KR101297900B1 - 안정한 고속 규소 슬러리 - Google Patents

안정한 고속 규소 슬러리 Download PDF

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Publication number
KR101297900B1
KR101297900B1 KR1020107028872A KR20107028872A KR101297900B1 KR 101297900 B1 KR101297900 B1 KR 101297900B1 KR 1020107028872 A KR1020107028872 A KR 1020107028872A KR 20107028872 A KR20107028872 A KR 20107028872A KR 101297900 B1 KR101297900 B1 KR 101297900B1
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South Korea
Prior art keywords
polishing composition
weight
silica
polishing
potassium
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Korean (ko)
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KR20110030478A (ko
Inventor
마이클 화이트
제프리 길리랜드
라몬 존스
앨리시아 월터스
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20110030478A publication Critical patent/KR20110030478A/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020107028872A 2008-05-23 2009-05-07 안정한 고속 규소 슬러리 Active KR101297900B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/126,739 US8017524B2 (en) 2008-05-23 2008-05-23 Stable, high rate silicon slurry
US12/126,739 2008-05-23
PCT/US2009/002846 WO2009142692A2 (en) 2008-05-23 2009-05-07 Stable, high rate silicon slurry

Publications (2)

Publication Number Publication Date
KR20110030478A KR20110030478A (ko) 2011-03-23
KR101297900B1 true KR101297900B1 (ko) 2013-08-22

Family

ID=41340714

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028872A Active KR101297900B1 (ko) 2008-05-23 2009-05-07 안정한 고속 규소 슬러리

Country Status (8)

Country Link
US (1) US8017524B2 (enExample)
EP (1) EP2297263B1 (enExample)
JP (1) JP5600100B2 (enExample)
KR (1) KR101297900B1 (enExample)
CN (1) CN102037094B (enExample)
MY (1) MY148323A (enExample)
TW (1) TWI398506B (enExample)
WO (1) WO2009142692A2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8697576B2 (en) * 2009-09-16 2014-04-15 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
US8883034B2 (en) 2009-09-16 2014-11-11 Brian Reiss Composition and method for polishing bulk silicon
US8815110B2 (en) * 2009-09-16 2014-08-26 Cabot Microelectronics Corporation Composition and method for polishing bulk silicon
US8025813B2 (en) * 2009-11-12 2011-09-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
US8491808B2 (en) * 2010-03-16 2013-07-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride
DE112011101518B4 (de) * 2010-04-30 2019-05-09 Sumco Corporation Verfahren zum Polieren von Siliziumwafern
SG192033A1 (en) * 2011-01-21 2013-08-30 Cabot Microelectronics Corp Silicon polishing compositions with improved psd performance
CN102816530B (zh) * 2011-06-08 2016-01-27 安集微电子（上海）有限公司 一种化学机械抛光液
US8795548B1 (en) * 2013-04-11 2014-08-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicon wafer polishing composition and related methods
US8801959B1 (en) * 2013-04-11 2014-08-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable silicon wafer polishing composition and related methods
US9150759B2 (en) * 2013-09-27 2015-10-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing composition for polishing silicon wafers and related methods
JP5985083B2 (ja) * 2014-01-06 2016-09-06 株式会社フジミインコーポレーテッド 研磨用組成物、および半導体ウェハの製造方法
JP2015189829A (ja) * 2014-03-27 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP6357356B2 (ja) * 2014-06-09 2018-07-11 株式会社フジミインコーポレーテッド 研磨用組成物
CN104263249B (zh) * 2014-09-26 2016-06-29 深圳市力合材料有限公司 一种硅溶胶的处理方法
CN104650740B (zh) * 2014-12-10 2017-07-14 深圳市力合材料有限公司 一种可实现快速稳定抛光的抛光液
CN105802509B (zh) * 2014-12-29 2018-10-26 安集微电子（上海）有限公司 一种组合物在阻挡层抛光中的应用
WO2017051770A1 (ja) * 2015-09-25 2017-03-30 山口精研工業株式会社 研磨剤組成物、および磁気ディスク基板の研磨方法
US9534148B1 (en) 2015-12-21 2017-01-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
US9803108B1 (en) 2016-10-19 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous compositions of stabilized aminosilane group containing silica particles
US20190185713A1 (en) * 2017-12-14 2019-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp slurry compositions containing silica with trimethylsulfoxonium cations
JP7157651B2 (ja) * 2017-12-27 2022-10-20 ニッタ・デュポン株式会社 研磨用組成物
KR102003441B1 (ko) * 2018-06-12 2019-07-24 주식회사 동진쎄미켐 화학-기계적 연마 슬러리 조성물
US11472984B1 (en) 2021-09-27 2022-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of enhancing the removal rate of polysilicon
CN115926629B (zh) * 2022-12-30 2023-12-05 昂士特科技(深圳)有限公司 具有改进再循环性能的化学机械抛光组合物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000006327A (ko) * 1998-06-22 2000-01-25 고시야마 이사무 연마조성물및표면처리조성물
KR20060044389A (ko) * 2004-03-19 2006-05-16 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마방법

