CN100506943C - 热界面材料 - Google Patents

热界面材料 Download PDF

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Publication number
CN100506943C
CN100506943C CNB2004100766248A CN200410076624A CN100506943C CN 100506943 C CN100506943 C CN 100506943C CN B2004100766248 A CNB2004100766248 A CN B2004100766248A CN 200410076624 A CN200410076624 A CN 200410076624A CN 100506943 C CN100506943 C CN 100506943C
Authority
CN
China
Prior art keywords
composition
thermal conduction
silver
thermal interface
terminated butadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100766248A
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English (en)
Chinese (zh)
Other versions
CN1603382A (zh
Inventor
A·科林斯
C·-M·程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of CN1603382A publication Critical patent/CN1603382A/zh
Application granted granted Critical
Publication of CN100506943C publication Critical patent/CN100506943C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB2004100766248A 2003-07-31 2004-07-30 热界面材料 Expired - Fee Related CN100506943C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/632,330 US6874573B2 (en) 2003-07-31 2003-07-31 Thermal interface material
US10/632330 2003-07-31

Publications (2)

Publication Number Publication Date
CN1603382A CN1603382A (zh) 2005-04-06
CN100506943C true CN100506943C (zh) 2009-07-01

Family

ID=33541542

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100766248A Expired - Fee Related CN100506943C (zh) 2003-07-31 2004-07-30 热界面材料

Country Status (6)

Country Link
US (1) US6874573B2 (enExample)
EP (1) EP1503413A3 (enExample)
JP (1) JP2005097550A (enExample)
KR (1) KR20050014749A (enExample)
CN (1) CN100506943C (enExample)
TW (1) TW200523348A (enExample)

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US20070179232A1 (en) * 2006-01-30 2007-08-02 National Starch And Chemical Investment Holding Corporation Thermal Interface Material
DE102006026075A1 (de) * 2006-06-03 2007-12-06 Hydac System Gmbh Wärmeaustauschvorrichtung
US20090051026A1 (en) * 2007-08-20 2009-02-26 International Business Machines Corporation Process for forming metal film and release layer on polymer
US9795059B2 (en) * 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8735487B2 (en) * 2008-07-03 2014-05-27 Bridgestone Corporation Tire components with improved heat transfer
JP5323432B2 (ja) * 2008-09-24 2013-10-23 古河電気工業株式会社 熱伝導用成形体
WO2010104542A1 (en) 2009-03-02 2010-09-16 Honeywell International Inc. Thermal interface material and method of making and using the same
US20110265979A1 (en) * 2010-04-30 2011-11-03 Sihai Chen Thermal interface materials with good reliability
US20120080639A1 (en) * 2010-10-04 2012-04-05 Laird Technologies, Inc. Potato shaped graphite filler, thermal interface materials and emi shielding
CN102250425A (zh) * 2011-05-24 2011-11-23 深圳市博恩实业有限公司 多功能导热复合材料
EP3077578A4 (en) 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
JP5563175B1 (ja) * 2014-03-05 2014-07-30 清二 加川 高熱伝導率の放熱シート及びその製造方法
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
DE102014016167A1 (de) * 2014-11-04 2016-05-04 Mann + Hummel Gmbh Filterelement und Verfahren zum Herstellen desselben
CN112080258A (zh) 2014-12-05 2020-12-15 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
WO2017152353A1 (en) 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10371620B2 (en) * 2016-05-20 2019-08-06 Particle Measuring Systems, Inc. Automatic power control liquid particle counter with flow and bubble detection systems
CN105820388A (zh) * 2016-05-30 2016-08-03 安徽省含山县锦华氧化锌厂 一种导电丁腈橡胶及其制备方法
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6370858B2 (ja) * 2016-10-26 2018-08-08 株式会社塩原製作所 加熱装置と被加熱物間への介在用熱伝導ペースト及び該熱伝導ペーストを用いた熱伝導方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR102807539B1 (ko) * 2020-02-25 2025-05-13 현대자동차주식회사 양면 냉각형 파워모듈
CN114561102A (zh) * 2022-03-22 2022-05-31 深圳先进电子材料国际创新研究院 一种高导热自修复热界面材料及其制备方法

Citations (6)

