JP2010525145A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010525145A5 JP2010525145A5 JP2010506287A JP2010506287A JP2010525145A5 JP 2010525145 A5 JP2010525145 A5 JP 2010525145A5 JP 2010506287 A JP2010506287 A JP 2010506287A JP 2010506287 A JP2010506287 A JP 2010506287A JP 2010525145 A5 JP2010525145 A5 JP 2010525145A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- thermally conductive
- volume
- composition according
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 20
- 239000011231 conductive filler Substances 0.000 claims description 7
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910017539 Cu-Li Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020944 Sn-Mg Inorganic materials 0.000 description 1
- 229910020941 Sn-Mn Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018725 Sn—Al Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008953 Sn—Mn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92592607P | 2007-04-24 | 2007-04-24 | |
| US60/925,926 | 2007-04-24 | ||
| PCT/US2008/005418 WO2008134031A2 (en) | 2007-04-24 | 2008-04-24 | Thermally conductive and electrically resistive liquid crystalline polymer composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010525145A JP2010525145A (ja) | 2010-07-22 |
| JP2010525145A5 true JP2010525145A5 (enExample) | 2011-06-16 |
| JP5398700B2 JP5398700B2 (ja) | 2014-01-29 |
Family
ID=39885865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010506287A Expired - Fee Related JP5398700B2 (ja) | 2007-04-24 | 2008-04-24 | 熱伝導性および電気抵抗性液晶ポリマー組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8029694B2 (enExample) |
| EP (1) | EP2139944A2 (enExample) |
| JP (1) | JP5398700B2 (enExample) |
| CN (2) | CN101663351A (enExample) |
| WO (1) | WO2008134031A2 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP5229462B2 (ja) * | 2008-07-24 | 2013-07-03 | 三菱瓦斯化学株式会社 | 絶縁性高熱伝導率樹脂複合材料 |
| KR20120051713A (ko) * | 2009-07-24 | 2012-05-22 | 티코나 엘엘씨 | 열전도성 열가소성 수지 조성물 및 관련 용도 |
| JP5503915B2 (ja) * | 2009-07-30 | 2014-05-28 | 住友化学株式会社 | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
| KR20110012780A (ko) * | 2009-07-31 | 2011-02-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
| KR20130009981A (ko) * | 2010-02-25 | 2013-01-24 | 티코나 엘엘씨 | 열 전도성 및 치수 안정성 액정 중합체 조성물 |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| KR101773204B1 (ko) * | 2011-10-31 | 2017-09-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 대전방지 특성을 갖는 전방향족 액정 폴리에스테르 수지 컴파운드 및 물품 |
| CN103582921B (zh) * | 2012-06-05 | 2016-06-22 | 道康宁公司 | 用于电源转换器中的发粘软凝胶 |
| CN104736672B (zh) | 2012-10-16 | 2017-10-24 | 提克纳有限责任公司 | 抗静电液晶聚合物组合物 |
| WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
| WO2014088700A1 (en) * | 2012-12-05 | 2014-06-12 | Ticona Llc | Conductive liquid crystalline polymer composition |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| KR102155924B1 (ko) * | 2013-03-13 | 2020-09-14 | 티코나 엘엘씨 | 대전방지성 액정질 중합체 조성물 |
| WO2015095035A1 (en) * | 2013-12-20 | 2015-06-25 | Ticona Llc | Metal detectable liquid crystalline polymer composition |
| JP6349543B2 (ja) * | 2013-12-25 | 2018-07-04 | パナソニックＩｐマネジメント株式会社 | 冷却構造体および冷却構造体の製造方法 |
| US9822254B2 (en) | 2014-04-09 | 2017-11-21 | Ticona Llc | Camera module |
| KR102305241B1 (ko) | 2014-04-09 | 2021-09-24 | 티코나 엘엘씨 | 대전방지 중합체 조성물 |
| CN104388051A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机定型储热材料及其制备方法 |
| CN104449582A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机物储热材料及其制备方法 |
| CN104449583A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机储热材料及其制备方法 |
| CN104388052A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机相变储热材料及其制备方法 |
| CN104388054A (zh) * | 2014-11-04 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型复合有机储热材料及其制备方法 |
| CN107710335B (zh) * | 2015-05-01 | 2020-06-02 | 金溶进 | 导电聚合物、它们的制造方法、以及它们的应用 |
