JP2005097550A5 - - Google Patents
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- Publication number
- JP2005097550A5 JP2005097550A5 JP2004222010A JP2004222010A JP2005097550A5 JP 2005097550 A5 JP2005097550 A5 JP 2005097550A5 JP 2004222010 A JP2004222010 A JP 2004222010A JP 2004222010 A JP2004222010 A JP 2004222010A JP 2005097550 A5 JP2005097550 A5 JP 2005097550A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- range
- silver
- volume
- carboxyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 7
- 229910052709 silver Inorganic materials 0.000 claims 7
- 239000004332 silver Substances 0.000 claims 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 229920000459 Nitrile rubber Polymers 0.000 claims 3
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229920001774 Perfluoroether Polymers 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- IRLQAJPIHBZROB-UHFFFAOYSA-N buta-2,3-dienenitrile Chemical compound C=C=CC#N IRLQAJPIHBZROB-UHFFFAOYSA-N 0.000 claims 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- UJMWVICAENGCRF-UHFFFAOYSA-N oxygen difluoride Chemical compound FOF UJMWVICAENGCRF-UHFFFAOYSA-N 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 239000006229 carbon black Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000009474 hot melt extrusion Methods 0.000 claims 1
- 235000012245 magnesium oxide Nutrition 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical class [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 239000011146 organic particle Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000012744 reinforcing agent Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 150000004756 silanes Chemical class 0.000 claims 1
- 230000009974 thixotropic effect Effects 0.000 claims 1
- -1 thixotropics Substances 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/632,330 US6874573B2 (en) | 2003-07-31 | 2003-07-31 | Thermal interface material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005097550A JP2005097550A (ja) | 2005-04-14 |
| JP2005097550A5 true JP2005097550A5 (enExample) | 2007-09-13 |
Family
ID=33541542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004222010A Pending JP2005097550A (ja) | 2003-07-31 | 2004-07-29 | サーマルインターフェース材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6874573B2 (enExample) |
| EP (1) | EP1503413A3 (enExample) |
| JP (1) | JP2005097550A (enExample) |
| KR (1) | KR20050014749A (enExample) |
| CN (1) | CN100506943C (enExample) |
| TW (1) | TW200523348A (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10327452A1 (de) * | 2003-06-18 | 2005-01-05 | Bayer Materialscience Ag | Klebstoffe |
| US20060070720A1 (en) * | 2004-09-17 | 2006-04-06 | Capp Joseph P | Heat riser |
| TW200634140A (en) * | 2005-03-21 | 2006-10-01 | Mitac Technology Corp | Heat conduction interface structure and manufacturing process method thereof |
| CN1978582A (zh) * | 2005-12-09 | 2007-06-13 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
| US20070179232A1 (en) * | 2006-01-30 | 2007-08-02 | National Starch And Chemical Investment Holding Corporation | Thermal Interface Material |
| DE102006026075A1 (de) * | 2006-06-03 | 2007-12-06 | Hydac System Gmbh | Wärmeaustauschvorrichtung |
| US20090051026A1 (en) * | 2007-08-20 | 2009-02-26 | International Business Machines Corporation | Process for forming metal film and release layer on polymer |
| US9795059B2 (en) * | 2007-11-05 | 2017-10-17 | Laird Technologies, Inc. | Thermal interface materials with thin film or metallization |
| US8735487B2 (en) * | 2008-07-03 | 2014-05-27 | Bridgestone Corporation | Tire components with improved heat transfer |
| JP5323432B2 (ja) * | 2008-09-24 | 2013-10-23 | 古河電気工業株式会社 | 熱伝導用成形体 |
| WO2010104542A1 (en) | 2009-03-02 | 2010-09-16 | Honeywell International Inc. | Thermal interface material and method of making and using the same |
| US20110265979A1 (en) * | 2010-04-30 | 2011-11-03 | Sihai Chen | Thermal interface materials with good reliability |
| US20120080639A1 (en) * | 2010-10-04 | 2012-04-05 | Laird Technologies, Inc. | Potato shaped graphite filler, thermal interface materials and emi shielding |
| CN102250425A (zh) * | 2011-05-24 | 2011-11-23 | 深圳市博恩实业有限公司 | 多功能导热复合材料 |
| EP3077578A4 (en) | 2013-12-05 | 2017-07-26 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
| JP5563175B1 (ja) * | 2014-03-05 | 2014-07-30 | 清二 加川 | 高熱伝導率の放熱シート及びその製造方法 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| DE102014016167A1 (de) * | 2014-11-04 | 2016-05-04 | Mann + Hummel Gmbh | Filterelement und Verfahren zum Herstellen desselben |
| CN112080258A (zh) | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10371620B2 (en) * | 2016-05-20 | 2019-08-06 | Particle Measuring Systems, Inc. | Automatic power control liquid particle counter with flow and bubble detection systems |
