JP2011241411A5 - - Google Patents
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- Publication number
- JP2011241411A5 JP2011241411A5 JP2010112265A JP2010112265A JP2011241411A5 JP 2011241411 A5 JP2011241411 A5 JP 2011241411A5 JP 2010112265 A JP2010112265 A JP 2010112265A JP 2010112265 A JP2010112265 A JP 2010112265A JP 2011241411 A5 JP2011241411 A5 JP 2011241411A5
- Authority
- JP
- Japan
- Prior art keywords
- atomic
- copper alloy
- range
- copper
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000010949 copper Substances 0.000 claims description 16
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 6
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 6
- 229910000765 intermetallic Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010112265A JP5045782B2 (ja) | 2010-05-14 | 2010-05-14 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
| MYPI2012700829A MY168183A (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| KR1020137031600A KR101570919B1 (ko) | 2010-05-14 | 2011-05-13 | 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재 |
| EP15193144.1A EP3020836A3 (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing it, and rolled copper alloy for electronic device |
| SG2012078978A SG185024A1 (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| EP15175001.5A EP2952595B1 (en) | 2010-05-14 | 2011-05-13 | Copper alloy and material rolled thereof for electronic device and method for producing this alloy |
| PCT/JP2011/061036 WO2011142450A1 (ja) | 2010-05-14 | 2011-05-13 | 電子機器用銅合金、電子機器用銅合金の製造方法、及び電子機器用銅合金圧延材 |
| MYPI2014002778A MY189251A (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| PH1/2012/502195A PH12012502195A1 (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US13/695,666 US10056165B2 (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| TW100116878A TWI441931B (zh) | 2010-05-14 | 2011-05-13 | 電子機器用銅合金、電子機器用銅合金之製造方法、及電子機器用銅合金滾壓材 |
| EP15193147.4A EP3009523B1 (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing it, and rolled material from it |
| CN201180018491.7A CN102822363B (zh) | 2010-05-14 | 2011-05-13 | 电子器件用铜合金及其制造方法及电子器件用铜合金轧材 |
| KR1020127025942A KR101369693B1 (ko) | 2010-05-14 | 2011-05-13 | 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재 |
| EP11780706.5A EP2570506B1 (en) | 2010-05-14 | 2011-05-13 | Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device |
| US14/291,335 US10032536B2 (en) | 2010-05-14 | 2014-05-30 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010112265A JP5045782B2 (ja) | 2010-05-14 | 2010-05-14 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011241411A JP2011241411A (ja) | 2011-12-01 |
| JP2011241411A5 true JP2011241411A5 (enExample) | 2012-02-09 |
| JP5045782B2 JP5045782B2 (ja) | 2012-10-10 |
Family
ID=45408381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010112265A Active JP5045782B2 (ja) | 2010-05-14 | 2010-05-14 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5045782B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6248387B2 (ja) * | 2012-12-05 | 2017-12-20 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用部品及び端子 |
| JP6248386B2 (ja) * | 2012-12-05 | 2017-12-20 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用部品及び端子 |
| JP6248388B2 (ja) * | 2012-12-05 | 2017-12-20 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用部品及び端子 |
| JP6248389B2 (ja) * | 2012-12-05 | 2017-12-20 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用部品及び端子 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53125222A (en) * | 1977-04-07 | 1978-11-01 | Furukawa Electric Co Ltd:The | High tensile electroconductive copper alloy |
| JP3904118B2 (ja) * | 1997-02-05 | 2007-04-11 | 株式会社神戸製鋼所 | 電気、電子部品用銅合金とその製造方法 |
| JPH11199954A (ja) * | 1998-01-20 | 1999-07-27 | Kobe Steel Ltd | 電気・電子部品用銅合金 |
-
2010
- 2010-05-14 JP JP2010112265A patent/JP5045782B2/ja active Active
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