TW200523348A - Thermal interface material - Google Patents

Thermal interface material Download PDF

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Publication number
TW200523348A
TW200523348A TW093122801A TW93122801A TW200523348A TW 200523348 A TW200523348 A TW 200523348A TW 093122801 A TW093122801 A TW 093122801A TW 93122801 A TW93122801 A TW 93122801A TW 200523348 A TW200523348 A TW 200523348A
Authority
TW
Taiwan
Prior art keywords
patent application
composition
item
application scope
scope
Prior art date
Application number
TW093122801A
Other languages
English (en)
Chinese (zh)
Inventor
Andrew Collins
Chih-Min Cheng
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of TW200523348A publication Critical patent/TW200523348A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW093122801A 2003-07-31 2004-07-30 Thermal interface material TW200523348A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/632,330 US6874573B2 (en) 2003-07-31 2003-07-31 Thermal interface material

Publications (1)

Publication Number Publication Date
TW200523348A true TW200523348A (en) 2005-07-16

Family

ID=33541542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122801A TW200523348A (en) 2003-07-31 2004-07-30 Thermal interface material

Country Status (6)

Country Link
US (1) US6874573B2 (enExample)
EP (1) EP1503413A3 (enExample)
JP (1) JP2005097550A (enExample)
KR (1) KR20050014749A (enExample)
CN (1) CN100506943C (enExample)
TW (1) TW200523348A (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10327452A1 (de) * 2003-06-18 2005-01-05 Bayer Materialscience Ag Klebstoffe
US20060070720A1 (en) * 2004-09-17 2006-04-06 Capp Joseph P Heat riser
TW200634140A (en) * 2005-03-21 2006-10-01 Mitac Technology Corp Heat conduction interface structure and manufacturing process method thereof
CN1978582A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
US20070179232A1 (en) * 2006-01-30 2007-08-02 National Starch And Chemical Investment Holding Corporation Thermal Interface Material
DE102006026075A1 (de) * 2006-06-03 2007-12-06 Hydac System Gmbh Wärmeaustauschvorrichtung
US20090051026A1 (en) * 2007-08-20 2009-02-26 International Business Machines Corporation Process for forming metal film and release layer on polymer
US9795059B2 (en) * 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8735487B2 (en) * 2008-07-03 2014-05-27 Bridgestone Corporation Tire components with improved heat transfer
JP5323432B2 (ja) * 2008-09-24 2013-10-23 古河電気工業株式会社 熱伝導用成形体
WO2010104542A1 (en) 2009-03-02 2010-09-16 Honeywell International Inc. Thermal interface material and method of making and using the same
US20110265979A1 (en) * 2010-04-30 2011-11-03 Sihai Chen Thermal interface materials with good reliability
US20120080639A1 (en) * 2010-10-04 2012-04-05 Laird Technologies, Inc. Potato shaped graphite filler, thermal interface materials and emi shielding
CN102250425A (zh) * 2011-05-24 2011-11-23 深圳市博恩实业有限公司 多功能导热复合材料
EP3077578A4 (en) 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
JP5563175B1 (ja) * 2014-03-05 2014-07-30 清二 加川 高熱伝導率の放熱シート及びその製造方法
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
DE102014016167A1 (de) * 2014-11-04 2016-05-04 Mann + Hummel Gmbh Filterelement und Verfahren zum Herstellen desselben
CN112080258A (zh) 2014-12-05 2020-12-15 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
WO2017152353A1 (en) 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10371620B2 (en) * 2016-05-20 2019-08-06 Particle Measuring Systems, Inc. Automatic power control liquid particle counter with flow and bubble detection systems
CN105820388A (zh) * 2016-05-30 2016-08-03 安徽省含山县锦华氧化锌厂 一种导电丁腈橡胶及其制备方法
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6370858B2 (ja) * 2016-10-26 2018-08-08 株式会社塩原製作所 加熱装置と被加熱物間への介在用熱伝導ペースト及び該熱伝導ペーストを用いた熱伝導方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR102807539B1 (ko) * 2020-02-25 2025-05-13 현대자동차주식회사 양면 냉각형 파워모듈
