JP2011513983A5 - - Google Patents

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JP2011513983A5
JP2011513983A5 JP2010549242A JP2010549242A JP2011513983A5 JP 2011513983 A5 JP2011513983 A5 JP 2011513983A5 JP 2010549242 A JP2010549242 A JP 2010549242A JP 2010549242 A JP2010549242 A JP 2010549242A JP 2011513983 A5 JP2011513983 A5 JP 2011513983A5
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metal
gas
recess
substrate
containing wetting
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JP2010549242A
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JP2011513983A (ja
JP5702154B2 (ja
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JP2010549242A 2008-03-07 2009-03-05 滑らかで凝集しないＣｕシード層を用いた気泡の存在しない凹部のＣｕ充填体 Active JP5702154B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/044,191 2008-03-07
US12/044,191 US8247030B2 (en) 2008-03-07 2008-03-07 Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer
PCT/IB2009/050910 WO2009109934A1 (en) 2008-03-07 2009-03-05 Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer

Publications (3)

Publication Number Publication Date
JP2011513983A JP2011513983A (ja) 2011-04-28
JP2011513983A5 true JP2011513983A5 (enExample) 2012-04-19
JP5702154B2 JP5702154B2 (ja) 2015-04-15

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JP2010549242A Active JP5702154B2 (ja) 2008-03-07 2009-03-05 滑らかで凝集しないＣｕシード層を用いた気泡の存在しない凹部のＣｕ充填体

Country Status (6)

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US (1) US8247030B2 (enExample)
JP (1) JP5702154B2 (enExample)
KR (1) KR101553424B1 (enExample)
CN (1) CN101965636A (enExample)
TW (1) TWI545653B (enExample)
WO (1) WO2009109934A1 (enExample)

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