JP2014529183A5 - - Google Patents
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- Publication number
- JP2014529183A5 JP2014529183A5 JP2014523427A JP2014523427A JP2014529183A5 JP 2014529183 A5 JP2014529183 A5 JP 2014529183A5 JP 2014523427 A JP2014523427 A JP 2014523427A JP 2014523427 A JP2014523427 A JP 2014523427A JP 2014529183 A5 JP2014529183 A5 JP 2014529183A5
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- amino
- heterocyclic
- optionally substituted
- hydroxyalkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000000217 alkyl group Chemical group 0.000 claims 18
- 238000000034 method Methods 0.000 claims 14
- 125000002877 alkyl aryl group Chemical group 0.000 claims 12
- 125000003710 aryl alkyl group Chemical group 0.000 claims 12
- 125000003118 aryl group Chemical group 0.000 claims 12
- 125000000623 heterocyclic group Chemical group 0.000 claims 12
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 10
- 239000000203 mixture Substances 0.000 claims 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 10
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 10
- 150000003839 salts Chemical class 0.000 claims 9
- 239000001257 hydrogen Substances 0.000 claims 8
- 229910052739 hydrogen Inorganic materials 0.000 claims 8
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 8
- 150000002894 organic compounds Chemical class 0.000 claims 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 6
- 125000004181 carboxyalkyl group Chemical group 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 6
- 229910052732 germanium Inorganic materials 0.000 claims 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 6
- 125000005842 heteroatom Chemical group 0.000 claims 6
- 229910052757 nitrogen Inorganic materials 0.000 claims 6
- 239000001301 oxygen Substances 0.000 claims 6
- 229910052760 oxygen Inorganic materials 0.000 claims 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 5
- 150000001735 carboxylic acids Chemical class 0.000 claims 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 5
- 238000005498 polishing Methods 0.000 claims 5
- 239000000126 substance Substances 0.000 claims 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 4
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 4
- 125000003545 alkoxy group Chemical group 0.000 claims 4
- 125000003277 amino group Chemical group 0.000 claims 4
- 125000004103 aminoalkyl group Chemical group 0.000 claims 4
- 125000002837 carbocyclic group Chemical group 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 229920006395 saturated elastomer Polymers 0.000 claims 4
- 208000012868 Overgrowth Diseases 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 3
- 125000002947 alkylene group Chemical group 0.000 claims 3
- 239000012736 aqueous medium Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 125000004648 C2-C8 alkenyl group Chemical group 0.000 claims 2
- 125000004649 C2-C8 alkynyl group Chemical group 0.000 claims 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 2
- 150000001450 anions Chemical class 0.000 claims 2
- 150000007942 carboxylates Chemical class 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- 125000001841 imino group Chemical group [H]N=* 0.000 claims 2
- 239000010954 inorganic particle Substances 0.000 claims 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 2
- 150000002892 organic cations Chemical class 0.000 claims 2
- 239000011146 organic particle Substances 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims 1
