JP5398700B2 - 熱伝導性および電気抵抗性液晶ポリマー組成物 - Google Patents
熱伝導性および電気抵抗性液晶ポリマー組成物 Download PDFInfo
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- JP5398700B2 JP5398700B2 JP2010506287A JP2010506287A JP5398700B2 JP 5398700 B2 JP5398700 B2 JP 5398700B2 JP 2010506287 A JP2010506287 A JP 2010506287A JP 2010506287 A JP2010506287 A JP 2010506287A JP 5398700 B2 JP5398700 B2 JP 5398700B2
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- liquid crystal
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- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92592607P | 2007-04-24 | 2007-04-24 | |
| US60/925,926 | 2007-04-24 | ||
| PCT/US2008/005418 WO2008134031A2 (en) | 2007-04-24 | 2008-04-24 | Thermally conductive and electrically resistive liquid crystalline polymer composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010525145A JP2010525145A (ja) | 2010-07-22 |
| JP2010525145A5 JP2010525145A5 (enExample) | 2011-06-16 |
| JP5398700B2 true JP5398700B2 (ja) | 2014-01-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| JP2010506287A Expired - Fee Related JP5398700B2 (ja) | 2007-04-24 | 2008-04-24 | 熱伝導性および電気抵抗性液晶ポリマー組成物 |
Country Status (5)
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| US (1) | US8029694B2 (enExample) |
| EP (1) | EP2139944A2 (enExample) |
| JP (1) | JP5398700B2 (enExample) |
| CN (2) | CN101663351A (enExample) |
| WO (1) | WO2008134031A2 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP5229462B2 (ja) * | 2008-07-24 | 2013-07-03 | 三菱瓦斯化学株式会社 | 絶縁性高熱伝導率樹脂複合材料 |
| EP2456814A1 (en) * | 2009-07-24 | 2012-05-30 | Ticona LLC | Thermally conductive thermoplastic resin compositions and related applications |
| JP5503915B2 (ja) * | 2009-07-30 | 2014-05-28 | 住友化学株式会社 | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
| KR20110012780A (ko) * | 2009-07-31 | 2011-02-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
| SG183459A1 (en) * | 2010-02-25 | 2012-09-27 | Ticona Llc | Thermally conductive and dimensionally stable liquid crystalline polymer composition |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| KR101773204B1 (ko) * | 2011-10-31 | 2017-09-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 대전방지 특성을 갖는 전방향족 액정 폴리에스테르 수지 컴파운드 및 물품 |
| EP2673786B1 (en) * | 2012-06-05 | 2015-08-19 | Dow Corning Corporation | Soft tacky gel for use in power converters |
| US9284435B2 (en) | 2012-10-16 | 2016-03-15 | Ticona Llc | Antistatic liquid crystalline polymer composition |
| WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
| WO2014088700A1 (en) * | 2012-12-05 | 2014-06-12 | Ticona Llc | Conductive liquid crystalline polymer composition |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| CN111732821A (zh) | 2013-03-13 | 2020-10-02 | 提克纳有限责任公司 | 抗静电液晶聚合物组合物 |
| WO2015095035A1 (en) * | 2013-12-20 | 2015-06-25 | Ticona Llc | Metal detectable liquid crystalline polymer composition |
| JP6349543B2 (ja) * | 2013-12-25 | 2018-07-04 | パナソニックＩｐマネジメント株式会社 | 冷却構造体および冷却構造体の製造方法 |
| CN106164172B (zh) | 2014-04-09 | 2019-07-26 | 提克纳有限责任公司 | 摄像模组 |
| KR102305241B1 (ko) | 2014-04-09 | 2021-09-24 | 티코나 엘엘씨 | 대전방지 중합체 조성물 |
| CN104388052A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机相变储热材料及其制备方法 |
| CN104388051A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机定型储热材料及其制备方法 |
