JP2011523207A5 - - Google Patents

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Publication number
JP2011523207A5
JP2011523207A5 JP2011510492A JP2011510492A JP2011523207A5 JP 2011523207 A5 JP2011523207 A5 JP 2011523207A5 JP 2011510492 A JP2011510492 A JP 2011510492A JP 2011510492 A JP2011510492 A JP 2011510492A JP 2011523207 A5 JP2011523207 A5 JP 2011523207A5
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JP
Japan
Prior art keywords
polishing composition
mass
silica
potassium
polishing
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JP2011510492A
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English (en)
Japanese (ja)
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JP2011523207A (ja
JP5600100B2 (ja
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Priority claimed from US12/126,739 external-priority patent/US8017524B2/en
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Publication of JP2011523207A publication Critical patent/JP2011523207A/ja
Publication of JP2011523207A5 publication Critical patent/JP2011523207A5/ja
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Publication of JP5600100B2 publication Critical patent/JP5600100B2/ja
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JP2011510492A 2008-05-23 2009-05-07 安定な高濃度ケイ素スラリー Active JP5600100B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/126,739 2008-05-23
US12/126,739 US8017524B2 (en) 2008-05-23 2008-05-23 Stable, high rate silicon slurry
PCT/US2009/002846 WO2009142692A2 (en) 2008-05-23 2009-05-07 Stable, high rate silicon slurry

Publications (3)

Publication Number Publication Date
JP2011523207A JP2011523207A (ja) 2011-08-04
JP2011523207A5 true JP2011523207A5 (enExample) 2011-09-15
JP5600100B2 JP5600100B2 (ja) 2014-10-01

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Family Applications (1)

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JP2011510492A Active JP5600100B2 (ja) 2008-05-23 2009-05-07 安定な高濃度ケイ素スラリー

Country Status (8)

Country Link
US (1) US8017524B2 (enExample)
EP (1) EP2297263B1 (enExample)
JP (1) JP5600100B2 (enExample)
KR (1) KR101297900B1 (enExample)
CN (1) CN102037094B (enExample)
MY (1) MY148323A (enExample)
TW (1) TWI398506B (enExample)
WO (1) WO2009142692A2 (enExample)

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CN115926629B (zh) * 2022-12-30 2023-12-05 昂士特科技(深圳)有限公司 具有改进再循环性能的化学机械抛光组合物

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