CN101154656B - 多芯片发光二极管模组结构及其制造方法 - Google Patents
多芯片发光二极管模组结构及其制造方法 Download PDFInfo
- Publication number
- CN101154656B CN101154656B CN 200610140630 CN200610140630A CN101154656B CN 101154656 B CN101154656 B CN 101154656B CN 200610140630 CN200610140630 CN 200610140630 CN 200610140630 A CN200610140630 A CN 200610140630A CN 101154656 B CN101154656 B CN 101154656B
- Authority
- CN
- China
- Prior art keywords
- chip
- emitting diode
- base plate
- integrated circuit
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 49
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000013461 design Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 21
- 238000002360 preparation method Methods 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910017083 AlN Inorganic materials 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 15
- 230000010354 integration Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 240000001439 Opuntia Species 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229940044658 gallium nitrate Drugs 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610140630 CN101154656B (zh) | 2006-09-30 | 2006-09-30 | 多芯片发光二极管模组结构及其制造方法 |
HK08108255.5A HK1113231A1 (en) | 2006-09-30 | 2008-07-25 | Multi-chip-module light emitting diode design and fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610140630 CN101154656B (zh) | 2006-09-30 | 2006-09-30 | 多芯片发光二极管模组结构及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101154656A CN101154656A (zh) | 2008-04-02 |
CN101154656B true CN101154656B (zh) | 2010-05-12 |
Family
ID=39256199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200610140630 Active CN101154656B (zh) | 2006-09-30 | 2006-09-30 | 多芯片发光二极管模组结构及其制造方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101154656B (zh) |
HK (1) | HK1113231A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008063325A1 (de) | 2008-12-30 | 2010-07-01 | Osram Opto Semiconductors Gmbh | Verfahren zur Fertigung von Leuchtmitteln |
CN101814489A (zh) * | 2010-03-02 | 2010-08-25 | 晶科电子(广州)有限公司 | 带有功能芯片的发光二极管封装结构及其封装方法 |
CN101886759B (zh) * | 2010-05-24 | 2012-07-25 | 晶科电子(广州)有限公司 | 一种使用交流电的发光器件及其制造方法 |
TWI478319B (zh) | 2010-07-20 | 2015-03-21 | Epistar Corp | 整合式發光裝置及其製造方法 |
CN102347325B (zh) * | 2010-07-30 | 2016-06-15 | 晶元光电股份有限公司 | 整合式发光装置及其制造方法 |
CN101958389A (zh) * | 2010-07-30 | 2011-01-26 | 晶科电子(广州)有限公司 | 一种硅基板集成有功能电路的led表面贴装结构及其封装方法 |
KR101711961B1 (ko) * | 2010-09-10 | 2017-03-03 | 삼성전자주식회사 | 발광 디바이스 |
US8912049B2 (en) * | 2010-10-12 | 2014-12-16 | Koninklijke Philips N.V. | PEC biasing technique for LEDs |
CN102214652B (zh) * | 2011-05-25 | 2013-01-30 | 映瑞光电科技(上海)有限公司 | 一种led封装结构及其制备方法 |
KR102138050B1 (ko) * | 2012-08-07 | 2020-08-11 | 루미리즈 홀딩 비.브이. | Led 회로 |
JP2015531982A (ja) * | 2012-09-18 | 2015-11-05 | ウェヴィエン, インコーポレイテッド.Wavien, Inc. | 光再利用のために二重反射を利用する放物面反射鏡を有するランプシステム |
CN102945912A (zh) * | 2012-12-06 | 2013-02-27 | 上海顿格电子贸易有限公司 | Led发光元器件支架 |
US9560722B2 (en) | 2013-03-25 | 2017-01-31 | The Hong Kong University Of Science And Technology | Power system-on-chip architecture |
EP2988056A4 (en) * | 2013-04-19 | 2016-09-28 | Shenzhen Xingrisheng Ind Co | LED LIGHTING DEVICE FOR DISASSEMBLY, ASSEMBLY, COMBINATION AND SIDE SHIFTING OF MODULES AND CONTROL PROCEDURES |
CN104485407B (zh) * | 2014-10-23 | 2017-05-24 | 贵州省兴豪华电子科技有限公司 | 一种带控制芯片的led灯 |
CN105303983A (zh) * | 2015-10-03 | 2016-02-03 | 上海铁歌科技有限公司 | 一种使用单层pcb板实现的小间距的led全彩显示屏 |
JP6740374B2 (ja) * | 2016-12-22 | 2020-08-12 | シャープ株式会社 | 表示装置および製造方法 |
CN108091646B (zh) * | 2017-12-27 | 2020-04-21 | 中国科学院半导体研究所 | 紫外led抗静电硅基板的封装结构 |
CN113411957A (zh) * | 2021-06-30 | 2021-09-17 | 珠海格力电器股份有限公司 | 抗静电芯片、电路板及开关结构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1731592A (zh) * | 2005-08-26 | 2006-02-08 | 杭州士兰明芯科技有限公司 | 倒装焊结构发光二极管及其制造方法 |
CN1780002A (zh) * | 2004-11-19 | 2006-05-31 | 中国科学院半导体研究所 | 倒装氮化镓基发光二极管芯片的制作方法 |
