CN102593338A - 薄型高导热金属基板及其制作方法 - Google Patents
薄型高导热金属基板及其制作方法 Download PDFInfo
- Publication number
- CN102593338A CN102593338A CN201110002244XA CN201110002244A CN102593338A CN 102593338 A CN102593338 A CN 102593338A CN 201110002244X A CN201110002244X A CN 201110002244XA CN 201110002244 A CN201110002244 A CN 201110002244A CN 102593338 A CN102593338 A CN 102593338A
- Authority
- CN
- China
- Prior art keywords
- adhesion coating
- copper foil
- base plate
- metal base
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 43
- 239000002184 metal Substances 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 51
- 238000000576 coating method Methods 0.000 claims abstract description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011889 copper foil Substances 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000011343 solid material Substances 0.000 claims abstract description 7
- 238000010023 transfer printing Methods 0.000 claims abstract description 4
- 239000013047 polymeric layer Substances 0.000 claims description 34
- 230000005855 radiation Effects 0.000 claims description 23
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000767 polyaniline Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- -1 amido formate Chemical compound 0.000 claims description 2
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract 7
- 239000012790 adhesive layer Substances 0.000 abstract 6
- 230000017525 heat dissipation Effects 0.000 abstract 5
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
本发明公开了一种薄型高导热金属基板,包括铜箔层、粘着层和绝缘导热聚合物层,所述绝缘导热聚合物层固定夹置于所述铜箔层和所述粘着层之间,绝缘导热聚合物层包括固体材料和散热粉体,粘着层包括树脂层和散热粉体,其制作方法为:在铜箔层的粗糙面涂布绝缘导热聚合物,并加以烘干形成绝缘导热聚合物层后得到一单面铜箔基板;然后用涂布和转印法中的一种将粘着层形成于绝缘导热聚合物层表面上,并使粘着层处于半聚合半硬化状态;最后加热固化,并贴合于各种金属基板上应用于各类散热产品中,由于粘着层和绝缘导热聚合物层中都含有散热粉体,且产品整体厚度相对较薄,使得本发明散热效率高,绝缘导热聚合物层还起到绝缘抗电压击穿的作用。
Description
技术领域
本发明涉及一种用于LED等散热产品上的柔性基板,尤其是一种具有高散热效率的薄型高导热金属基板及其制作方法。
背景技术
随着全球环保的意识抬头,节能省电已成为当今的趋势。LED产业是近年来最受瞩目的产业之一。发展至今,LED产品已具有节能、省电、高效率、反应时间快、寿命周期长、且不含汞,具有环保效益等优点。然而通常LED高功率产品输入功率只有约为20%能转换成光,剩下80%的电能均转换为热能。
一般而言,LED发光时所产生的热能若无法导出,将会使LED结面温度过高,进而影响产品生命周期、发光效率和稳定性。
当结面温度由25℃上升至100℃时,其发光效率将会衰退20%到75%不等,其中又以黄色光衰退75%最为严重。此外,当LED的操作环境温度越高,其产品寿命亦越低,当操作温度由63℃升到74℃时,LED平均寿命将会减少3/4。
发明内容
为了弥补以上不足,本发明提供了一种薄型高导热金属基板及其制作方法,该薄型高导热金属基板具有散热效率高的优点。
本发明为了解决其技术问题所采用的技术方案是:一种薄型高导热金属基板,包括绝缘导热聚合物层、用于将所述薄型高导热金属基板粘附于印刷电路板上的粘着层和铜箔层,所述绝缘导热聚合物层固定夹置于所述铜箔层和所述粘着层之间,所述绝缘导热聚合物层包括固体材料和散热粉体,所述粘着层包括树脂层和散热粉体,当然绝缘导热聚合物层除了固体的材料和散热粉体外还可包括促进剂和催化剂等,粘着层除了树脂层和散热粉体还可以包括橡胶、固化剂和奈米填充料等,由于所述绝缘导热聚合物层和粘着层中含有散热粉体,散热粉体提高散热效果,所以本发明具有较好的散热效果。
