JP5045782B2 - 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 - Google Patents

電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Download PDF

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Publication number
JP5045782B2
JP5045782B2 JP2010112265A JP2010112265A JP5045782B2 JP 5045782 B2 JP5045782 B2 JP 5045782B2 JP 2010112265 A JP2010112265 A JP 2010112265A JP 2010112265 A JP2010112265 A JP 2010112265A JP 5045782 B2 JP5045782 B2 JP 5045782B2
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Japan
Prior art keywords
atomic
copper alloy
electronic equipment
range
alloy
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JP2010112265A
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English (en)
Japanese (ja)
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JP2011241411A (ja
JP2011241411A5 (enExample
Inventor
優樹 伊藤
一誠 牧
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2010112265A priority Critical patent/JP5045782B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to PH1/2012/502195A priority patent/PH12012502195A1/en
Priority to EP15193147.4A priority patent/EP3009523B1/en
Priority to KR1020137031600A priority patent/KR101570919B1/ko
Priority to EP15193144.1A priority patent/EP3020836A3/en
Priority to SG2012078978A priority patent/SG185024A1/en
Priority to EP15175001.5A priority patent/EP2952595B1/en
Priority to PCT/JP2011/061036 priority patent/WO2011142450A1/ja
Priority to MYPI2014002778A priority patent/MY189251A/en
Priority to EP11780706.5A priority patent/EP2570506B1/en
Priority to US13/695,666 priority patent/US10056165B2/en
Priority to TW100116878A priority patent/TWI441931B/zh
Priority to MYPI2012700829A priority patent/MY168183A/en
Priority to CN201180018491.7A priority patent/CN102822363B/zh
Priority to KR1020127025942A priority patent/KR101369693B1/ko
Publication of JP2011241411A publication Critical patent/JP2011241411A/ja
Publication of JP2011241411A5 publication Critical patent/JP2011241411A5/ja
Application granted granted Critical
Publication of JP5045782B2 publication Critical patent/JP5045782B2/ja
Priority to US14/291,335 priority patent/US10032536B2/en
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JP2010112265A 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Active JP5045782B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2010112265A JP5045782B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
MYPI2012700829A MY168183A (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
KR1020137031600A KR101570919B1 (ko) 2010-05-14 2011-05-13 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
EP15193144.1A EP3020836A3 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing it, and rolled copper alloy for electronic device
SG2012078978A SG185024A1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
EP15175001.5A EP2952595B1 (en) 2010-05-14 2011-05-13 Copper alloy and material rolled thereof for electronic device and method for producing this alloy
PCT/JP2011/061036 WO2011142450A1 (ja) 2010-05-14 2011-05-13 電子機器用銅合金、電子機器用銅合金の製造方法、及び電子機器用銅合金圧延材
MYPI2014002778A MY189251A (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
PH1/2012/502195A PH12012502195A1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US13/695,666 US10056165B2 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
TW100116878A TWI441931B (zh) 2010-05-14 2011-05-13 電子機器用銅合金、電子機器用銅合金之製造方法、及電子機器用銅合金滾壓材
EP15193147.4A EP3009523B1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing it, and rolled material from it
CN201180018491.7A CN102822363B (zh) 2010-05-14 2011-05-13 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
KR1020127025942A KR101369693B1 (ko) 2010-05-14 2011-05-13 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
EP11780706.5A EP2570506B1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device
US14/291,335 US10032536B2 (en) 2010-05-14 2014-05-30 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010112265A JP5045782B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Publications (3)

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JP2011241411A JP2011241411A (ja) 2011-12-01
JP2011241411A5 JP2011241411A5 (enExample) 2012-02-09
JP5045782B2 true JP5045782B2 (ja) 2012-10-10

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JP2010112265A Active JP5045782B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

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JP (1) JP5045782B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6248387B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248386B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248388B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248389B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53125222A (en) * 1977-04-07 1978-11-01 Furukawa Electric Co Ltd:The High tensile electroconductive copper alloy
JP3904118B2 (ja) * 1997-02-05 2007-04-11 株式会社神戸製鋼所 電気、電子部品用銅合金とその製造方法
JPH11199954A (ja) * 1998-01-20 1999-07-27 Kobe Steel Ltd 電気・電子部品用銅合金

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