| US20190131207A1 (en) * | 2016-05-10 | 2019-05-02 | Republic Polytechnic | A heat sink, a filler for a heat sink and methods thereof |
| CN108192459B (zh) * | 2017-11-23 | 2019-12-31 | 中国科学院深圳先进技术研究院 | 导热复合材料及其制备方法和应用 |
| US10829634B2 (en) | 2017-12-05 | 2020-11-10 | Ticona Llc | Aromatic polymer composition for use in a camera module |
| US20200072564A1 (en) * | 2018-08-31 | 2020-03-05 | Sharp Kabushiki Kaisha | Thermal switch, method for manufacturing thermal switch, thermally conductive filler-containing composite material, apparatus containing the composite material, and display device |
| KR20200080017A (ko) * | 2018-12-26 | 2020-07-06 | 삼성전자주식회사 | 전지 케이스, 및 전지 |
| KR20220147110A (ko) | 2020-02-26 | 2022-11-02 | 티코나 엘엘씨 | 전자 디바이스를 위한 중합체 조성물 |
| WO2021173408A1 (en) | 2020-02-26 | 2021-09-02 | Ticona Llc | Electronic device |
| JP2023515975A (ja) | 2020-02-26 | 2023-04-17 | ティコナ・エルエルシー | 電子デバイス |
| CN115700014A (zh) | 2020-02-26 | 2023-02-03 | 提克纳有限责任公司 | 电路结构 |
| US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
| JP2024546075A (ja) | 2021-12-01 | 2024-12-17 | ティコナ・エルエルシー | アンテナモジュール |
| WO2024016312A1 (en) * | 2022-07-22 | 2024-01-25 | Ticona Llc | In-wheel motor |
| KR20250038792A (ko) * | 2022-07-22 | 2025-03-19 | 티코나 엘엘씨 | 배터리 어셈블리용 버스바 |
| CN116948499A (zh) * | 2023-07-31 | 2023-10-27 | 深圳市信维通信股份有限公司 | 复合导热膜的制备方法及复合导热膜 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109313A (ja) * | 1991-10-14 | 1993-04-30 | Toshiba Chem Corp | 導電性樹脂組成物およびその成形品 |
| ES2384165T3 (es) * | 2001-08-31 | 2012-07-02 | Cool Options, Inc. | Reflector de lámpara térmicamente conductor |
| DE10297231T5 (de) * | 2001-09-27 | 2004-10-28 | Nippon Kagaku Yakin Co. Ltd., Neyagawa | Harzzusammensetzung mit hoher thermischen Leitfähigkeit und Verfahren zu ihrer Herstellung |
| JP5340595B2 (ja) * | 2005-06-06 | 2013-11-13 | 日本科学冶金株式会社 | 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法 |
| JP2008075063A (ja) * | 2006-08-22 | 2008-04-03 | Sumitomo Chemical Co Ltd | 液晶性ポリマー成形体 |
-
2008
- 2008-04-23 US US12/148,906 patent/US8029694B2/en not_active Expired - Fee Related
- 2008-04-24 EP EP08743344A patent/EP2139944A2/en not_active Withdrawn
- 2008-04-24 CN CN200880013142A patent/CN101663351A/zh active Pending
- 2008-04-24 CN CN201310594246.1A patent/CN103756348A/zh active Pending
- 2008-04-24 WO PCT/US2008/005418 patent/WO2008134031A2/en not_active Ceased
- 2008-04-24 JP JP2010506287A patent/JP5398700B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5282593B2 (ja) | 熱電変換素子及びそれを用いた熱電変換モジュール | |
| JP5871081B2 (ja) | 接合体、パワーモジュール用基板、パワーモジュール、及び、接合体の製造方法 | |
| WO2008134031A3 (en) | Thermally conductive and electrically resistive liquid crystalline polymer composition | |
| JP2012043622A5 (enExample) | ||
| JP2011241412A5 (enExample) | ||
| JP2004533705A (ja) | 界面材料ならびにその製造法および使用 | |
| WO2015072428A1 (ja) | ヒートシンク | |
| JP2014525661A5 (enExample) | ||
| US20160082552A1 (en) | Zn based lead-free solder and semiconductor power module | |
| Suganuma et al. | Ultra heat-shock resistant die attachment for silicon carbide with pure zinc | |
| JP7651806B2 (ja) | チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 | |
| JP2004002967A5 (enExample) | ||
| JP2017150084A (ja) | アルミニウムからなる金属化基板の製造方法 | |
| CN1775459A (zh) | 含镓、铟和铈的无镉银钎料 | |
| CN106489198B (zh) | 具有Ag基底层的功率模块用基板及功率模块 | |
| CN103056551B (zh) | 一种含锡和铟的新型多组元无镉银钎料 | |
| CN102102157A (zh) | 多元复合铜合金电接触材料 | |
| CN103757460B (zh) | 具有时效硬化效应的电刷合金及用途 | |
| CN103122422A (zh) | Au基摩擦副配对材料 | |
| CN102637662B (zh) | 使用焊料合金的半导体装置 | |
| TW200426231A (en) | Oxygen-free copper alloy and method for its manufacture and use of copper alloy | |
| JP2011241411A5 (enExample) | ||
| JPS6365748B2 (enExample) | ||
| CN100362655C (zh) | 热界面材料以及包括铟和锌的组合物 | |
| CN101673602A (zh) | 电阻元件及其制造方法 |