JP2012060133A5 - - Google Patents
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- Publication number
- JP2012060133A5 JP2012060133A5 JP2011197317A JP2011197317A JP2012060133A5 JP 2012060133 A5 JP2012060133 A5 JP 2012060133A5 JP 2011197317 A JP2011197317 A JP 2011197317A JP 2011197317 A JP2011197317 A JP 2011197317A JP 2012060133 A5 JP2012060133 A5 JP 2012060133A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor
- emitting element
- integrated circuit
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 295
- 239000000758 substrate Substances 0.000 claims description 145
- 239000000463 material Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000010410 layer Substances 0.000 description 119
- 238000000034 method Methods 0.000 description 10
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100089048A KR101711961B1 (ko) | 2010-09-10 | 2010-09-10 | 발광 디바이스 |
| KR10-2010-0089048 | 2010-09-10 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012060133A JP2012060133A (ja) | 2012-03-22 |
| JP2012060133A5 true JP2012060133A5 (cg-RX-API-DMAC7.html) | 2014-10-30 |
| JP5945392B2 JP5945392B2 (ja) | 2016-07-05 |
Family
ID=44582605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011197317A Active JP5945392B2 (ja) | 2010-09-10 | 2011-09-09 | 発光デバイス |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9006973B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2428991B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5945392B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101711961B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102403309B (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751296B (zh) * | 2012-07-24 | 2015-05-20 | 矽光光电科技（上海）有限公司 | 整合集成电路、发光元件及传感元件的单衬底器件 |
| CN105264661B (zh) * | 2013-03-25 | 2018-01-16 | 香港科技大学 | 功率片上系统结构 |
| KR20160032236A (ko) * | 2013-07-19 | 2016-03-23 | 코닌클리케 필립스 엔.브이. | 광학 요소를 가지며 기판 캐리어를 갖지 않는 ｐｃ ｌｅｄ |
| TWM496091U (zh) * | 2014-03-26 | 2015-02-21 | 賀喜能源股份有限公司 | 具矽基座的發光二極體及發光二極體燈具 |
| DE102014105734A1 (de) * | 2014-04-23 | 2015-10-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| JP6736260B2 (ja) * | 2015-05-13 | 2020-08-05 | ローム株式会社 | 半導体発光装置 |
| US20170104135A1 (en) * | 2015-10-13 | 2017-04-13 | Sensor Electronic Technology, Inc. | Light Emitting Diode Mounting Structure |
| KR102629637B1 (ko) * | 2018-04-19 | 2024-01-30 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 반도체 레이저 구동 장치 및 그 제조 방법 |
| US12148743B2 (en) * | 2018-12-11 | 2024-11-19 | Sony Semiconductor Solutions Corporation | Semiconductor device and electronic equipment |
| CN113594194B (zh) | 2020-04-30 | 2024-09-17 | 华为机器有限公司 | 一种堆叠结构、显示屏及显示装置 |
| KR102557580B1 (ko) * | 2021-01-05 | 2023-07-20 | 엘지전자 주식회사 | 반도체 발광 소자 패키지 및 디스플레이 장치 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111682A (ja) * | 1986-10-29 | 1988-05-16 | Mitsubishi Electric Corp | 光半導体素子用サブマウント |
| EP1959506A2 (en) | 1997-01-31 | 2008-08-20 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a semiconductor light-emitting device |
| US6777883B2 (en) | 2002-04-10 | 2004-08-17 | Koninklijke Philips Electronics N.V. | Integrated LED drive electronics on silicon-on-insulator integrated circuits |
| US20040206970A1 (en) | 2003-04-16 | 2004-10-21 | Martin Paul S. | Alternating current light emitting device |
| JP2005142294A (ja) | 2003-11-05 | 2005-06-02 | Matsushita Electric Ind Co Ltd | 半導体レーザユニットおよびそれを用いた光ピックアップ装置 |
| JPWO2005104248A1 (ja) * | 2004-04-19 | 2007-08-30 | 松下電器産業株式会社 | 発光素子駆動用半導体チップ、発光装置及び照明装置 |
| WO2006005062A2 (en) | 2004-06-30 | 2006-01-12 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
| KR100927256B1 (ko) | 2004-07-09 | 2009-11-16 | 엘지전자 주식회사 | 제너다이오드가 집적된 발광소자 서브마운트 제작방법 |
| US7221044B2 (en) | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
| JP4601464B2 (ja) * | 2005-03-10 | 2010-12-22 | 株式会社沖データ | 半導体装置、プリントヘッド、及びそれを用いた画像形成装置 |
| KR101241973B1 (ko) | 2005-03-11 | 2013-03-08 | 서울반도체 주식회사 | 발광 장치 및 이의 제조 방법 |
| EP2280430B1 (en) | 2005-03-11 | 2020-01-01 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| US7495944B2 (en) | 2005-03-30 | 2009-02-24 | Ovonyx, Inc. | Reading phase change memories |
| JP4969055B2 (ja) * | 2005-04-28 | 2012-07-04 | ローム株式会社 | 光通信モジュール |
| US7994514B2 (en) | 2006-04-21 | 2011-08-09 | Koninklijke Philips Electronics N.V. | Semiconductor light emitting device with integrated electronic components |
| US7655957B2 (en) | 2006-04-27 | 2010-02-02 | Cree, Inc. | Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| KR101134752B1 (ko) | 2006-07-14 | 2012-04-13 | 엘지이노텍 주식회사 | Ｌｅｄ 패키지 |
| CN101154656B (zh) | 2006-09-30 | 2010-05-12 | 香港微晶先进封装技术有限公司 | 多芯片发光二极管模组结构及其制造方法 |
| US7855425B2 (en) * | 2007-03-09 | 2010-12-21 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing the same |
| JP2008235792A (ja) * | 2007-03-23 | 2008-10-02 | Matsushita Electric Ind Co Ltd | 半導体装置とその製造方法 |
| US8436371B2 (en) * | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
| KR100878326B1 (ko) | 2007-07-03 | 2009-01-14 | 한국광기술원 | 칩스케일 패키징 발광소자 및 그의 제조방법 |
| JP2009117536A (ja) * | 2007-11-05 | 2009-05-28 | Towa Corp | 樹脂封止発光体及びその製造方法 |
| JP5102605B2 (ja) | 2007-12-25 | 2012-12-19 | パナソニック株式会社 | 発光装置およびその製造方法 |
| JP5475954B2 (ja) * | 2008-01-28 | 2014-04-16 | パナソニック株式会社 | 発光装置 |
| US8084780B2 (en) * | 2009-08-13 | 2011-12-27 | Semileds Optoelectronics Co. | Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC) |
-
2010
- 2010-09-10 KR KR1020100089048A patent/KR101711961B1/ko active Active
-
2011
- 2011-09-08 EP EP11180601.4A patent/EP2428991B1/en active Active
- 2011-09-09 US US13/229,152 patent/US9006973B2/en active Active
- 2011-09-09 JP JP2011197317A patent/JP5945392B2/ja active Active
- 2011-09-13 CN CN201110276376.1A patent/CN102403309B/zh active Active
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