作为本发明的进一步改进,以重量百分比计,所述散热粉体占所述粘着层固含量的40~90%。
作为本发明的进一步改进,所述散热粉体为碳化硅、氮化硼、氧化铝和氮化铝中的至少一种。
作为本发明的进一步改进,所述散热粉体的平均粒径为5~20微米。
作为本发明的进一步改进,所述铜箔层为电解铜箔和压延铜箔中的一种,使用该铜箔层可以在薄型高导热金属基板上形成高散热的电路层,铜箔层的厚度为12.5~35微米,优选的是16~35微米。
作为本发明的进一步改进,所述绝缘导热聚合物层的厚度为5~12微米。
作为本发明的进一步改进,所述绝缘导热聚合物层的固体材料为聚酰亚胺、聚对苯二甲酸乙二酯、聚苯胺、聚萘二甲酸乙二酯、环氧树脂和聚碳酸酯中的至少一种,优选的是聚酰亚胺和聚对苯二甲酸乙二酯中的至少一种,使用该绝缘导热聚合物层之后对薄型高导热金属基板的抗电击穿和机械强度都有明显的提高。
作为本发明的进一步改进,所述粘着层的树脂层为环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和聚酰亚胺树脂中的至少一种。
作为本发明的进一步改进,所述粘着层的厚度为5~30um。
作为本发明的进一步改进,还包括与所述粘着层外表面进行压合热固化的金属基板,如铝基板、铜基板等金属材质基板。
作为本发明的进一步改进,为了维持本发明薄型高导热金属基板的特性以应用于LED等散热产品,并能有效控制成本,本发明将所述粘着层的厚度为20~25微米,所述绝缘导热聚合物层的厚度为5~8微米。
本发明通过控制绝缘导热聚合物层的厚度和粘着层的厚度,达到控制散热效果和耐击穿电压的目的。
一种薄型高导热金属基板的制作方法,包括如下步骤:
步骤一:在铜箔层的粗糙面涂布绝缘导热聚合物,并加以烘干形成绝缘导热聚合物层后得到一单面铜箔基板;
步骤二:用涂布和转印法中的一种将粘着层形成于绝缘导热聚合物层表面上,并使粘着层处于半聚合半硬化状态(B-stage状态,此时粘着层分子与分子之间化学键不多,在高温高压下还会软化);
步骤三:将贴合后的基板按一定的加热条件进行固化。
所述的薄型高导热金属基板的制作方法,步骤三之后还包括如下步骤:贴合金属基板到粘着层外表面,并进行热固化。
本发明的有益效果是:本发明依次包括铜箔层、绝缘导热聚合物层和粘着层,制作方法简便,可以根据需要调整粘着层与绝缘导热聚合物层的厚度,使本发明具有高热传导效率,高耐击穿电压的特性。
附图说明
图1为本发明的剖面结构示意图;
图2为本发明贴合金属基板的剖面图。
具体实施方式
实施例:一种薄型高导热金属基板,包括铜箔层11、绝缘导热聚合物层12和粘着层13,所述绝缘导热聚合物层12包括固体材料和散热粉体,粘着层13包括树脂层和散热粉体,粘着层13用于将所述薄型高导热金属基板粘附于各种金属基板或其他基材上,当然绝缘导热聚合物层12除了固体的材料和散热粉体外还可包括促进剂、催化剂等,粘着层13除了树脂层和散热粉体还可以包括橡胶、固化剂和奈米填充料等,所述绝缘导热聚合物层固定夹置于所述铜箔层和所述粘着层之间,由于所述粘着层和绝缘导热聚合物层中均含有散热粉体,散热粉体能提高散热效果,所以本发明的薄型高导热金属基板具有较好的散热效果。
所述散热粉体为碳化硅、氮化硼、氧化铝和氮化铝中的至少一种。以重量百分比计,所述粘着层中散热粉体占所述粘着层固含量的40~90%。
所述散热粉体的平均粒径为5~20微米。
所述绝缘导热聚合物层12的固体材料为聚酰亚胺、聚对苯二甲酸乙二酯、聚苯胺、聚萘二甲酸乙二酯、环氧树脂和聚碳酸酯中的至少一种,优选的是聚酰亚胺和聚对苯二甲酸乙二酯中的至少一种,进一步优选的是使用不含卤素的热固性聚酰亚胺材料,更优选的是使用具有自黏性且不含卤素的热固性聚酰亚胺材料。
所述铜箔层所使用的铜箔为压延铜箔(RA铜箔)和高温高屈曲铜箔(HA铜箔)中的一种,铜箔层的厚度为12.5~35微米,优选的是16~35微米。
为了维持本发明柔性高导热基板的特性以应用于LED电路板,并能有效控制成本,本发明中所述粘着层的厚度为20~25微米,将所述绝缘导热聚合物层的厚度为5~8微米。
还包括与所述粘着层外表面进行压合热固化的金属基板14,如铝基板、铜基板等金属材质基板。
一种薄型高导热金属基板的制作方法,包括如下步骤:
步骤一:在铜箔层11的粗糙面涂布绝缘导热聚合物,并加以烘干形成绝缘导热聚合物层12后得到一单面铜箔基板;
步骤二:用涂布和转印法中的一种将粘着层13形成于绝缘导热聚合物层12表面上,并使粘着层13处于半聚合半硬化状态(B-stage状态,此时粘着层分子与分子之间化学键不多,在高温高压下还会软化);
步骤三:将贴合后的基板按一定的加热条件进行固化。
所述的薄型高导热金属基板的制作方法,步骤三之后还包括如下步骤:贴合金属基板14到粘着层外表面,并进行热固化。
对薄型高导热金属基板进行热传导分析测试:用热导系数仪(Hot Disk)进行热传导分析测试,在传感器上下两面覆盖两完全固化后蚀刻铜箔层的薄型高导热金属基板样品,并在该两个薄型高导热金属基板外侧面分别以两钢板夹置绝缘导热聚合物层和传感器,并由传感器测量绝缘导热聚合物层和粘着层的导热性能,将对本发明的绝缘导热聚合物层和粘着层所作的测试作为实验组,以同样的方法测试一般导热基板的导热性能作为比较例,将测得的热传导系数结果纪录于表1中:
表1
由上表可知,本发明相对于一般的导热基板,在设计上能够通过降低整体产品的厚度从而达到了高导热效率的作用,热传导的效率可以达到0.06以上,另由于增加了一层绝缘导热聚合物层,从而达到了高耐击穿电压的效果。
Claims (10)
