JP2012153775A - フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法 - Google Patents
フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法 Download PDFInfo
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- JP2012153775A JP2012153775A JP2011012869A JP2011012869A JP2012153775A JP 2012153775 A JP2012153775 A JP 2012153775A JP 2011012869 A JP2011012869 A JP 2011012869A JP 2011012869 A JP2011012869 A JP 2011012869A JP 2012153775 A JP2012153775 A JP 2012153775A
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- film
- mold
- polymer
- pentene
- methyl
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
- WSSSPWUEQFSQQG-UHFFFAOYSA-N dimethylbutene Natural products CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims abstract description 162
- 229920001577 copolymer Polymers 0.000 claims abstract description 100
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 67
- 238000002844 melting Methods 0.000 claims abstract description 42
- 230000008018 melting Effects 0.000 claims abstract description 42
- 229910008901 TmB2 Inorganic materials 0.000 claims abstract description 14
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 46
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 42
- 238000000465 moulding Methods 0.000 claims description 37
- 239000010410 layer Substances 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 32
- 229920000642 polymer Polymers 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 229920001971 elastomer Polymers 0.000 claims description 16
- 239000000806 elastomer Substances 0.000 claims description 16
- 150000001336 alkenes Chemical class 0.000 claims description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- 239000002344 surface layer Substances 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 9
- 238000003917 TEM image Methods 0.000 claims description 7
- 101100207005 Caenorhabditis elegans tmc-2 gene Proteins 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 44
- 230000015572 biosynthetic process Effects 0.000 description 31
- 238000003786 synthesis reaction Methods 0.000 description 31
- 239000004065 semiconductor Substances 0.000 description 14
- 239000004711 α-olefin Substances 0.000 description 14
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 230000037303 wrinkles Effects 0.000 description 9
- 238000004898 kneading Methods 0.000 description 8
- 229920005629 polypropylene homopolymer Polymers 0.000 description 8
- 229920002050 silicone resin Polymers 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- -1 ethylene, propylene, 1-butene Chemical class 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 4
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 101100425646 Caenorhabditis elegans tmc-1 gene Proteins 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012760 heat stabilizer Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- 229920006124 polyolefin elastomer Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 239000005001 laminate film Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000012968 metallocene catalyst Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229920002600 TPX™ Polymers 0.000 description 1
- 229920005517 TPX™ DX310 Polymers 0.000 description 1
- 229920005518 TPX™ DX350 Polymers 0.000 description 1
- 229920005531 TPX™ MX004 Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QKTQFVSPMAUOFP-UHFFFAOYSA-L [Cl-].[Cl-].CC(C)=[Zr+2](C1=CC=CC=2C3=CC=CC=C3CC1=2)C1C=C(C=C1C)C(C)(C)C Chemical compound [Cl-].[Cl-].CC(C)=[Zr+2](C1=CC=CC=2C3=CC=CC=C3CC1=2)C1C=C(C=C1C)C(C)(C)C QKTQFVSPMAUOFP-UHFFFAOYSA-L 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229920001887 crystalline plastic Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- CPOFMOWDMVWCLF-UHFFFAOYSA-N methyl(oxo)alumane Chemical compound C[Al]=O CPOFMOWDMVWCLF-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000199 molecular distillation Methods 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011012869A JP2012153775A (ja) | 2011-01-25 | 2011-01-25 | フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011012869A JP2012153775A (ja) | 2011-01-25 | 2011-01-25 | フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012153775A true JP2012153775A (ja) | 2012-08-16 |