-
2006
- 2006-09-30 CN CN 200610140630 patent/CN101154656B/zh active Active
-
2008
- 2008-07-25 HK HK08108255.5A patent/HK1113231A1/xx unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1780002A (zh) * | 2004-11-19 | 2006-05-31 | 中国科学院半导体研究所 | 倒装氮化镓基发光二极管芯片的制作方法 |
CN1731592A (zh) * | 2005-08-26 | 2006-02-08 | 杭州士兰明芯科技有限公司 | 倒装焊结构发光二极管及其制造方法 |
Non-Patent Citations (1)
Title |
---|
JP特开平7-12302A 1995.05.12 |
Also Published As
Publication number | Publication date |
---|---|
HK1113231A1 (en) | 2008-09-26 |
CN101154656A (zh) | 2008-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101154656B (zh) | 多芯片发光二极管模组结构及其制造方法 | |
EP2954564B1 (en) | Submount-free light emitting diode (led) components and methods of fabricating same | |
US8138515B2 (en) | Surface mounted LED structure and packaging method of integrating functional circuits on a silicon | |
US7808013B2 (en) | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies | |
US9660161B2 (en) | Light emitting diode (LED) components including contact expansion frame | |
US7928458B2 (en) | Light-emitting diode device and method for fabricating the same | |
US9431592B2 (en) | Submount with cavities and through vias for LED packaging | |
TWI528508B (zh) | 高功率發光二極體陶瓷封裝之製造方法 | |
US8247833B2 (en) | LED package and manufacturing method thereof | |
US20070262338A1 (en) | Semiconductor Light-Emitting Element, Manufacturing Method and Mounting Method of the Same and Light-Emitting Device | |
CN102185091B (zh) | 一种发光二极管器件及其制造方法 | |
US9214607B1 (en) | Wire bonded light emitting diode (LED) components including reflective layer | |
WO2020147004A1 (zh) | 发光二极管封装器件及发光装置 | |
CN101350321A (zh) | 直接倒装于支架内的发光二极管的制造方法 | |
TWI420695B (zh) | 化合物半導體元件之封裝模組結構及其製造方法 | |
CN107223285A (zh) | 发光元件以及发光二极管 | |
CN102693972A (zh) | 发光二极管封装及其导线架的制作方法 | |
WO2006056121A1 (en) | The integrated-type led and manufacturing method thereof | |
TW201042720A (en) | A wafer-level CSP processing method and thereof a thin-chip SMT-type light emitting diode | |
CN201904368U (zh) | 一种硅基板集成有功能电路的led表面贴装结构 | |
CN111463339A (zh) | 发光单元及显示屏 | |
JP2012165016A (ja) | 発光装置 | |
JP2006279080A (ja) | 発光素子ウエハの固定方法 | |
KR100643583B1 (ko) | 메탈 pcb를 이용한 다색 발광소자 모듈 및 그 제조방법 | |
JP2008263246A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1113231 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HONGKONG ADVANCED PHOTOELECTRONIC TECHNOLOGY LTD. Free format text: FORMER NAME: HONGKONG MICROCRYSTALLINE ADVANCED PACKAGE TECHNOLOGY CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Room 5, building 501-2, integrated circuit development, 6 West Science Park, Sha Tin Science Park, New Territories, Hongkong Patentee after: Hongkong microcrystalline advanced photoelectric technology Co., Ltd. Address before: Chinese Hongkong Kowloon Hong Kong University Science & Technology wing room 4585 Patentee before: Hongkong Microcrystalline Advanced Package Technology Co., Ltd. |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1113231 Country of ref document: HK |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151120 Address after: 511458, No. 33, South Road, ring road, Nansha New District, Guangdong, Guangzhou Patentee after: APT (Guangzhou) Electronics Ltd. Address before: Room 5, building 501-2, integrated circuit development, 6, science Avenue West, Sha Tin Science Park, West China, Hongkong, China Patentee before: Hongkong microcrystalline advanced photoelectric technology Co., Ltd. |
|
CP03 | Change of name, title or address |
Address after: 511458, No. 33, South Avenue, ring road, Guangzhou, Guangdong, Nansha District Patentee after: GUANGDONG APT ELECTRONICS LTD. Address before: 511458, No. 33, South Road, ring road, Nansha New District, Guangdong, Guangzhou Patentee before: APT (Guangzhou) Electronics Ltd. |
|
CP03 | Change of name, title or address |