1.一种薄型高导热金属基板,其特征在于:包括铜箔层、绝缘导热聚合物层和粘着层,所述绝缘导热聚合物层包括固体材料和散热粉体,所述粘着层包括树脂层和散热粉体,所述绝缘导热聚合物层固定夹置于所述铜箔层和所述粘着层之间。
2.根据权利要求1所述的薄型高导热金属基板,其特征在于:以重量百分比计,所述粘着层中的散热粉体占所述粘着层固含量的40~90%。
3.根据权利要求1或2所述的薄型高导热金属基板,其特征在于:所述散热粉体的平均粒径为5~20微米的碳化硅、氮化硼、氧化铝和氮化铝中的至少一种。
4.根据权利要求1所述的薄型高导热金属基板,其特征在于:所述铜箔层为电解铜箔和压延铜箔中的一种。
5.根据权利要求1所述的薄型高导热金属基板,其特征在于:所述铜箔层厚度为12.5~35微米,绝缘导热聚合物层的厚度为5~12微米,粘着层的厚度为5~30微米。
6.根据权利要求1所述的薄型高导热金属基板,其特征在于:所述绝缘导热聚合物层的固体材料为聚酰亚胺、聚对苯二甲酸乙二酯、聚苯胺、聚萘二甲酸乙二酯、环氧树脂和聚碳酸酯中的至少一种。
7.根据权利要求1所述的薄型高导热金属基板,其特征在于:所述粘着层的树脂层为环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和聚酰亚胺树脂中的至少一种。
8.根据权利要求1所述的薄型高导热金属基板,其特征在于:还包括与所述粘着层外表面进行压合热固化的金属基板。
9.一种如权利要求1所述的薄型高导热金属基板的制作方法,其特征在于:包括如下步骤:
步骤一:在铜箔层的粗糙面涂布绝缘导热聚合物,并加以烘干形成绝缘导热聚合物层后得到一单面铜箔基板;
步骤二:用涂布和转印法中的一种将粘着层形成于绝缘导热聚合物层表面上,并使粘着层处于半聚合半硬化状态;
步骤三:将贴合后的基板按一定的加热条件进行固化。
10.根据权利要求9所述的薄型高导热金属基板的制作方法,其特征在于:步骤三之后还包括如下步骤:贴合金属基板到粘着层外表面,并进行热固化。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110002244XA CN102593338A (zh) | 2011-01-07 | 2011-01-07 | 薄型高导热金属基板及其制作方法 |
TW100216334U TWM420148U (en) | 2011-01-07 | 2011-08-09 | Thin mental substrate with high thermal conductivity |
JP2011007034U JP3173569U (ja) | 2011-01-07 | 2011-11-29 | 薄型高熱伝導金属基板 |
US13/438,099 US9902137B2 (en) | 2011-01-07 | 2012-04-03 | Thin metal substrate having high thermal conductivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110002244XA CN102593338A (zh) | 2011-01-07 | 2011-01-07 | 薄型高导热金属基板及其制作方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102593338A true CN102593338A (zh) | 2012-07-18 |
Family
ID=46452234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110002244XA Pending CN102593338A (zh) | 2011-01-07 | 2011-01-07 | 薄型高导热金属基板及其制作方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9902137B2 (zh) |
JP (1) | JP3173569U (zh) |
CN (1) | CN102593338A (zh) |
TW (1) | TWM420148U (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103025127A (zh) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | 散热贴膜 |
CN103879087A (zh) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | 导热铜箔 |
CN103963386A (zh) * | 2014-03-05 | 2014-08-06 | 金安国纪科技股份有限公司 | 金属基覆铜板及其制备方法 |
WO2015123804A1 (zh) * | 2014-02-18 | 2015-08-27 | 陈鸿文 | 自粘性电路软胶膜及使用该软胶膜的led灯体结构 |
CN105280587A (zh) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | 功率模块用散热片及用其制成的功率模块 |
CN105992457A (zh) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | 导热铜箔金属基板 |
CN109768019A (zh) * | 2018-12-29 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | 一种功率模块用散热片及用其制成的功率模块 |