| JP2012153775A5 JP2012153775A5 (enExample) | 2014-02-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011012869A Pending JP2012153775A (ja) | 2011-01-25 | 2011-01-25 | フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012153775A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012188597A (ja) * | 2011-03-11 | 2012-10-04 | Mitsui Chemicals Inc | フィルム、前記フィルムの製造方法及びそれを用いたダイシング方法 |
| WO2013115187A1 (ja) * | 2012-01-30 | 2013-08-08 | 旭硝子株式会社 | 離型フィルムおよびこれを用いた半導体デバイスの製造方法 |
| JP2014113703A (ja) * | 2012-12-06 | 2014-06-26 | Mitsui Chemicals Tohcello Inc | Ｌｅｄ封止体用金型離型フィルムおよびそれを用いたｌｅｄ封止体の製造方法 |
| JP2015214658A (ja) * | 2014-05-12 | 2015-12-03 | 三井化学株式会社 | 拡張性基材フィルム、拡張性粘着フィルム、ダイシングフィルム、拡張性基材フィルムの製造方法、及び半導体装置の製造方法 |
| JP2021141244A (ja) * | 2020-03-06 | 2021-09-16 | 味の素株式会社 | 半導体装置の製造方法、及び、樹脂シート |
| JP2023151749A (ja) * | 2022-04-01 | 2023-10-16 | 株式会社日本製鋼所 | 成形方法および射出成形機システム |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751342A (ja) * | 1993-03-16 | 1995-02-28 | Clintec Nutrition Co | 剥離可能シール、ならびに同シールを備える容器 |
| JPH08302111A (ja) * | 1995-05-15 | 1996-11-19 | Yokohama Rubber Co Ltd:The | 熱可塑性エラストマー組成物 |
| JP2002225203A (ja) * | 2001-02-02 | 2002-08-14 | Grand Polymer Co Ltd | オレフィン系多層収縮フィルムおよび包装材 |
| WO2005030466A1 (ja) * | 2003-09-30 | 2005-04-07 | Sekisui Chemical Co., Ltd. | 多層シート |
| JP2006070252A (ja) * | 2004-08-03 | 2006-03-16 | Mitsui Chemicals Inc | ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 |
| JP2007175885A (ja) * | 2005-12-27 | 2007-07-12 | Asahi Kasei Chemicals Corp | 離型フィルム |
| JP2009030066A (ja) * | 2008-09-16 | 2009-02-12 | Mitsui Chemicals Inc | フィルム及びそれを含有してなる積層体 |
| JP2009040982A (ja) * | 2007-08-11 | 2009-02-26 | Sumitomo Bakelite Co Ltd | 離型フィルム |
| WO2010023907A1 (ja) * | 2008-08-28 | 2010-03-04 | 三井化学株式会社 | 半導体樹脂パッケージ製造用金型離型フィルム、およびそれを用いた半導体樹脂パッケージの製造方法 |
-
2011
- 2011-01-25 JP JP2011012869A patent/JP2012153775A/ja active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751342A (ja) * | 1993-03-16 | 1995-02-28 | Clintec Nutrition Co | 剥離可能シール、ならびに同シールを備える容器 |
| JPH08302111A (ja) * | 1995-05-15 | 1996-11-19 | Yokohama Rubber Co Ltd:The | 熱可塑性エラストマー組成物 |
| JP2002225203A (ja) * | 2001-02-02 | 2002-08-14 | Grand Polymer Co Ltd | オレフィン系多層収縮フィルムおよび包装材 |
| WO2005030466A1 (ja) * | 2003-09-30 | 2005-04-07 | Sekisui Chemical Co., Ltd. | 多層シート |
| JP2006070252A (ja) * | 2004-08-03 | 2006-03-16 | Mitsui Chemicals Inc | ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 |
| JP2007175885A (ja) * | 2005-12-27 | 2007-07-12 | Asahi Kasei Chemicals Corp | 離型フィルム |
| JP2009040982A (ja) * | 2007-08-11 | 2009-02-26 | Sumitomo Bakelite Co Ltd | 離型フィルム |
| WO2010023907A1 (ja) * | 2008-08-28 | 2010-03-04 | 三井化学株式会社 | 半導体樹脂パッケージ製造用金型離型フィルム、およびそれを用いた半導体樹脂パッケージの製造方法 |
| JP2009030066A (ja) * | 2008-09-16 | 2009-02-12 | Mitsui Chemicals Inc | フィルム及びそれを含有してなる積層体 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012188597A (ja) * | 2011-03-11 | 2012-10-04 | Mitsui Chemicals Inc | フィルム、前記フィルムの製造方法及びそれを用いたダイシング方法 |
| WO2013115187A1 (ja) * | 2012-01-30 | 2013-08-08 | 旭硝子株式会社 | 離型フィルムおよびこれを用いた半導体デバイスの製造方法 |
| JPWO2013115187A1 (ja) * | 2012-01-30 | 2015-05-11 | 旭硝子株式会社 | 離型フィルムおよびこれを用いた半導体デバイスの製造方法 |
| US9306135B2 (en) | 2012-01-30 | 2016-04-05 | Asahi Glass Company, Limited | Mold release film and method of process for producing a semiconductor device using the same |
| JP2014113703A (ja) * | 2012-12-06 | 2014-06-26 | Mitsui Chemicals Tohcello Inc | Ｌｅｄ封止体用金型離型フィルムおよびそれを用いたｌｅｄ封止体の製造方法 |
| JP2015214658A (ja) * | 2014-05-12 | 2015-12-03 | 三井化学株式会社 | 拡張性基材フィルム、拡張性粘着フィルム、ダイシングフィルム、拡張性基材フィルムの製造方法、及び半導体装置の製造方法 |
| JP2021141244A (ja) * | 2020-03-06 | 2021-09-16 | 味の素株式会社 | 半導体装置の製造方法、及び、樹脂シート |
| JP7439575B2 (ja) | 2020-03-06 | 2024-02-28 | 味の素株式会社 | 半導体装置の製造方法、及び、樹脂シート |
| JP2023151749A (ja) * | 2022-04-01 | 2023-10-16 | 株式会社日本製鋼所 | 成形方法および射出成形機システム |
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