| CN104449583A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机储热材料及其制备方法 |
| CN104449582A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机物储热材料及其制备方法 |
| CN104388054A (zh) * | 2014-11-04 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型复合有机储热材料及其制备方法 |
| WO2016178943A1 (en) * | 2015-05-01 | 2016-11-10 | Kim Yong-Jihn | New generation conductive polymers, manufacturing method thereof, and their applications including electric wires, tapes, and cables, hot surface igniters, electronics devices, 3d printing filaments, and lightweight materials for automobile and aerospace ship |
| WO2017196259A1 (en) * | 2016-05-10 | 2017-11-16 | Republic Polytechnic | A heat sink, a filler for a heat sink and methods thereof |
| CN108192459B (zh) * | 2017-11-23 | 2019-12-31 | 中国科学院深圳先进技术研究院 | 导热复合材料及其制备方法和应用 |
| KR102627886B1 (ko) | 2017-12-05 | 2024-01-19 | 티코나 엘엘씨 | 카메라 모듈에 사용하기 위한 방향족 중합체 조성물 |
| US20200072564A1 (en) * | 2018-08-31 | 2020-03-05 | Sharp Kabushiki Kaisha | Thermal switch, method for manufacturing thermal switch, thermally conductive filler-containing composite material, apparatus containing the composite material, and display device |
| KR20200080017A (ko) * | 2018-12-26 | 2020-07-06 | 삼성전자주식회사 | 전지 케이스, 및 전지 |
| EP4110610A4 (en) | 2020-02-26 | 2024-03-27 | Ticona LLC | POLYMER COMPOSITION FOR ELECTRONIC DEVICE |
| JP7737387B2 (ja) | 2020-02-26 | 2025-09-10 | ティコナ・エルエルシー | 回路構造体 |
| KR20220146567A (ko) | 2020-02-26 | 2022-11-01 | 티코나 엘엘씨 | 전자 디바이스 |
| US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
| CN118613966A (zh) | 2021-12-01 | 2024-09-06 | 提克纳有限责任公司 | 天线模块 |
| WO2024016312A1 (en) * | 2022-07-22 | 2024-01-25 | Ticona Llc | In-wheel motor |
| CN116948499A (zh) * | 2023-07-31 | 2023-10-27 | 深圳市信维通信股份有限公司 | 复合导热膜的制备方法及复合导热膜 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05109313A (ja) * | 1991-10-14 | 1993-04-30 | Toshiba Chem Corp | 導電性樹脂組成物およびその成形品 |
| AU2002323471B2 (en) * | 2001-08-31 | 2005-01-06 | Ticona Polymers, Inc. | Thermally conductive lamp reflector |
| CN1308399C (zh) * | 2001-09-27 | 2007-04-04 | 日本科学冶金株式会社 | 高导热性树脂组合物及其制备方法 |
| JP5340595B2 (ja) * | 2005-06-06 | 2013-11-13 | 日本科学冶金株式会社 | 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法 |
| JP2008075063A (ja) * | 2006-08-22 | 2008-04-03 | Sumitomo Chemical Co Ltd | 液晶性ポリマー成形体 |
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2008
- 2008-04-23 US US12/148,906 patent/US8029694B2/en not_active Expired - Fee Related
- 2008-04-24 WO PCT/US2008/005418 patent/WO2008134031A2/en not_active Ceased
- 2008-04-24 CN CN200880013142A patent/CN101663351A/zh active Pending
- 2008-04-24 EP EP08743344A patent/EP2139944A2/en not_active Withdrawn
- 2008-04-24 JP JP2010506287A patent/JP5398700B2/ja not_active Expired - Fee Related
- 2008-04-24 CN CN201310594246.1A patent/CN103756348A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP2139944A2 (en) | 2010-01-06 |
| CN103756348A (zh) | 2014-04-30 |
| JP2010525145A (ja) | 2010-07-22 |
| US8029694B2 (en) | 2011-10-04 |
| WO2008134031A2 (en) | 2008-11-06 |
| WO2008134031A3 (en) | 2009-01-22 |
| CN101663351A (zh) | 2010-03-03 |
| US20080265202A1 (en) | 2008-10-30 |
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