CN101663351A - 导热绝缘液晶聚合物组合物 - Google Patents

导热绝缘液晶聚合物组合物 Download PDF

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Publication number
CN101663351A
CN101663351A CN200880013142A CN200880013142A CN101663351A CN 101663351 A CN101663351 A CN 101663351A CN 200880013142 A CN200880013142 A CN 200880013142A CN 200880013142 A CN200880013142 A CN 200880013142A CN 101663351 A CN101663351 A CN 101663351A
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CN
China
Prior art keywords
composition
alloy
tin
conductive filler
heat conductive
Prior art date
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Pending
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CN200880013142A
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English (en)
Chinese (zh)
Inventor
Y·萨加
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EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101663351A publication Critical patent/CN101663351A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200880013142A 2007-04-24 2008-04-24 导热绝缘液晶聚合物组合物 Pending CN101663351A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92592607P 2007-04-24 2007-04-24
US60/925,926 2007-04-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201310594246.1A Division CN103756348A (zh) 2007-04-24 2008-04-24 导热绝缘液晶聚合物组合物

Publications (1)

Publication Number Publication Date
CN101663351A true CN101663351A (zh) 2010-03-03

Family

ID=39885865

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310594246.1A Pending CN103756348A (zh) 2007-04-24 2008-04-24 导热绝缘液晶聚合物组合物
CN200880013142A Pending CN101663351A (zh) 2007-04-24 2008-04-24 导热绝缘液晶聚合物组合物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201310594246.1A Pending CN103756348A (zh) 2007-04-24 2008-04-24 导热绝缘液晶聚合物组合物

Country Status (5)

Country Link
US (1) US8029694B2 (enExample)
EP (1) EP2139944A2 (enExample)
JP (1) JP5398700B2 (enExample)
CN (2) CN103756348A (enExample)
WO (1) WO2008134031A2 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102482449A (zh) * 2009-07-24 2012-05-30 提克纳有限责任公司 导热性热塑性树脂组合物和相关应用
WO2013131330A1 (en) * 2012-06-05 2013-09-12 Dow Corning Corporation Soft tacky gel for use in power converters
CN105143401A (zh) * 2013-03-13 2015-12-09 提克纳有限责任公司 抗静电液晶聚合物组合物
CN107710335A (zh) * 2015-05-01 2018-02-16 金溶进 新一代导电聚合物、它们的制造方法、以及它们的应用，包括电线、胶带、和电缆、热表面点火器、电子器件、3d打印丝、和用于汽车和宇航船的轻质材料
CN108192459A (zh) * 2017-11-23 2018-06-22 中国科学院深圳先进技术研究院 导热复合材料及其制备方法和应用
CN110876251A (zh) * 2018-08-31 2020-03-10 夏普株式会社 热开关、热开关的制造方法、含热传导性填料的复合材料、含该复合材料的装置及显示设备
CN116948499A (zh) * 2023-07-31 2023-10-27 深圳市信维通信股份有限公司 复合导热膜的制备方法及复合导热膜

Families Citing this family (30)