CN110305357A (zh) * | 2012-11-27 | 2019-10-08 | 积水化学工业株式会社 | 电子装置用热传导性发泡体片和电子装置用热传导性叠层体 |
CN113442527A (zh) * | 2021-07-07 | 2021-09-28 | 王氏港建移动科技有限公司 | 在电子电路或组件中有用的金属聚合物界面 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101421083B1 (ko) * | 2012-06-13 | 2014-07-18 | 손재설 | 히트싱크 일체형 회로기판의 제조방법 |
BR102013027786A2 (pt) * | 2013-10-29 | 2015-11-24 | Mahle Int Gmbh | bronzina e biela |
CN103945641B (zh) * | 2014-05-13 | 2016-08-31 | 邢台市海纳电子科技有限责任公司 | 高导热线路板及其制作方法 |
WO2016020398A1 (en) * | 2014-08-05 | 2016-02-11 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Adhesion promoting material-coated electrically conductive carrier with thermally conductive layer |
CN106445226B (zh) * | 2016-08-29 | 2019-09-10 | 业成科技(成都)有限公司 | 低成本压力感测器制作方法及其结构 |
CN108419362A (zh) * | 2017-02-09 | 2018-08-17 | 昆山雅森电子材料科技有限公司 | 一种具有高散热效率的frcc基材及其制作方法 |
KR20180127148A (ko) * | 2017-05-18 | 2018-11-28 | 주식회사 아모그린텍 | 방열복합재 및 이의 제조방법 |
KR102498313B1 (ko) * | 2017-07-24 | 2023-02-09 | 주식회사 아모그린텍 | 절연성 방열복합재 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080047742A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
CN101707853A (zh) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | 金属基覆铜箔板 |
CN201590948U (zh) * | 2009-12-30 | 2010-09-22 | 昆山雅森电子材料科技有限公司 | 双面铜箔基板 |
CN101861353A (zh) * | 2007-11-16 | 2010-10-13 | 纳幕尔杜邦公司 | 导热树脂组合物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
JP2008130780A (ja) * | 2006-11-21 | 2008-06-05 | Hitachi Ltd | 希土類磁石 |
US8383230B2 (en) * | 2007-05-24 | 2013-02-26 | Arisawa Mfg. Co., Ltd. | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
JP5280034B2 (ja) * | 2007-10-10 | 2013-09-04 | 日東電工株式会社 | 配線回路基板用両面粘着テープ又はシートおよび配線回路基板 |
JP5156511B2 (ja) * | 2008-07-11 | 2013-03-06 | ポリマテック株式会社 | 熱伝導性シート複合体及びその製造方法 |
TWM377823U (en) * | 2009-11-17 | 2010-04-01 | Asia Electronic Material Co | Complex double-sided copper clad laminate and structure of flexible printed circuit board using the same |
-
2011
- 2011-01-07 CN CN201110002244XA patent/CN102593338A/zh active Pending
- 2011-08-09 TW TW100216334U patent/TWM420148U/zh not_active IP Right Cessation
- 2011-11-29 JP JP2011007034U patent/JP3173569U/ja not_active Expired - Lifetime
-
2012
- 2012-04-03 US US13/438,099 patent/US9902137B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080047742A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
CN101861353A (zh) * | 2007-11-16 | 2010-10-13 | 纳幕尔杜邦公司 | 导热树脂组合物 |
CN101707853A (zh) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | 金属基覆铜箔板 |
