JP2019163457A5 - - Google Patents
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- Publication number
- JP2019163457A5 JP2019163457A5 JP2019044731A JP2019044731A JP2019163457A5 JP 2019163457 A5 JP2019163457 A5 JP 2019163457A5 JP 2019044731 A JP2019044731 A JP 2019044731A JP 2019044731 A JP2019044731 A JP 2019044731A JP 2019163457 A5 JP2019163457 A5 JP 2019163457A5
- Authority
- JP
- Japan
- Prior art keywords
- mechanical polishing
- chemical mechanical
- weight
- formula
- polishing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 18
- 239000000126 substance Substances 0.000 claims 18
- 239000000203 mixture Chemical class 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 9
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000006061 abrasive grain Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 229910052783 alkali metal Inorganic materials 0.000 claims 5
- 150000001340 alkali metals Chemical class 0.000 claims 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 3
- 150000001450 anions Chemical class 0.000 claims 3
- 150000004820 halides Chemical class 0.000 claims 3
- 229910017604 nitric acid Inorganic materials 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical class [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 2
- 150000003863 ammonium salts Chemical class 0.000 claims 2
- 229910017053 inorganic salt Inorganic materials 0.000 claims 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 claims 1
- 229920000388 Polyphosphate Polymers 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- -1 acetate anions Chemical class 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims 1
- 239000008119 colloidal silica Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 claims 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims 1
- 235000011180 diphosphates Nutrition 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 150000004679 hydroxides Chemical class 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 235000011007 phosphoric acid Nutrition 0.000 claims 1
- 239000001205 polyphosphate Substances 0.000 claims 1
- 235000011176 polyphosphates Nutrition 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 239000001226 triphosphate Substances 0.000 claims 1
- 235000011178 triphosphate Nutrition 0.000 claims 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/922,054 | 2018-03-15 | ||
| US15/922,054 US10683439B2 (en) | 2018-03-15 | 2018-03-15 | Polishing composition and method of polishing a substrate having enhanced defect inhibition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019163457A JP2019163457A (ja) | 2019-09-26 |
| JP2019163457A5 true JP2019163457A5 (enExample) | 2022-03-07 |
| JP7359554B2 JP7359554B2 (ja) | 2023-10-11 |
Family
ID=67905197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019044731A Active JP7359554B2 (ja) | 2018-03-15 | 2019-03-12 | 欠陥抑制を向上させた研磨組成物及び基板の研磨方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10683439B2 (enExample) |
| JP (1) | JP7359554B2 (enExample) |
| KR (1) | KR102762648B1 (enExample) |
| CN (1) | CN110283532B (enExample) |
| TW (1) | TWI820091B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12291655B2 (en) * | 2021-04-27 | 2025-05-06 | DuPont Electronic Materials Holding, Inc. | Polishing composition and method of polishing a substrate having enhanced defect reduction |
| US11274230B1 (en) * | 2021-04-27 | 2022-03-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing composition and method of polishing a substrate having enhanced defect inhibition |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5139571A (en) | 1991-04-24 | 1992-08-18 | Motorola, Inc. | Non-contaminating wafer polishing slurry |
| KR100822236B1 (ko) * | 2000-11-30 | 2008-04-16 | 토소가부시키가이샤 | 레지스트 박리제 |
| JP3440419B2 (ja) | 2001-02-02 | 2003-08-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| TW200424299A (en) | 2002-12-26 | 2004-11-16 | Kao Corp | Polishing composition |
| JP2004247542A (ja) * | 2003-02-14 | 2004-09-02 | Kao Corp | 精密部品用基板の製造方法 |
| JP4608856B2 (ja) * | 2003-07-24 | 2011-01-12 | 信越半導体株式会社 | ウエーハの研磨方法 |
| US7018560B2 (en) | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
| US7300480B2 (en) | 2003-09-25 | 2007-11-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate barrier polishing composition |
| JP4974447B2 (ja) | 2003-11-26 | 2012-07-11 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP2005268665A (ja) | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| US7446046B2 (en) | 2005-01-06 | 2008-11-04 | Intel Corporation | Selective polish for fabricating electronic devices |
| KR101134590B1 (ko) * | 2005-03-28 | 2012-04-09 | 삼성코닝정밀소재 주식회사 | 분산 안정성이 우수한 연마 슬러리의 제조방법 |
| US7452481B2 (en) * | 2005-05-16 | 2008-11-18 | Kabushiki Kaisha Kobe Seiko Sho | Polishing slurry and method of reclaiming wafers |
| KR101395542B1 (ko) | 2006-05-02 | 2014-05-14 | 캐보트 마이크로일렉트로닉스 코포레이션 | 반도체 물질의 ｃｍｐ를 위한 조성물 및 방법 |
| US20080020680A1 (en) * | 2006-07-24 | 2008-01-24 | Cabot Microelectronics Corporation | Rate-enhanced CMP compositions for dielectric films |
| TW200817497A (en) * | 2006-08-14 | 2008-04-16 | Nippon Chemical Ind | Polishing composition for semiconductor wafer, production method thereof, and polishing method |
| US8026201B2 (en) * | 2007-01-03 | 2011-09-27 | Az Electronic Materials Usa Corp. | Stripper for coating layer |
| JP5275595B2 (ja) * | 2007-08-29 | 2013-08-28 | 日本化学工業株式会社 | 半導体ウエハ研磨用組成物および研磨方法 |
| US8431490B2 (en) * | 2010-03-31 | 2013-04-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal |
| JP6250454B2 (ja) * | 2014-03-27 | 2017-12-20 | 株式会社フジミインコーポレーテッド | シリコン材料研磨用組成物 |
| US9305794B2 (en) * | 2014-04-07 | 2016-04-05 | Macronix International Co., Ltd. | Etching method and etching composition |
| JP6174625B2 (ja) * | 2015-05-22 | 2017-08-02 | 株式会社フジミインコーポレーテッド | 研磨方法及び組成調整剤 |
-
2018
- 2018-03-15 US US15/922,054 patent/US10683439B2/en active Active
-
2019
- 2019-03-05 TW TW108107203A patent/TWI820091B/zh active
- 2019-03-12 JP JP2019044731A patent/JP7359554B2/ja active Active
- 2019-03-13 CN CN201910191269.5A patent/CN110283532B/zh active Active
- 2019-03-13 KR KR1020190028590A patent/KR102762648B1/ko active Active
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