JP2004526822A5 - - Google Patents
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- Publication number
- JP2004526822A5 JP2004526822A5 JP2002561844A JP2002561844A JP2004526822A5 JP 2004526822 A5 JP2004526822 A5 JP 2004526822A5 JP 2002561844 A JP2002561844 A JP 2002561844A JP 2002561844 A JP2002561844 A JP 2002561844A JP 2004526822 A5 JP2004526822 A5 JP 2004526822A5
- Authority
- JP
- Japan
- Prior art keywords
- compliant
- vinyl
- crosslinkable material
- silicone resin
- resin mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 19
- 229920002554 vinyl polymer Polymers 0.000 claims description 17
- 229920002050 silicone resin Polymers 0.000 claims description 16
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 13
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011231 conductive filler Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000003623 enhancer Substances 0.000 claims description 5
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 150000004678 hydrides Chemical class 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- -1 titanate compound Chemical class 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 239000012758 reinforcing additive Substances 0.000 claims 8
- 239000003431 cross linking reagent Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims 2
- 239000004971 Cross linker Substances 0.000 claims 2
- 229920001410 Microfiber Polymers 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 230000003078 antioxidant effect Effects 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 239000004917 carbon fiber Substances 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- 239000003658 microfiber Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000012798 spherical particle Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000002245 particle Substances 0.000 description 3
- 239000000499 gel Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 235000013175 Crataegus laevigata Nutrition 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/774,466 US6605238B2 (en) | 1999-09-17 | 2001-01-30 | Compliant and crosslinkable thermal interface materials |
| PCT/US2002/001573 WO2002061764A1 (en) | 2001-01-30 | 2002-01-17 | Compliant and crosslinkable thermal interface materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004526822A JP2004526822A (ja) | 2004-09-02 |
| JP2004526822A5 true JP2004526822A5 (enExample) | 2008-04-17 |
Family
ID=25101321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002561844A Withdrawn JP2004526822A (ja) | 2001-01-30 | 2002-01-17 | コンプライアントな架橋性サーマルインターフェース材料 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6605238B2 (enExample) |
| EP (2) | EP1356477B1 (enExample) |
| JP (1) | JP2004526822A (enExample) |
| KR (1) | KR100621538B1 (enExample) |
| CN (2) | CN1288668C (enExample) |
| AT (1) | ATE411605T1 (enExample) |
| CA (1) | CA2433567A1 (enExample) |
| DE (1) | DE60229355D1 (enExample) |
| MY (1) | MY122904A (enExample) |
| TW (1) | TWI305218B (enExample) |
| WO (1) | WO2002061764A1 (enExample) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6706219B2 (en) | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| CN1868736A (zh) * | 2001-05-30 | 2006-11-29 | 霍尼韦尔国际公司 | 界面材料及其生产方法和应用 |
| US6651736B2 (en) * | 2001-06-28 | 2003-11-25 | Intel Corporation | Short carbon fiber enhanced thermal grease |
| JP4784720B2 (ja) * | 2001-09-25 | 2011-10-05 | 信越化学工業株式会社 | 粘着テープ |
| KR100796678B1 (ko) * | 2001-09-28 | 2008-01-21 | 삼성에스디아이 주식회사 | 평면 표시 소자용 전자 방출원 조성물, 이를 이용한 평면 표시 소자용 전자 방출원의 제조방법 및 이를 포함하는 평면 표시 소자 |
| US6620515B2 (en) * | 2001-12-14 | 2003-09-16 | Dow Corning Corporation | Thermally conductive phase change materials |
| AU2003254046A1 (en) * | 2002-07-15 | 2004-02-02 | Honeywell International Inc. | Thermal interconnect and interface systems, methods of production and uses thereof |
| US6783692B2 (en) * | 2002-10-17 | 2004-08-31 | Dow Corning Corporation | Heat softening thermally conductive compositions and methods for their preparation |
| JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
