HK1113231A1 - Multi-chip-module light emitting diode design and fabrication - Google Patents

Multi-chip-module light emitting diode design and fabrication

Info

Publication number
HK1113231A1
HK1113231A1 HK08108255.5A HK08108255A HK1113231A1 HK 1113231 A1 HK1113231 A1 HK 1113231A1 HK 08108255 A HK08108255 A HK 08108255A HK 1113231 A1 HK1113231 A1 HK 1113231A1
Authority
HK
Hong Kong
Prior art keywords
chip
bedplate
flip
led
control chip
Prior art date
Application number
HK08108255.5A
Other languages
English (en)
Inventor
guo wei Xiao
Philip Chen
Original Assignee
Advanced Packaging Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Packaging Technology filed Critical Advanced Packaging Technology
Publication of HK1113231A1 publication Critical patent/HK1113231A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
HK08108255.5A 2006-09-30 2008-07-25 Multi-chip-module light emitting diode design and fabrication HK1113231A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200610140630 CN101154656B (zh) 2006-09-30 2006-09-30 多芯片发光二极管模组结构及其制造方法

Publications (1)

Publication Number Publication Date
HK1113231A1 true HK1113231A1 (en) 2008-09-26

Family

ID=39256199

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08108255.5A HK1113231A1 (en) 2006-09-30 2008-07-25 Multi-chip-module light emitting diode design and fabrication

Country Status (2)

Country Link
CN (1) CN101154656B (zh)
HK (1) HK1113231A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063325A1 (de) 2008-12-30 2010-07-01 Osram Opto Semiconductors Gmbh Verfahren zur Fertigung von Leuchtmitteln
CN101814489A (zh) * 2010-03-02 2010-08-25 晶科电子（广州）有限公司 带有功能芯片的发光二极管封装结构及其封装方法
CN101886759B (zh) * 2010-05-24 2012-07-25 晶科电子（广州）有限公司 一种使用交流电的发光器件及其制造方法
TWI478319B (zh) 2010-07-20 2015-03-21 Epistar Corp 整合式發光裝置及其製造方法
CN102347325B (zh) * 2010-07-30 2016-06-15 晶元光电股份有限公司 整合式发光装置及其制造方法
CN101958389A (zh) * 2010-07-30 2011-01-26 晶科电子（广州）有限公司 一种硅基板集成有功能电路的led表面贴装结构及其封装方法
KR101711961B1 (ko) * 2010-09-10 2017-03-03 삼성전자주식회사 발광 디바이스
US8912049B2 (en) * 2010-10-12 2014-12-16 Koninklijke Philips N.V. PEC biasing technique for LEDs
CN102214652B (zh) * 2011-05-25 2013-01-30 映瑞光电科技(上海)有限公司 一种led封装结构及其制备方法
KR102138050B1 (ko) * 2012-08-07 2020-08-11 루미리즈 홀딩 비.브이. Led 회로
JP2015531982A (ja) * 2012-09-18 2015-11-05 ウェヴィエン, インコーポレイテッド.Wavien, Inc. 光再利用のために二重反射を利用する放物面反射鏡を有するランプシステム
CN102945912A (zh) * 2012-12-06 2013-02-27 上海顿格电子贸易有限公司 Led发光元器件支架
US9560722B2 (en) 2013-03-25 2017-01-31 The Hong Kong University Of Science And Technology Power system-on-chip architecture
EP2988056A4 (en) * 2013-04-19 2016-09-28 Shenzhen Xingrisheng Ind Co LED LIGHTING DEVICE FOR DISASSEMBLY, ASSEMBLY, COMBINATION AND SIDE SHIFTING OF MODULES AND CONTROL PROCEDURES
CN104485407B (zh) * 2014-10-23 2017-05-24 贵州省兴豪华电子科技有限公司 一种带控制芯片的led灯
CN105303983A (zh) * 2015-10-03 2016-02-03 上海铁歌科技有限公司 一种使用单层pcb板实现的小间距的led全彩显示屏
JP6740374B2 (ja) * 2016-12-22 2020-08-12 シャープ株式会社 表示装置および製造方法
CN108091646B (zh) * 2017-12-27 2020-04-21 中国科学院半导体研究所 紫外led抗静电硅基板的封装结构
CN113411957A (zh) * 2021-06-30 2021-09-17 珠海格力电器股份有限公司 抗静电芯片、电路板及开关结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100353576C (zh) * 2004-11-19 2007-12-05 中国科学院半导体研究所 倒装氮化镓基发光二极管芯片的制作方法
CN1731592A (zh) * 2005-08-26 2006-02-08 杭州士兰明芯科技有限公司 倒装焊结构发光二极管及其制造方法

Also Published As

Publication number Publication date
CN101154656B (zh) 2010-05-12
CN101154656A (zh) 2008-04-02

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