MX2018011658A - Aleacion de cobre para equipos electronicos y electricos, tira de placa de aleacion de cobre para equipos electronicos y electricos, componente para equipos electronicos y electricos, terminales, barras colectoras y piezas moviles para relevador. - Google Patents

Aleacion de cobre para equipos electronicos y electricos, tira de placa de aleacion de cobre para equipos electronicos y electricos, componente para equipos electronicos y electricos, terminales, barras colectoras y piezas moviles para relevador.

Info

Publication number
MX2018011658A
MX2018011658A MX2018011658A MX2018011658A MX2018011658A MX 2018011658 A MX2018011658 A MX 2018011658A MX 2018011658 A MX2018011658 A MX 2018011658A MX 2018011658 A MX2018011658 A MX 2018011658A MX 2018011658 A MX2018011658 A MX 2018011658A
Authority
MX
Mexico
Prior art keywords
electronic
electrical equipment
copper alloy
busbar
relays
Prior art date
Application number
MX2018011658A
Other languages
English (en)
Inventor
Maki Kazunari
Matsunaga Hirotaka
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority claimed from PCT/JP2017/012914 external-priority patent/WO2017170699A1/ja
Publication of MX2018011658A publication Critical patent/MX2018011658A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/56—Contact spring sets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La presente invención se caracteriza por: incluir al menos 0.15 % en masa y menos de 0.35 % en masa de Mg y al menos 0.0005 % en masa y menos de 0.01 % en masa de P siendo el resto Cu y las impurezas inevitables; la conductividad siendo mayor a 75% IACS, y el número promedio de compuestos que contienen Mg y P con un diámetro de partícula de al menos 0.1 µm, cuando se observa mediante un microscopio electrónico de barrido, siendo no más de 0.5 /µm2.
MX2018011658A 2016-03-30 2017-03-29 Aleacion de cobre para equipos electronicos y electricos, tira de placa de aleacion de cobre para equipos electronicos y electricos, componente para equipos electronicos y electricos, terminales, barras colectoras y piezas moviles para relevador. MX2018011658A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016069080 2016-03-30
JP2017063418A JP6226098B2 (ja) 2016-03-30 2017-03-28 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
PCT/JP2017/012914 WO2017170699A1 (ja) 2016-03-30 2017-03-29 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片

Publications (1)

Publication Number Publication Date
MX2018011658A true MX2018011658A (es) 2018-12-19

Family

ID=60043970

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018011658A MX2018011658A (es) 2016-03-30 2017-03-29 Aleacion de cobre para equipos electronicos y electricos, tira de placa de aleacion de cobre para equipos electronicos y electricos, componente para equipos electronicos y electricos, terminales, barras colectoras y piezas moviles para relevador.

Country Status (6)

Country Link
EP (1) EP3438298B1 (es)
JP (1) JP6226098B2 (es)
KR (1) KR102296652B1 (es)
CN (1) CN108431257B (es)
MX (1) MX2018011658A (es)
TW (1) TWI703225B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11203806B2 (en) 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
WO2017170733A1 (ja) 2016-03-30 2017-10-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7180101B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
MX2020009869A (es) * 2018-03-30 2020-10-12 Mitsubishi Materials Corp Aleacion de cobre para dispositivo electronico/electrico, material en lamina/tira de aleacion de cobre para dispositivo electronico/electrico, componente para dispositivo electronico/electrico, terminal, y barra colectora.
JP7180102B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
WO2020137726A1 (ja) 2018-12-26 2020-07-02 三菱伸銅株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
CN110172609A (zh) * 2019-05-16 2019-08-27 红河学院 一种高强度高导电率铜镁系合金及其制备方法
JP7443737B2 (ja) 2019-12-10 2024-03-06 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法

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US3778318A (en) * 1969-02-24 1973-12-11 Cooper Range Co Copper base composition
JPS5045783Y2 (es) 1971-08-06 1975-12-25
JPS58199835A (ja) * 1982-05-19 1983-11-21 Sumitomo Electric Ind Ltd 電気又は電子機器用銅合金
JP2661462B2 (ja) * 1992-05-01 1997-10-08 三菱伸銅株式会社 繰り返し曲げ性にすぐれた直経：０．１ｍｍ以下のＣｕ合金極細線
JP4333881B2 (ja) * 2003-09-24 2009-09-16 株式会社マテリアルソルーション 連続鋳造鋳型及び銅合金の連続鋳造方法
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP5848169B2 (ja) * 2012-03-14 2016-01-27 Ｄｏｗａメタルテック株式会社 銀めっき材
EP2835433B1 (en) * 2012-04-04 2018-08-08 Mitsubishi Shindoh Co., Ltd. Cu-mg-p-based copper alloy plate having excellent fatigue resistance, and method for manufacturing same
JP5908796B2 (ja) * 2012-06-05 2016-04-26 三菱伸銅株式会社 機械的な成形性に優れたＣｕ−Ｍｇ−Ｐ系銅合金板及びその製造方法
JP6054085B2 (ja) * 2012-07-24 2016-12-27 三菱伸銅株式会社 曲げ加工後のばね限界値特性及び耐疲労特性に優れたＣｕ−Ｍｇ−Ｐ系銅合金板及びその製造方法
JP6055242B2 (ja) * 2012-08-30 2016-12-27 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金Ｓｎめっき板及びその製造方法
JP6076724B2 (ja) 2012-12-06 2017-02-08 古河電気工業株式会社 銅合金材料およびその製造方法
JP5962707B2 (ja) * 2013-07-31 2016-08-03 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子
JP6140032B2 (ja) * 2013-08-30 2017-05-31 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法並びに通電部品
JP5847787B2 (ja) * 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP6187629B1 (ja) * 2016-03-30 2017-08-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー

Also Published As

Publication number Publication date
JP6226098B2 (ja) 2017-11-08
JP2017186664A (ja) 2017-10-12
CN108431257B (zh) 2020-07-28
TWI703225B (zh) 2020-09-01
KR20180125449A (ko) 2018-11-23
EP3438298B1 (en) 2021-03-17
EP3438298A1 (en) 2019-02-06
TW201738394A (zh) 2017-11-01
KR102296652B1 (ko) 2021-08-31
CN108431257A (zh) 2018-08-21
EP3438298A4 (en) 2019-12-11

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