CN201590948U (zh) * | 2009-12-30 | 2010-09-22 | 昆山雅森电子材料科技有限公司 | 双面铜箔基板 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110305357B (zh) * | 2012-11-27 | 2021-06-01 | 积水化学工业株式会社 | 电子装置用热传导性发泡体片和电子装置用热传导性叠层体 |
CN110305357A (zh) * | 2012-11-27 | 2019-10-08 | 积水化学工业株式会社 | 电子装置用热传导性发泡体片和电子装置用热传导性叠层体 |
CN103025127A (zh) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | 散热贴膜 |
WO2015123804A1 (zh) * | 2014-02-18 | 2015-08-27 | 陈鸿文 | 自粘性电路软胶膜及使用该软胶膜的led灯体结构 |
CN103963386B (zh) * | 2014-03-05 | 2016-05-11 | 金安国纪科技股份有限公司 | 金属基覆铜板及其制备方法 |
CN103963386A (zh) * | 2014-03-05 | 2014-08-06 | 金安国纪科技股份有限公司 | 金属基覆铜板及其制备方法 |
CN103879087A (zh) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | 导热铜箔 |
CN105992457A (zh) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | 导热铜箔金属基板 |
CN105280587A (zh) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | 功率模块用散热片及用其制成的功率模块 |
CN105280587B (zh) * | 2015-07-03 | 2018-08-07 | 苏州赛伍应用技术股份有限公司 | 功率模块用散热片及用其制成的功率模块 |
CN109768019A (zh) * | 2018-12-29 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | 一种功率模块用散热片及用其制成的功率模块 |
CN109768019B (zh) * | 2018-12-29 | 2020-12-25 | 苏州赛伍应用技术股份有限公司 | 一种功率模块用散热片及用其制成的功率模块 |
CN113442527A (zh) * | 2021-07-07 | 2021-09-28 | 王氏港建移动科技有限公司 | 在电子电路或组件中有用的金属聚合物界面 |
Also Published As
Publication number | Publication date |
---|---|
US20130040120A1 (en) | 2013-02-14 |
TWM420148U (en) | 2012-01-01 |
JP3173569U (ja) | 2012-02-09 |
US9902137B2 (en) | 2018-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102593338A (zh) | 薄型高导热金属基板及其制作方法 | |
TWI705001B (zh) | 熱傳導片、電子裝置 | |
US20160279900A1 (en) | Electromagnetic-wave-absorbing heat dissipation sheet | |
CN102595766A (zh) | 柔性铜箔高导热基板及其制作方法 | |
US20160324031A1 (en) | Heat sink | |
CN101784137A (zh) | 软性电热装置及其制造方法 | |
CN103042762B (zh) | 高导热金属基板 | |
CN102469685A (zh) | 导热双面软硬结合基板及其制作方法 | |
CN202271584U (zh) | 高导热金属基板 | |
CN202285457U (zh) | 散热基材 | |
CN204634154U (zh) | 双面导热基板 | |
CN201910417U (zh) | 薄型高导热金属基板 | |
CN202135441U (zh) | 一种复合散热片 | |
CN103068151B (zh) | 散热基材 | |
CN102673048A (zh) | 一种高导热性铝基覆铜板制作方法 | |
CN108419362A (zh) | 一种具有高散热效率的frcc基材及其制作方法 | |
CN201937950U (zh) | 柔性铜箔高导热基板 | |
CN107502258A (zh) | 一种导热胶及其制备方法 | |
TWM556055U (zh) | 軟性背膠銅箔基板 | |
CN103826425B (zh) | 一种高导热泡棉的制备方法 | |
TWM589118U (zh) | 導熱薄膜結構 | |
CN103050616B (zh) | 复合式导热铜箔基板 | |
CN204810782U (zh) | 散热片 | |
CN107995780B (zh) | 一种高性能散热柔性电路板 | |
CN205179500U (zh) | 具有导电导热功能的高平坦性补强板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120718 |