| WO2005096786A2 (en) * | 2004-04-09 | 2005-10-20 | Ail Research, Inc. | Heat and mass exchanger |
| CN100370604C (zh) * | 2004-04-15 | 2008-02-20 | 鸿富锦精密工业（深圳）有限公司 | 一种热界面材料及其制造方法 |
| CN100389166C (zh) * | 2004-04-29 | 2008-05-21 | 鸿富锦精密工业（深圳）有限公司 | 一种热界面材料及其制造方法 |
| CN100543103C (zh) * | 2005-03-19 | 2009-09-23 | 清华大学 | 热界面材料及其制备方法 |
| US7390377B1 (en) | 2005-09-22 | 2008-06-24 | Sandia Corporation | Bonding thermoplastic polymers |
| CN100528315C (zh) * | 2005-10-11 | 2009-08-19 | 鸿富锦精密工业（深圳）有限公司 | 热界面材料混合装置 |
| US20070097651A1 (en) * | 2005-11-01 | 2007-05-03 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
| CN1962067B (zh) * | 2005-11-10 | 2010-04-14 | 鸿富锦精密工业（深圳）有限公司 | 碾磨设备 |
| CN1978580B (zh) * | 2005-12-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
| JP2007161806A (ja) * | 2005-12-12 | 2007-06-28 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーンゴム組成物 |
| US20100219369A1 (en) * | 2005-12-20 | 2010-09-02 | Industrial Technology Research Institute | Composition of thermal interface material |
| TWI291480B (en) * | 2005-12-20 | 2007-12-21 | Ind Tech Res Inst | Composition for thermal interface materials |
| CN1986643B (zh) * | 2005-12-23 | 2010-05-12 | 富准精密工业(深圳)有限公司 | 硅脂组合物 |
| CN101003685A (zh) * | 2006-01-18 | 2007-07-25 | 富准精密工业(深圳)有限公司 | 导热聚硅氧烷组合物 |
| CN101003725A (zh) * | 2006-01-21 | 2007-07-25 | 富准精密工业(深圳)有限公司 | 热界面材料及其制作方法 |
| US7951871B2 (en) * | 2006-11-10 | 2011-05-31 | Exxonmobil Chemical Patents Inc. | Curing rubber by hydrosilation |
| EP2039496A1 (en) * | 2007-09-20 | 2009-03-25 | ABB Research Ltd. | A method of producing a rubber product |
| EP2042558A1 (en) * | 2007-09-20 | 2009-04-01 | ABB Research Ltd. | An electric insulation device and an electric device provided therewith |
| JP2008160126A (ja) * | 2007-12-21 | 2008-07-10 | Shin Etsu Chem Co Ltd | 電子部品の冷却構造 |
| US20110038124A1 (en) * | 2008-04-21 | 2011-02-17 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
| US7808099B2 (en) * | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
| US20100112360A1 (en) * | 2008-10-31 | 2010-05-06 | Delano Andrew D | Layered thermal interface systems methods of production and uses thereof |
| US9751264B2 (en) * | 2009-10-09 | 2017-09-05 | Alcatel-Lucent Usa Inc. | Thermal interface device |
| US8247494B2 (en) * | 2009-11-23 | 2012-08-21 | Exxonmobil Chemical Patents Inc. | Thermoset compositions with dispersed thermoplastic resin therein and process for making them |
| CN102554486A (zh) * | 2010-12-28 | 2012-07-11 | 上海杰远环保科技有限公司 | 一种高导热焊接材料及其制造方法 |
| KR102250406B1 (ko) | 2013-03-14 | 2021-05-12 | 다우 실리콘즈 코포레이션 | 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스 |
| WO2014150302A1 (en) | 2013-03-14 | 2014-09-25 | Dow Corning Corporation | Conductive silicone materials and uses |
| US9693481B2 (en) | 2013-06-25 | 2017-06-27 | Henkel IP & Holding GmbH | Thermally conductive dielectric interface |
| EP3077578A4 (en) | 2013-12-05 | 2017-07-26 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
| CN105980512A (zh) | 2014-02-13 | 2016-09-28 | 霍尼韦尔国际公司 | 可压缩热界面材料 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| CN106795274B (zh) | 2014-07-18 | 2020-02-07 | 沙特基础工业全球技术公司 | 形成动态交联聚合物组合物的方法 |
| JP6149831B2 (ja) * | 2014-09-04 | 2017-06-21 | 信越化学工業株式会社 | シリコーン組成物 |
| CN112080258A (zh) | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| EP3274124A1 (en) * | 2015-03-26 | 2018-01-31 | SABIC Global Technologies B.V. | Use of dynamic cross-linked polymer compositions in soldering applications |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| US9937662B2 (en) | 2016-09-01 | 2018-04-10 | International Business Machines Corporation | Shape memory thermal interface materials |
| US9873774B1 (en) * | 2016-09-01 | 2018-01-23 | International Business Machines Corporation | Shape memory thermal interface materials |
| US10165841B2 (en) | 2016-10-28 | 2019-01-01 | SWings Products, LLC | Footwear carrying system |
| JP2018078272A (ja) * | 2016-10-31 | 2018-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | 三次元形状熱伝導性成形体、及びその製造方法 |