- 150000001414 amino alcohols Chemical class 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- -1 nitrogen-containing heterocyclic compound Chemical class 0.000 claims 1
- SBOJXQVPLKSXOG-UHFFFAOYSA-N o-amino-hydroxylamine Chemical compound NON SBOJXQVPLKSXOG-UHFFFAOYSA-N 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161513694P | 2011-08-01 | 2011-08-01 | |
| US61/513694 | 2011-08-01 | ||
| PCT/IB2012/053877 WO2013018015A2 (en) | 2011-08-01 | 2012-07-30 | A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING OF ELEMENTAL GERMANIUM AND/OR Si1-XGeX MATERIAL IN THE PRESENCE OF A CMP COMPOSITION COMPRISING A SPECIFIC ORGANIC COMPOUND |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014529183A JP2014529183A (ja) | 2014-10-30 |
| JP2014529183A5 true JP2014529183A5 (enExample) | 2015-09-10 |
Family
ID=47629744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014523427A Pending JP2014529183A (ja) | 2011-08-01 | 2012-07-30 | 特定の有機化合物を含む化学機械研磨用組成物の存在下での元素ゲルマニウムおよび／またはＳｉ１−ｘＧｅｘ材料の化学機械研磨を含む、半導体デバイスを製造するための方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9443739B2 (enExample) |
| EP (1) | EP2742103B1 (enExample) |
| JP (1) | JP2014529183A (enExample) |
| KR (1) | KR20140059216A (enExample) |
| CN (1) | CN103827235B (enExample) |
| RU (1) | RU2605941C2 (enExample) |
| TW (1) | TWI548728B (enExample) |
| WO (1) | WO2013018015A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG191877A1 (en) * | 2011-01-25 | 2013-08-30 | Hitachi Chemical Co Ltd | Cmp polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material |
| WO2013077369A1 (ja) * | 2011-11-25 | 2013-05-30 | 株式会社 フジミインコーポレーテッド | 研磨用組成物 |
| JP6139975B2 (ja) * | 2013-05-15 | 2017-05-31 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| SG11201509227PA (en) * | 2013-05-15 | 2015-12-30 | Basf Se | Chemical-mechanical polishing compositions comprising n,n,n',n'-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid |
| EP2810997A1 (en) | 2013-06-05 | 2014-12-10 | Basf Se | A chemical mechanical polishing (cmp) composition |
| KR101842033B1 (ko) * | 2014-01-06 | 2018-03-26 | 한화테크윈 주식회사 | 그래핀 제조용 조성물 및 이를 이용한 그래핀의 제조 방법 |
| JP6436638B2 (ja) * | 2014-03-27 | 2018-12-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6094541B2 (ja) * | 2014-07-28 | 2017-03-15 | 信越半導体株式会社 | ゲルマニウムウェーハの研磨方法 |
| US20160053381A1 (en) * | 2014-08-22 | 2016-02-25 | Cabot Microelectronics Corporation | Germanium chemical mechanical polishing |
| US9530655B2 (en) * | 2014-09-08 | 2016-12-27 | Taiwan Semiconductor Manufacting Company, Ltd. | Slurry composition for chemical mechanical polishing of Ge-based materials and devices |
| US9431261B2 (en) * | 2014-12-01 | 2016-08-30 | The Boeing Company | Removal of defects by in-situ etching during chemical-mechanical polishing processing |
| US10227506B2 (en) | 2014-12-16 | 2019-03-12 | Basf Se | Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium |
| US9916985B2 (en) | 2015-10-14 | 2018-03-13 | International Business Machines Corporation | Indium phosphide smoothing and chemical mechanical planarization processes |
| US9646842B1 (en) | 2015-10-14 | 2017-05-09 | International Business Machines Corporation | Germanium smoothing and chemical mechanical planarization processes |
| US9646841B1 (en) | 2015-10-14 | 2017-05-09 | International Business Machines Corporation | Group III arsenide material smoothing and chemical mechanical planarization processes |
| KR102640734B1 (ko) * | 2015-12-24 | 2024-02-27 | 솔브레인 주식회사 | 유기막 연마용 슬러리 조성물 및 이를 이용한 반도체 기판 연마 방법 |
| KR102462501B1 (ko) | 2016-01-15 | 2022-11-02 | 삼성전자주식회사 | 슬러리 조성물을 이용하는 집적회로 소자의 제조 방법 |