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US4169337A (en) * 1978-03-30 1979-10-02 Nalco Chemical Company Process for polishing semi-conductor materials
US4462188A (en) * 1982-06-21 1984-07-31 Nalco Chemical Company Silica sol compositions for polishing silicon wafers
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
JPS6230333A (ja) * 1985-05-20 1987-02-09 ナルコ　ケミカル　カンパニ− シリコンウエ−ハの研磨方法及び組成物
US5230833A (en) * 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
DE69108546T2 (de) * 1991-05-28 1995-11-30 Rodel Inc Polierbreie aus Silika mit geringem Gehalt an Natrium und an Metallen.
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (ja) 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5571373A (en) * 1994-05-18 1996-11-05 Memc Electronic Materials, Inc. Method of rough polishing semiconductor wafers to reduce surface roughness
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
MY133700A (en) * 1996-05-15 2007-11-30 Kobe Steel Ltd Polishing fluid composition and polishing method
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
JP4163785B2 (ja) * 1998-04-24 2008-10-08 スピードファム株式会社 研磨用組成物及び研磨加工方法
JPH11349925A (ja) * 1998-06-05 1999-12-21 Fujimi Inc エッジポリッシング用組成物
JP4151179B2 (ja) * 1999-11-22 2008-09-17 Ｊｓｒ株式会社 複合粒子の製造方法及びこの方法により製造される複合粒子並びに複合粒子を含有する化学機械研磨用水系分散体
KR100400030B1 (ko) * 2000-06-05 2003-09-29 삼성전자주식회사 금속막의 화학 및 기계적 연마용 슬러리 및 그 제조방법과상기 슬러리를 이용한 반도체 소자의 금속 배선 형성 방법
JP3440419B2 (ja) * 2001-02-02 2003-08-25 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
US20040132308A1 (en) * 2001-10-24 2004-07-08 Psiloquest, Inc. Corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces
KR100497608B1 (ko) * 2002-08-05 2005-07-01 삼성전자주식회사 슬러리 조성물 및 이의 제조 방법과 이를 사용한 연마 방법
JP2004128069A (ja) * 2002-09-30 2004-04-22 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
JP4593064B2 (ja) * 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US7005382B2 (en) * 2002-10-31 2006-02-28 Jsr Corporation Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
CN100440445C (zh) * 2002-11-08 2008-12-03 福吉米株式会社 抛光组合物和清洗组合物
JP2004273547A (ja) 2003-03-05 2004-09-30 Kao Corp 研磨速度選択比向上剤
EP1628334A4 (en) * 2003-05-09 2006-08-02 Sanyo Chemical Ind Ltd POLISHING LIQUID FOR A CMP PROCESS AND POLISHING METHOD
JP2005038924A (ja) * 2003-07-16 2005-02-10 Sanyo Chem Ind Ltd Ｃｍｐプロセス用研磨液
WO2005012451A2 (en) * 2003-07-30 2005-02-10 Climax Engineered Materials, Llc Slurries and methods for chemical-mechanical planarization of copper
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
US7153335B2 (en) * 2003-10-10 2006-12-26 Dupont Air Products Nanomaterials Llc Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole
JP2005268667A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
DE102005039896A1 (de) * 2004-08-24 2006-03-02 Disco Corporation Polierflüssigkeit
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP2007129167A (ja) * 2005-11-07 2007-05-24 Fujifilm Corp 金属用研磨液
JP2007201012A (ja) * 2006-01-24 2007-08-09 Fujifilm Corp 金属用研磨液
JP2007214205A (ja) * 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
KR20070088245A (ko) * 2006-02-24 2007-08-29 후지필름 가부시키가이샤 금속용 연마액
JP2007234852A (ja) * 2006-03-01 2007-09-13 Fujifilm Corp 研磨方法
WO2007130350A1 (en) 2006-05-02 2007-11-15 Cabot Microelectronics Corporation Compositions and methods for cmp of semiconductor materials
US20080148652A1 (en) * 2006-12-21 2008-06-26 Junaid Ahmed Siddiqui Compositions for chemical mechanical planarization of copper
JP5357396B2 (ja) * 2007-01-31 2013-12-04 ニッタ・ハース株式会社 研磨組成物用添加剤および研磨組成物の使用方法
US7678605B2 (en) * 2007-08-30 2010-03-16 Dupont Air Products Nanomaterials Llc Method for chemical mechanical planarization of chalcogenide materials
US7915071B2 (en) * 2007-08-30 2011-03-29 Dupont Air Products Nanomaterials, Llc Method for chemical mechanical planarization of chalcogenide materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000006327A (ko) * 1998-06-22 2000-01-25 고시야마 이사무 연마조성물및표면처리조성물
KR20060044389A (ko) * 2004-03-19 2006-05-16 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마방법

Also Published As

Publication number Publication date
MY148323A (en) 2013-03-29
TW201009058A (en) 2010-03-01
JP5600100B2 (ja) 2014-10-01
WO2009142692A3 (en) 2010-02-18
KR20110030478A (ko) 2011-03-23
EP2297263A4 (en) 2011-11-30
EP2297263B1 (en) 2017-03-22
EP2297263A2 (en) 2011-03-23
CN102037094B (zh) 2013-07-31
US20090291559A1 (en) 2009-11-26
JP2011523207A (ja) 2011-08-04
TWI398506B (zh) 2013-06-11
US8017524B2 (en) 2011-09-13
CN102037094A (zh) 2011-04-27
WO2009142692A2 (en) 2009-11-26

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