| CN107189767B (zh) * | 2017-05-27 | 2020-11-27 | 广州中科检测技术服务有限公司 | 一种高界面传热效果、可塑、无粘污的界面传热材料及其制备方法 |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN108620765A (zh) * | 2018-05-09 | 2018-10-09 | 长沙小如信息科技有限公司 | 一种汽车钣金件焊接材料及焊接工艺 |
| IT201800006010A1 (it) * | 2018-06-04 | 2019-12-04 | Strato sigillante di uno pneumatico | |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN110591658A (zh) * | 2019-08-20 | 2019-12-20 | 深圳市博恩实业有限公司 | 通道式柔性复合材料高导热体及其制备方法 |
| KR20220035462A (ko) * | 2019-08-26 | 2022-03-22 | 후지필름 가부시키가이샤 | 열전도 재료 형성용 조성물, 열전도 재료, 열전도 시트, 열전도층 포함 디바이스 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4842911A (en) * | 1983-09-02 | 1989-06-27 | The Bergquist Company | Interfacing for heat sinks |
| US4790968A (en) | 1985-10-19 | 1988-12-13 | Toshiba Silicone Co., Ltd. | Process for producing pressure-sensitive electroconductive sheet |
| US5891951A (en) * | 1987-09-14 | 1999-04-06 | Idemitsu Kosan Co., Ltd. | Styrene-based resin composition |
| US5094769A (en) * | 1988-05-13 | 1992-03-10 | International Business Machines Corporation | Compliant thermally conductive compound |
| JPH0484444A (ja) | 1990-07-27 | 1992-03-17 | Toshiba Chem Corp | 導電性ペースト |
| EP0476224A1 (en) | 1990-08-21 | 1992-03-25 | Ricon Resins, Inc. | Adhesive rubber compositions |
| US5227093A (en) * | 1991-11-29 | 1993-07-13 | Dow Corning Corporation | Curable organosiloxane compositions yielding electrically conductive materials |
| US5380770A (en) | 1992-04-09 | 1995-01-10 | General Electric Company | Heat cured silicone rubber compositions containing a potassium aluminosilicate filler which provides resistance to hydrocarbon oils and adjustable shrinkage |
| US5665473A (en) * | 1994-09-16 | 1997-09-09 | Tokuyama Corporation | Package for mounting a semiconductor device |
| US5837119A (en) | 1995-03-31 | 1998-11-17 | International Business Machines Corporation | Methods of fabricating dendritic powder materials for high conductivity paste applications |
| US5859105A (en) | 1997-02-11 | 1999-01-12 | Johnson Matthey, Inc. | Organosilicon-containing compositions capable of rapid curing at low temperature |
| US5852092A (en) | 1997-02-11 | 1998-12-22 | Johnson Matthey, Inc. | Organosilicon-containing compositions having enhanced adhesive properties |
| JPH1140224A (ja) | 1997-07-11 | 1999-02-12 | Jsr Corp | 異方導電性シート |
| US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| GB9816377D0 (en) | 1998-07-29 | 1998-09-23 | Dow Corning Sa | Foam control agents |
| JP3948642B2 (ja) * | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
| JP2000109373A (ja) * | 1998-10-02 | 2000-04-18 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物及びそれを使用した半導体装置 |
| US6271299B1 (en) | 1999-02-02 | 2001-08-07 | Dow Corning Corporation | Fire resistant sealant composition |
| US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
| US5989459A (en) | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
| US6162663A (en) * | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
-
2001
- 2001-01-30 US US09/774,466 patent/US6605238B2/en not_active Expired - Lifetime
-
2002
- 2002-01-17 AT AT02704176T patent/ATE411605T1/de not_active IP Right Cessation
- 2002-01-17 WO PCT/US2002/001573 patent/WO2002061764A1/en not_active Ceased
- 2002-01-17 EP EP02704176A patent/EP1356477B1/en not_active Expired - Lifetime
- 2002-01-17 EP EP08012564A patent/EP1993134A3/en not_active Withdrawn
- 2002-01-17 CN CNB028042662A patent/CN1288668C/zh not_active Ceased
- 2002-01-17 CN CNA2006101318229A patent/CN1927989A/zh active Pending
- 2002-01-17 JP JP2002561844A patent/JP2004526822A/ja not_active Withdrawn
- 2002-01-17 DE DE60229355T patent/DE60229355D1/de not_active Expired - Lifetime
- 2002-01-17 CA CA002433567A patent/CA2433567A1/en not_active Abandoned
- 2002-01-17 KR KR1020037009484A patent/KR100621538B1/ko not_active Expired - Fee Related
- 2002-01-25 TW TW091101240A patent/TWI305218B/zh not_active IP Right Cessation
- 2002-01-29 MY MYPI20020327A patent/MY122904A/en unknown
-
2003
- 2003-05-27 US US10/446,891 patent/US6811725B2/en not_active Expired - Fee Related
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