JP2010525145A5 - - Google Patents
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- Publication number
- JP2010525145A5 JP2010525145A5 JP2010506287A JP2010506287A JP2010525145A5 JP 2010525145 A5 JP2010525145 A5 JP 2010525145A5 JP 2010506287 A JP2010506287 A JP 2010506287A JP 2010506287 A JP2010506287 A JP 2010506287A JP 2010525145 A5 JP2010525145 A5 JP 2010525145A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- thermally conductive
- volume
- composition according
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 claims description 20
- 239000011231 conductive filler Substances 0.000 claims description 7
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910017539 Cu-Li Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020944 Sn-Mg Inorganic materials 0.000 description 1
- 229910020941 Sn-Mn Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018725 Sn—Al Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008953 Sn—Mn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92592607P | 2007-04-24 | 2007-04-24 | |
| US60/925,926 | 2007-04-24 | ||
| PCT/US2008/005418 WO2008134031A2 (en) | 2007-04-24 | 2008-04-24 | Thermally conductive and electrically resistive liquid crystalline polymer composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010525145A JP2010525145A (ja) | 2010-07-22 |
| JP2010525145A5 true JP2010525145A5 (enExample) | 2011-06-16 |
| JP5398700B2 JP5398700B2 (ja) | 2014-01-29 |
Family
ID=39885865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010506287A Expired - Fee Related JP5398700B2 (ja) | 2007-04-24 | 2008-04-24 | 熱伝導性および電気抵抗性液晶ポリマー組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8029694B2 (enExample) |
| EP (1) | EP2139944A2 (enExample) |
| JP (1) | JP5398700B2 (enExample) |
| CN (2) | CN101663351A (enExample) |
| WO (1) | WO2008134031A2 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP5229462B2 (ja) * | 2008-07-24 | 2013-07-03 | 三菱瓦斯化学株式会社 | 絶縁性高熱伝導率樹脂複合材料 |
| EP2456814A1 (en) * | 2009-07-24 | 2012-05-30 | Ticona LLC | Thermally conductive thermoplastic resin compositions and related applications |
| JP5503915B2 (ja) * | 2009-07-30 | 2014-05-28 | 住友化学株式会社 | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
| KR20110012780A (ko) * | 2009-07-31 | 2011-02-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
| SG183459A1 (en) * | 2010-02-25 | 2012-09-27 | Ticona Llc | Thermally conductive and dimensionally stable liquid crystalline polymer composition |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| KR101773204B1 (ko) * | 2011-10-31 | 2017-09-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 대전방지 특성을 갖는 전방향족 액정 폴리에스테르 수지 컴파운드 및 물품 |
| EP2673786B1 (en) * | 2012-06-05 | 2015-08-19 | Dow Corning Corporation | Soft tacky gel for use in power converters |
| US9284435B2 (en) | 2012-10-16 | 2016-03-15 | Ticona Llc | Antistatic liquid crystalline polymer composition |
| WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
| WO2014088700A1 (en) * | 2012-12-05 | 2014-06-12 | Ticona Llc | Conductive liquid crystalline polymer composition |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| CN111732821A (zh) | 2013-03-13 | 2020-10-02 | 提克纳有限责任公司 | 抗静电液晶聚合物组合物 |
| WO2015095035A1 (en) * | 2013-12-20 | 2015-06-25 | Ticona Llc | Metal detectable liquid crystalline polymer composition |
| JP6349543B2 (ja) * | 2013-12-25 | 2018-07-04 | パナソニックＩｐマネジメント株式会社 | 冷却構造体および冷却構造体の製造方法 |
| CN106164172B (zh) | 2014-04-09 | 2019-07-26 | 提克纳有限责任公司 | 摄像模组 |
| KR102305241B1 (ko) | 2014-04-09 | 2021-09-24 | 티코나 엘엘씨 | 대전방지 중합체 조성물 |
| CN104388052A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机相变储热材料及其制备方法 |
| CN104388051A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机定型储热材料及其制备方法 |
| CN104449583A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机储热材料及其制备方法 |
| CN104449582A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机物储热材料及其制备方法 |
| CN104388054A (zh) * | 2014-11-04 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型复合有机储热材料及其制备方法 |
| WO2016178943A1 (en) * | 2015-05-01 | 2016-11-10 | Kim Yong-Jihn | New generation conductive polymers, manufacturing method thereof, and their applications including electric wires, tapes, and cables, hot surface igniters, electronics devices, 3d printing filaments, and lightweight materials for automobile and aerospace ship |
| WO2017196259A1 (en) * | 2016-05-10 | 2017-11-16 | Republic Polytechnic | A heat sink, a filler for a heat sink and methods thereof |
| CN108192459B (zh) * | 2017-11-23 | 2019-12-31 | 中国科学院深圳先进技术研究院 | 导热复合材料及其制备方法和应用 |
| KR102627886B1 (ko) | 2017-12-05 | 2024-01-19 | 티코나 엘엘씨 | 카메라 모듈에 사용하기 위한 방향족 중합체 조성물 |
| US20200072564A1 (en) * | 2018-08-31 | 2020-03-05 | Sharp Kabushiki Kaisha | Thermal switch, method for manufacturing thermal switch, thermally conductive filler-containing composite material, apparatus containing the composite material, and display device |
| KR20200080017A (ko) * | 2018-12-26 | 2020-07-06 | 삼성전자주식회사 | 전지 케이스, 및 전지 |
| EP4110610A4 (en) | 2020-02-26 | 2024-03-27 | Ticona LLC | POLYMER COMPOSITION FOR ELECTRONIC DEVICE |
| JP7737387B2 (ja) | 2020-02-26 | 2025-09-10 | ティコナ・エルエルシー | 回路構造体 |
| KR20220146567A (ko) | 2020-02-26 | 2022-11-01 | 티코나 엘엘씨 | 전자 디바이스 |
| US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
| CN118613966A (zh) | 2021-12-01 | 2024-09-06 | 提克纳有限责任公司 | 天线模块 |
| WO2024016312A1 (en) * | 2022-07-22 | 2024-01-25 | Ticona Llc | In-wheel motor |
| CN116948499A (zh) * | 2023-07-31 | 2023-10-27 | 深圳市信维通信股份有限公司 | 复合导热膜的制备方法及复合导热膜 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109313A (ja) * | 1991-10-14 | 1993-04-30 | Toshiba Chem Corp | 導電性樹脂組成物およびその成形品 |
| AU2002323471B2 (en) * | 2001-08-31 | 2005-01-06 | Ticona Polymers, Inc. | Thermally conductive lamp reflector |
| CN1308399C (zh) * | 2001-09-27 | 2007-04-04 | 日本科学冶金株式会社 | 高导热性树脂组合物及其制备方法 |
| JP5340595B2 (ja) * | 2005-06-06 | 2013-11-13 | 日本科学冶金株式会社 | 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法 |
| JP2008075063A (ja) * | 2006-08-22 | 2008-04-03 | Sumitomo Chemical Co Ltd | 液晶性ポリマー成形体 |
-
2008
- 2008-04-23 US US12/148,906 patent/US8029694B2/en not_active Expired - Fee Related
- 2008-04-24 WO PCT/US2008/005418 patent/WO2008134031A2/en not_active Ceased
- 2008-04-24 CN CN200880013142A patent/CN101663351A/zh active Pending
- 2008-04-24 EP EP08743344A patent/EP2139944A2/en not_active Withdrawn
- 2008-04-24 JP JP2010506287A patent/JP5398700B2/ja not_active Expired - Fee Related
- 2008-04-24 CN CN201310594246.1A patent/CN103756348A/zh active Pending
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