| CN105820388A (zh) * | 2016-05-30 | 2016-08-03 | 安徽省含山县锦华氧化锌厂 | 一种导电丁腈橡胶及其制备方法 |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| JP6370858B2 (ja) * | 2016-10-26 | 2018-08-08 | 株式会社塩原製作所 | 加熱装置と被加熱物間への介在用熱伝導ペースト及び該熱伝導ペーストを用いた熱伝導方法 |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| KR102807539B1 (ko) * | 2020-02-25 | 2025-05-13 | 현대자동차주식회사 | 양면 냉각형 파워모듈 |
| CN114561102A (zh) * | 2022-03-22 | 2022-05-31 | 深圳先进电子材料国际创新研究院 | 一种高导热自修复热界面材料及其制备方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972821A (en) * | 1973-04-30 | 1976-08-03 | Amchem Products, Inc. | Heat transfer composition and method of making |
| JPS58117234A (ja) * | 1982-01-05 | 1983-07-12 | Meidensha Electric Mfg Co Ltd | 熱伝導性材料 |
| US4576845A (en) | 1983-12-15 | 1986-03-18 | Krc Inc. | Thermally conductive base layers for cast polyurethane roll covers |
| US5137959A (en) | 1991-05-24 | 1992-08-11 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer containing alumina platelets |
| US6319599B1 (en) * | 1992-07-14 | 2001-11-20 | Theresa M. Buckley | Phase change thermal control materials, method and apparatus |
| JP3439246B2 (ja) | 1993-11-22 | 2003-08-25 | 株式会社共和 | 絶縁性と制振性と熱伝導性を有するゴムおよび／またはプラスチック成型物 |
| US5591034A (en) | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
| US5545473A (en) | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
| US5712039A (en) * | 1995-04-11 | 1998-01-27 | Minnesota Mining And Manufacturing Company | Epoxy adhesives with dithiooxamide adhesion promoters |
| JPH0925393A (ja) * | 1995-05-09 | 1997-01-28 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| US6090484A (en) | 1995-05-19 | 2000-07-18 | The Bergquist Company | Thermally conductive filled polymer composites for mounting electronic devices and method of application |
| US5904978A (en) | 1995-12-15 | 1999-05-18 | W. L. Gore & Associates, Inc. | Electrically conductive polytetrafluoroethylene article |
| TW392179B (en) * | 1996-02-08 | 2000-06-01 | Asahi Chemical Ind | Anisotropic conductive composition |
| US6054198A (en) | 1996-04-29 | 2000-04-25 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
| JP3668555B2 (ja) | 1996-06-05 | 2005-07-06 | 住友ゴム工業株式会社 | 導電性ゴム組成物 |
| US5738936A (en) | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
| US6210789B1 (en) | 1997-02-20 | 2001-04-03 | W. L. Gore & Associates, Inc. | Electrically conductive composite article |
| JPH10242354A (ja) * | 1997-02-24 | 1998-09-11 | Matsushita Electric Ind Co Ltd | 熱伝導部材およびそれを用いた電子装置 |
| US5783465A (en) * | 1997-04-03 | 1998-07-21 | Lucent Technologies Inc. | Compliant bump technology |
| US5807910A (en) * | 1997-06-23 | 1998-09-15 | Industrial Technology Research Institute | Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| JPH1131767A (ja) * | 1997-07-10 | 1999-02-02 | Toyota Motor Corp | 変形可能な伝熱体 |
| US5945217A (en) | 1997-10-14 | 1999-08-31 | Gore Enterprise Holdings, Inc. | Thermally conductive polytrafluoroethylene article |
| US6090491A (en) | 1998-02-27 | 2000-07-18 | Eastman Kodak Company | Fuser member with styrl-treated Al2 O3 filler and functionalized release fluids |
| US6255581B1 (en) | 1998-03-31 | 2001-07-03 | Gore Enterprise Holdings, Inc. | Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| US6203873B1 (en) | 1998-05-22 | 2001-03-20 | Dayco Products, Inc. | Blends of fluoroelastomer interpolymers with thermo fluoroplastic interpolymers and the use of such blends in hoses |
| JP2992285B1 (ja) * | 1998-11-10 | 1999-12-20 | 北川工業株式会社 | 熱伝導材 |
| JP2000174184A (ja) * | 1998-12-08 | 2000-06-23 | Sekisui Chem Co Ltd | 熱伝導性シート及び熱伝導性部品 |
| EP1198005A4 (en) * | 1999-03-26 | 2004-11-24 | Hitachi Ltd | SEMICONDUCTOR MODULE AND ITS ASSEMBLY |
| JP3510834B2 (ja) | 2000-01-28 | 2004-03-29 | 株式会社巴川製紙所 | 導電性接着剤組成物、導電性接着剤シート、電磁波シールド材料及びそれを使用したフレキシブルプリント基板 |
| JP3068613B1 (ja) * | 1999-06-28 | 2000-07-24 | 北川工業株式会社 | 電子部品用放熱体 |
| US6391442B1 (en) | 1999-07-08 | 2002-05-21 | Saint-Gobain Performance Plastics Corporation | Phase change thermal interface material |
| US6451422B1 (en) | 1999-12-01 | 2002-09-17 | Johnson Matthey, Inc. | Thermal interface materials |
| JP2002206030A (ja) * | 2000-11-08 | 2002-07-26 | Bridgestone Corp | 放熱シートの製造方法 |
| US6533955B1 (en) | 2000-11-20 | 2003-03-18 | 3M Innovative Properties Company | Conductive fluoropolymers |
| JP2002194339A (ja) * | 2000-12-26 | 2002-07-10 | Sekisui Chem Co Ltd | 熱伝導材 |
-
2003
- 2003-07-31 US US10/632,330 patent/US6874573B2/en not_active Expired - Fee Related
-
2004
- 2004-07-26 EP EP04017644A patent/EP1503413A3/en not_active Withdrawn
- 2004-07-29 JP JP2004222010A patent/JP2005097550A/ja active Pending
- 2004-07-30 CN CNB2004100766248A patent/CN100506943C/zh not_active Expired - Fee Related
- 2004-07-30 TW TW093122801A patent/TW200523348A/zh unknown
- 2004-07-30 KR KR1020040060296A patent/KR20050014749A/ko not_active Ceased
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