 2020-11-01 | 美商堤康那責任有限公司 | 用於相機模組之液晶聚合物組合物 |
| JP6335374B2 (ja) * | 2017-07-25 | 2018-05-30 | 明和化成株式会社 | エポキシ樹脂組成物及びその用途 |
| JP7248217B2 (ja) * | 2017-12-04 | 2023-03-29 | 積水ポリマテック株式会社 | 熱伝導性組成物 |
| CN108587155A (zh) * | 2018-05-25 | 2018-09-28 | 郑州智锦电子科技有限公司 | 一种导热聚酰胺复合材料及其制备方法 |
| FR3084202B1 (fr) * | 2018-07-20 | 2020-10-23 | Inst Supergrid | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
| CN113574106A (zh) * | 2019-01-11 | 2021-10-29 | 杜邦聚合物公司 | 电绝缘且导热的聚合物组合物 |
| FR3098817A1 (fr) * | 2019-07-16 | 2021-01-22 | Ppg Industries Ohio, Inc. | Compositions contenant des charges thermiquement conductrices |
| CN110423447A (zh) * | 2019-08-19 | 2019-11-08 | 浙江衡昶科技有限公司 | 一种由改性天然植物纤维、生物基材料补强增韧不饱和聚酯树脂的制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1333801A (zh) * | 1999-01-29 | 2002-01-30 | 酷选择股份有限公司 | 导热复合材料 |
| JP2002188007A (ja) * | 2000-12-21 | 2002-07-05 | Hitachi Metals Ltd | 複合材料及び回路基板 |
| CN1696194A (zh) * | 2004-05-14 | 2005-11-16 | 住友化学株式会社 | 高导热性树脂组合物 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PH15509A (en) * | 1974-05-10 | 1983-02-03 | Du Pont | Improvements in an relating to synthetic polyesters |
| US4174358A (en) * | 1975-05-23 | 1979-11-13 | E. I. Du Pont De Nemours And Company | Tough thermoplastic nylon compositions |
| JPS5780447A (en) * | 1980-11-06 | 1982-05-20 | Kuraray Co Ltd | Mica powder-filled polybutylene terephthalate resin composition |
| EP0174343B1 (en) * | 1984-02-24 | 1992-04-29 | E.I. Du Pont De Nemours And Company | Toughened thermoplastic polyester compositions |
| JPS6291559A (ja) * | 1985-10-17 | 1987-04-27 | Wako Kasei Kogyo Kk | 射出成形用樹脂組成物 |
| JPH0726011B2 (ja) * | 1986-10-17 | 1995-03-22 | ポリプラスチックス株式会社 | ポリエステル樹脂組成物 |
| JPH03200397A (ja) * | 1989-12-27 | 1991-09-02 | Tokai Rubber Ind Ltd | 放熱シート |
| JP2574055B2 (ja) * | 1990-07-25 | 1997-01-22 | ポリプラスチックス株式会社 | ポリブチレンテレフタレート系樹脂中空成形品及びその製造法 |
| JPH09328610A (ja) * | 1996-06-12 | 1997-12-22 | Nitto Denko Corp | 耐熱樹脂製管状物 |
| US6093765A (en) * | 1998-11-03 | 2000-07-25 | E. I. Du Pont De Nemours And Company | Compositions containing liquid crystalline polymers |
| US6620497B2 (en) * | 2000-01-11 | 2003-09-16 | Cool Options, Inc. | Polymer composition with boron nitride coated carbon flakes |
| JP4369594B2 (ja) * | 2000-04-28 | 2009-11-25 | 古河電気工業株式会社 | 熱伝導性成形体 |
| WO2001096458A1 (de) * | 2000-06-16 | 2001-12-20 | Siemens Aktiengesellschaft | Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu |
| US6851869B2 (en) * | 2000-08-04 | 2005-02-08 | Cool Options, Inc. | Highly thermally conductive electronic connector |
| JP2002118991A (ja) * | 2000-10-02 | 2002-04-19 | Fuji Electric Co Ltd | 回転電機のコアワニスおよびこのワニスを塗布した積層コア |
| JP2003306594A (ja) * | 2002-04-17 | 2003-10-31 | Hitachi Ltd | エポキシ樹脂組成物およびそれを用いた回転機 |
| US7077990B2 (en) * | 2002-06-26 | 2006-07-18 | Cool Options, Inc. | High-density, thermally-conductive plastic compositions for encapsulating motors |
| US6854279B1 (en) * | 2003-06-09 | 2005-02-15 | The United States Of America As Represented By The Secretary Of The Navy | Dynamic desiccation cooling system for ships |
| US20050176835A1 (en) * | 2004-01-12 | 2005-08-11 | Toshikazu Kobayashi | Thermally conductive thermoplastic resin compositions |
| US7327578B2 (en) * | 2004-02-06 | 2008-02-05 | Sun Microsystems, Inc. | Cooling failure mitigation for an electronics enclosure |
| JP4434854B2 (ja) * | 2004-06-25 | 2010-03-17 | 株式会社東芝 | 回転電機 |
| WO2006006535A1 (ja) * | 2004-07-12 | 2006-01-19 | Mitsubishi Engineering-Plastics Corporation | 熱可塑性樹脂組成物 |
| JP2006109600A (ja) * | 2004-10-04 | 2006-04-20 | Toshiba Corp | 回転電機の固定子コイルおよびその固定方法 |
| US7621134B2 (en) * | 2006-09-08 | 2009-11-24 | International Business Machines Corporation | Air re-cool for electronic equipment |
| JP4709795B2 (ja) * | 2007-03-16 | 2011-06-22 | 株式会社東芝 | 高熱伝導性材料 |
| US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
-
2008
- 2008-11-12 US US12/291,590 patent/US20090152491A1/en not_active Abandoned
- 2008-11-13 WO PCT/US2008/083401 patent/WO2009064883A1/en not_active Ceased
- 2008-11-13 CN CN2008801161874A patent/CN101861353B/zh not_active Expired - Fee Related
- 2008-11-13 JP JP2010534177A patent/JP5547644B2/ja not_active Expired - Fee Related
- 2008-11-13 EP EP08848744A patent/EP2209844A1/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1333801A (zh) * | 1999-01-29 | 2002-01-30 | 酷选择股份有限公司 | 导热复合材料 |
| JP2002188007A (ja) * | 2000-12-21 | 2002-07-05 | Hitachi Metals Ltd | 複合材料及び回路基板 |
| CN1696194A (zh) * | 2004-05-14 | 2005-11-16 | 住友化学株式会社 | 高导热性树脂组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101861353A (zh) | 2010-10-13 |
| JP2011503328A (ja) | 2011-01-27 |
| US20090152491A1 (en) | 2009-06-18 |
| WO2009064883A1 (en) | 2009-05-22 |
| JP5547644B2 (ja) | 2014-07-16 |
| EP2209844A1 (en) | 2010-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20201113 |
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| CF01 | Termination of patent right due to non-payment of annual fee |