CN114561102A (zh) * 2022-03-22 2022-05-31 深圳先进电子材料国际创新研究院 一种高导热自修复热界面材料及其制备方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972821A (en) * 1973-04-30 1976-08-03 Amchem Products, Inc. Heat transfer composition and method of making
JPS58117234A (ja) * 1982-01-05 1983-07-12 Meidensha Electric Mfg Co Ltd 熱伝導性材料
US4576845A (en) 1983-12-15 1986-03-18 Krc Inc. Thermally conductive base layers for cast polyurethane roll covers
US5137959A (en) 1991-05-24 1992-08-11 W. R. Grace & Co.-Conn. Thermally conductive elastomer containing alumina platelets
US6319599B1 (en) * 1992-07-14 2001-11-20 Theresa M. Buckley Phase change thermal control materials, method and apparatus
JP3439246B2 (ja) 1993-11-22 2003-08-25 株式会社共和 絶縁性と制振性と熱伝導性を有するゴムおよび／またはプラスチック成型物
US5591034A (en) 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5545473A (en) 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5712039A (en) * 1995-04-11 1998-01-27 Minnesota Mining And Manufacturing Company Epoxy adhesives with dithiooxamide adhesion promoters
JPH0925393A (ja) * 1995-05-09 1997-01-28 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
US6090484A (en) 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5904978A (en) 1995-12-15 1999-05-18 W. L. Gore & Associates, Inc. Electrically conductive polytetrafluoroethylene article
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
US6054198A (en) 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
JP3668555B2 (ja) 1996-06-05 2005-07-06 住友ゴム工業株式会社 導電性ゴム組成物
US5738936A (en) 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
US6210789B1 (en) 1997-02-20 2001-04-03 W. L. Gore & Associates, Inc. Electrically conductive composite article
JPH10242354A (ja) * 1997-02-24 1998-09-11 Matsushita Electric Ind Co Ltd 熱伝導部材およびそれを用いた電子装置
US5783465A (en) * 1997-04-03 1998-07-21 Lucent Technologies Inc. Compliant bump technology
US5807910A (en) * 1997-06-23 1998-09-15 Industrial Technology Research Institute Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive
JPH1131767A (ja) * 1997-07-10 1999-02-02 Toyota Motor Corp 変形可能な伝熱体
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US6090491A (en) 1998-02-27 2000-07-18 Eastman Kodak Company Fuser member with styrl-treated Al2 O3 filler and functionalized release fluids
US6255581B1 (en) 1998-03-31 2001-07-03 Gore Enterprise Holdings, Inc. Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace
US6203873B1 (en) 1998-05-22 2001-03-20 Dayco Products, Inc. Blends of fluoroelastomer interpolymers with thermo fluoroplastic interpolymers and the use of such blends in hoses
JP2992285B1 (ja) * 1998-11-10 1999-12-20 北川工業株式会社 熱伝導材
JP2000174184A (ja) * 1998-12-08 2000-06-23 Sekisui Chem Co Ltd 熱伝導性シート及び熱伝導性部品
EP1198005A4 (en) * 1999-03-26 2004-11-24 Hitachi Ltd SEMICONDUCTOR MODULE AND ITS ASSEMBLY
JP3510834B2 (ja) 2000-01-28 2004-03-29 株式会社巴川製紙所 導電性接着剤組成物、導電性接着剤シート、電磁波シールド材料及びそれを使用したフレキシブルプリント基板
JP3068613B1 (ja) * 1999-06-28 2000-07-24 北川工業株式会社 電子部品用放熱体
US6391442B1 (en) 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6451422B1 (en) 1999-12-01 2002-09-17 Johnson Matthey, Inc. Thermal interface materials
JP2002206030A (ja) * 2000-11-08 2002-07-26 Bridgestone Corp 放熱シートの製造方法
US6533955B1 (en) 2000-11-20 2003-03-18 3M Innovative Properties Company Conductive fluoropolymers
JP2002194339A (ja) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd 熱伝導材

Also Published As

Publication number Publication date
KR20050014749A (ko) 2005-02-07
JP2005097550A (ja) 2005-04-14
EP1503413A3 (en) 2008-01-23
EP1503413A2 (en) 2005-02-02
CN100506943C (zh) 2009-07-01
US20050022971A1 (en) 2005-02-03
US6874573B2 (en) 2005-04-05
CN1603382A (zh) 2005-04-06

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