| CN109476954B (zh) * | 2016-08-26 | 2021-07-23 | 福禄公司 | 选择性硅石抛光的浆料组合物和方法 |
| US10600655B2 (en) * | 2017-08-10 | 2020-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| JP2021089906A (ja) * | 2018-03-22 | 2021-06-10 | 株式会社フジミインコーポレーテッド | ゲルマニウム溶解抑制剤 |
| US11697183B2 (en) | 2018-07-26 | 2023-07-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fabrication of a polishing pad for chemical mechanical polishing |
| US10920105B2 (en) | 2018-07-27 | 2021-02-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Materials and methods for chemical mechanical polishing of ruthenium-containing materials |
| KR102886739B1 (ko) | 2019-02-11 | 2025-11-17 | 삼성전자주식회사 | 연마 조성물 및 이를 사용한 반도체 소자 제조 방법 |
| EP4490772A4 (en) * | 2022-03-10 | 2025-06-25 | FUJIFILM Electronic Materials U.S.A, Inc. | ETCHING COMPOSITIONS |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3429080A (en) * | 1966-05-02 | 1969-02-25 | Tizon Chem Corp | Composition for polishing crystalline silicon and germanium and process |
| US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
| US5897375A (en) | 1997-10-20 | 1999-04-27 | Motorola, Inc. | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
| US20020197935A1 (en) * | 2000-02-14 | 2002-12-26 | Mueller Brian L. | Method of polishing a substrate |
| JP3958687B2 (ja) * | 2000-12-22 | 2007-08-15 | エア プロダクツ アンド ケミカルズ インコーポレイテッド | 酸化剤および錯体化合物を備える組成物 |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| CN1849379B (zh) * | 2003-07-11 | 2011-12-14 | 格雷斯公司 | 用于化学机械抛光的磨料颗粒 |
| JP4759298B2 (ja) | 2005-03-30 | 2011-08-31 | 株式会社フジミインコーポレーテッド | 単結晶表面用の研磨剤及び研磨方法 |
| JP4749775B2 (ja) * | 2005-06-23 | 2011-08-17 | 山口精研工業株式会社 | ウェーハ研磨液組成物及びウェーハ研磨方法 |
| US7897061B2 (en) * | 2006-02-01 | 2011-03-01 | Cabot Microelectronics Corporation | Compositions and methods for CMP of phase change alloys |
| DE102007019565A1 (de) | 2007-04-25 | 2008-09-04 | Siltronic Ag | Verfahren zum einseitigen Polieren von Halbleiterscheiben und Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht |
| US20090001339A1 (en) | 2007-06-29 | 2009-01-01 | Tae Young Lee | Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same |
| MY155239A (en) * | 2007-07-26 | 2015-09-30 | Cabot Microelectronics Corp | Compositions and methods for chemical-mechanical polishing of phase change materials |
| US7678605B2 (en) | 2007-08-30 | 2010-03-16 | Dupont Air Products Nanomaterials Llc | Method for chemical mechanical planarization of chalcogenide materials |
| US7915071B2 (en) * | 2007-08-30 | 2011-03-29 | Dupont Air Products Nanomaterials, Llc | Method for chemical mechanical planarization of chalcogenide materials |
| FR2932108B1 (fr) * | 2008-06-10 | 2019-07-05 | Soitec | Polissage de couches de germanium |
| DE102008059044B4 (de) | 2008-11-26 | 2013-08-22 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht |
| JP5481166B2 (ja) * | 2009-11-11 | 2014-04-23 | 株式会社クラレ | 化学的機械的研磨用スラリー |
-
2012
- 2012-07-30 US US14/236,539 patent/US9443739B2/en not_active Expired - Fee Related
- 2012-07-30 CN CN201280038321.XA patent/CN103827235B/zh not_active Expired - Fee Related
- 2012-07-30 RU RU2014107763/05A patent/RU2605941C2/ru not_active IP Right Cessation
- 2012-07-30 WO PCT/IB2012/053877 patent/WO2013018015A2/en not_active Ceased
- 2012-07-30 KR KR1020147005585A patent/KR20140059216A/ko not_active Ceased
- 2012-07-30 TW TW101127387A patent/TWI548728B/zh active
- 2012-07-30 EP EP12819882.7A patent/EP2742103B1/en not_active Not-in-force
- 2012-07-30 JP JP2014523427A patent/JP2014529183A/ja active Pending
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