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US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
JP5229462B2 (ja) * 2008-07-24 2013-07-03 三菱瓦斯化学株式会社 絶縁性高熱伝導率樹脂複合材料
JP5503915B2 (ja) * 2009-07-30 2014-05-28 住友化学株式会社 液晶ポリエステル組成物およびこれを用いた電子回路基板
KR20110012780A (ko) * 2009-07-31 2011-02-09 엘지디스플레이 주식회사 액정표시장치
CN102844406A (zh) * 2010-02-25 2012-12-26 提克纳有限责任公司 导热且尺寸稳定的液晶聚合物组合物
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
KR101773204B1 (ko) * 2011-10-31 2017-09-01 심천 워트 어드밴스드 머티리얼즈 주식회사 대전방지 특성을 갖는 전방향족 액정 폴리에스테르 수지 컴파운드 및 물품
WO2014062536A1 (en) 2012-10-16 2014-04-24 Ticona Llc Antistatic liquid crystalline polymer composition
WO2014065910A1 (en) * 2012-10-26 2014-05-01 Laird Technologies, Inc. Thermally conductive polymer composites containing magnesium silicate and boron nitride
WO2014088700A1 (en) * 2012-12-05 2014-06-12 Ticona Llc Conductive liquid crystalline polymer composition
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
WO2015095035A1 (en) * 2013-12-20 2015-06-25 Ticona Llc Metal detectable liquid crystalline polymer composition
JP6349543B2 (ja) * 2013-12-25 2018-07-04 パナソニックＩｐマネジメント株式会社 冷却構造体および冷却構造体の製造方法
CN106164153A (zh) 2014-04-09 2016-11-23 提克纳有限责任公司 抗静电聚合物组合物
CN106164172B (zh) 2014-04-09 2019-07-26 提克纳有限责任公司 摄像模组
CN104449582A (zh) * 2014-11-03 2015-03-25 镇江新梦溪能源科技有限公司 一种新型有机物储热材料及其制备方法
CN104449583A (zh) * 2014-11-03 2015-03-25 镇江新梦溪能源科技有限公司 一种新型有机储热材料及其制备方法
CN104388052A (zh) * 2014-11-03 2015-03-04 镇江新梦溪能源科技有限公司 一种新型有机相变储热材料及其制备方法
CN104388051A (zh) * 2014-11-03 2015-03-04 镇江新梦溪能源科技有限公司 一种新型有机定型储热材料及其制备方法
CN104388054A (zh) * 2014-11-04 2015-03-04 镇江新梦溪能源科技有限公司 一种新型复合有机储热材料及其制备方法
US20190131207A1 (en) * 2016-05-10 2019-05-02 Republic Polytechnic A heat sink, a filler for a heat sink and methods thereof
JP7372915B2 (ja) 2017-12-05 2023-11-01 ティコナ・エルエルシー カメラモジュールにおいて使用するための芳香族ポリマー組成物
KR20200080017A (ko) * 2018-12-26 2020-07-06 삼성전자주식회사 전지 케이스, 및 전지
KR20220147110A (ko) 2020-02-26 2022-11-02 티코나 엘엘씨 전자 디바이스를 위한 중합체 조성물
WO2021173412A1 (en) 2020-02-26 2021-09-02 Ticona Llc Circuit structure
CN115151607A (zh) 2020-02-26 2022-10-04 提克纳有限责任公司 电子器件
US11728065B2 (en) 2020-07-28 2023-08-15 Ticona Llc Molded interconnect device
EP4441848A4 (en) 2021-12-01 2025-10-22 Ticona Llc ANTENNA MODULE
WO2024016312A1 (en) * 2022-07-22 2024-01-25 Ticona Llc In-wheel motor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109313A (ja) * 1991-10-14 1993-04-30 Toshiba Chem Corp 導電性樹脂組成物およびその成形品
PT1421595E (pt) * 2001-08-31 2012-05-25 Cool Options Inc Reflector de lâmpada termocondutor
CN1308399C (zh) * 2001-09-27 2007-04-04 日本科学冶金株式会社 高导热性树脂组合物及其制备方法
WO2006132185A1 (ja) * 2005-06-06 2006-12-14 Nippon Kagaku Yakin Co., Ltd. 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法
JP2008075063A (ja) * 2006-08-22 2008-04-03 Sumitomo Chemical Co Ltd 液晶性ポリマー成形体

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102482449A (zh) * 2009-07-24 2012-05-30 提克纳有限责任公司 导热性热塑性树脂组合物和相关应用
WO2013131330A1 (en) * 2012-06-05 2013-09-12 Dow Corning Corporation Soft tacky gel for use in power converters
CN105143401A (zh) * 2013-03-13 2015-12-09 提克纳有限责任公司 抗静电液晶聚合物组合物
CN105143402A (zh) * 2013-03-13 2015-12-09 提克纳有限责任公司 紧凑型摄像模组
CN105143403A (zh) * 2013-03-13 2015-12-09 提克纳有限责任公司 液晶聚合物组合物
CN111732821A (zh) * 2013-03-13 2020-10-02 提克纳有限责任公司 抗静电液晶聚合物组合物
CN107710335A (zh) * 2015-05-01 2018-02-16 金溶进 新一代导电聚合物、它们的制造方法、以及它们的应用，包括电线、胶带、和电缆、热表面点火器、电子器件、3d打印丝、和用于汽车和宇航船的轻质材料
CN107710335B (zh) * 2015-05-01 2020-06-02 金溶进 导电聚合物、它们的制造方法、以及它们的应用
CN108192459A (zh) * 2017-11-23 2018-06-22 中国科学院深圳先进技术研究院 导热复合材料及其制备方法和应用
CN108192459B (zh) * 2017-11-23 2019-12-31 中国科学院深圳先进技术研究院 导热复合材料及其制备方法和应用
CN110876251A (zh) * 2018-08-31 2020-03-10 夏普株式会社 热开关、热开关的制造方法、含热传导性填料的复合材料、含该复合材料的装置及显示设备
CN116948499A (zh) * 2023-07-31 2023-10-27 深圳市信维通信股份有限公司 复合导热膜的制备方法及复合导热膜

Also Published As

Publication number Publication date
US20080265202A1 (en) 2008-10-30
WO2008134031A2 (en) 2008-11-06
CN103756348A (zh) 2014-04-30
WO2008134031A3 (en) 2009-01-22
US8029694B2 (en) 2011-10-04
EP2139944A2 (en) 2010-01-06
JP2010525145A (ja) 2010-07-22
JP5398700B2 (ja) 2014-01-29

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Application publication date: 20100303