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US3972821A (en) * 1973-04-30 1976-08-03 Amchem Products, Inc. Heat transfer composition and method of making
US5712039A (en) * 1995-04-11 1998-01-27 Minnesota Mining And Manufacturing Company Epoxy adhesives with dithiooxamide adhesion promoters
US5783465A (en) * 1997-04-03 1998-07-21 Lucent Technologies Inc. Compliant bump technology
US5807910A (en) * 1997-06-23 1998-09-15 Industrial Technology Research Institute Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive
US6063839A (en) * 1995-05-09 2000-05-16 Toray Industries, Inc. Prepreg of reinforcing fibers, epoxy resins, crosslinked rubber particles and curing agent
EP1198005A1 (en) * 1999-03-26 2002-04-17 Hitachi, Ltd. Semiconductor module and method of mounting

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JPS58117234A (ja) * 1982-01-05 1983-07-12 Meidensha Electric Mfg Co Ltd 熱伝導性材料
US4576845A (en) 1983-12-15 1986-03-18 Krc Inc. Thermally conductive base layers for cast polyurethane roll covers
US5137959A (en) 1991-05-24 1992-08-11 W. R. Grace & Co.-Conn. Thermally conductive elastomer containing alumina platelets
US6319599B1 (en) * 1992-07-14 2001-11-20 Theresa M. Buckley Phase change thermal control materials, method and apparatus
JP3439246B2 (ja) 1993-11-22 2003-08-25 株式会社共和 絶縁性と制振性と熱伝導性を有するゴムおよび／またはプラスチック成型物
US5591034A (en) 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5545473A (en) 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US6090484A (en) 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5904978A (en) 1995-12-15 1999-05-18 W. L. Gore & Associates, Inc. Electrically conductive polytetrafluoroethylene article
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
US6054198A (en) 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
JP3668555B2 (ja) 1996-06-05 2005-07-06 住友ゴム工業株式会社 導電性ゴム組成物
US5738936A (en) 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
US6210789B1 (en) 1997-02-20 2001-04-03 W. L. Gore & Associates, Inc. Electrically conductive composite article
JPH10242354A (ja) * 1997-02-24 1998-09-11 Matsushita Electric Ind Co Ltd 熱伝導部材およびそれを用いた電子装置
JPH1131767A (ja) * 1997-07-10 1999-02-02 Toyota Motor Corp 変形可能な伝熱体
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US6090491A (en) 1998-02-27 2000-07-18 Eastman Kodak Company Fuser member with styrl-treated Al2 O3 filler and functionalized release fluids
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JP2992285B1 (ja) * 1998-11-10 1999-12-20 北川工業株式会社 熱伝導材
JP2000174184A (ja) * 1998-12-08 2000-06-23 Sekisui Chem Co Ltd 熱伝導性シート及び熱伝導性部品
JP3510834B2 (ja) 2000-01-28 2004-03-29 株式会社巴川製紙所 導電性接着剤組成物、導電性接着剤シート、電磁波シールド材料及びそれを使用したフレキシブルプリント基板
JP3068613B1 (ja) * 1999-06-28 2000-07-24 北川工業株式会社 電子部品用放熱体
US6391442B1 (en) 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
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JP2002206030A (ja) * 2000-11-08 2002-07-26 Bridgestone Corp 放熱シートの製造方法
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JP2002194339A (ja) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd 熱伝導材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972821A (en) * 1973-04-30 1976-08-03 Amchem Products, Inc. Heat transfer composition and method of making
US5712039A (en) * 1995-04-11 1998-01-27 Minnesota Mining And Manufacturing Company Epoxy adhesives with dithiooxamide adhesion promoters
US6063839A (en) * 1995-05-09 2000-05-16 Toray Industries, Inc. Prepreg of reinforcing fibers, epoxy resins, crosslinked rubber particles and curing agent
US5783465A (en) * 1997-04-03 1998-07-21 Lucent Technologies Inc. Compliant bump technology
US5807910A (en) * 1997-06-23 1998-09-15 Industrial Technology Research Institute Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive
EP1198005A1 (en) * 1999-03-26 2002-04-17 Hitachi, Ltd. Semiconductor module and method of mounting

Also Published As

Publication number Publication date
KR20050014749A (ko) 2005-02-07
TW200523348A (en) 2005-07-16
JP2005097550A (ja) 2005-04-14
EP1503413A3 (en) 2008-01-23
EP1503413A2 (en) 2005-02-02
US20050022971A1 (en) 2005-02-03
US6874573B2 (en) 2005-04-05
CN1603382A (zh) 2005-04-06

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090701

Termination date: 20100730