JP6013901B2 - Cu配線の形成方法 - Google Patents
Cu配線の形成方法 Download PDFInfo
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Description
まず、Cu配線の形成方法の一実施形態について図1のフローチャートおよび図2の工程断面図を参照して説明する。
TaAlN膜からなるバリア膜204は上述したように、熱ALDまたは熱CVDにより成膜する。
従来のバリア膜であるPVDによるTaN膜は、非晶質であり結晶粒界が存在しないため高いバリア性を有する。しかし、TaN膜をALDで成膜すると膜が結晶化するため、結晶粒界の存在によりバリア性が低下してしまう。そこで、TaNの良好な膜質を維持したまま、ALDやCVDで形成してバリア性の高い非晶質となるように、TaN膜中にTaと結晶の大きさが異なるAlを添加して、TaAlN膜とした。
ここでは、Si基板上に表1に示す種々のTaAlN膜を形成し、その上にiPVDによるCu膜を50nm成膜し、その後、Ar/H2雰囲気にて400℃で60minのアニールを行ってサンプルを作成し、それらサンプルの表面状態からバリア性を把握した。TaAlN膜としては、表1に示すように、TaNの供給サイクルとAlNの供給サイクルの比TaN:AlNを1:1〜8:1で変化させ、ターゲット膜厚を1nm、2nmと変化させ、プリAlN、プラズマ処理のいずれかを行ったもの、およびいずれも行わなかったものを形成した。プリAlNは、先にAlN単位膜を形成し、その後TaN単位膜を形成したものであり、プリAlN以外は、TaN単位膜を形成した後にAlN膜を形成したものである。またプラズマ処理については、TaAlN膜の成膜が完了した後に、Arプラズマによる処理を行った。
RuはCuに対する濡れ性が高いため、Cuの下地にRuライナー膜を形成することにより、次のiPVDによるCu膜形成の際に、良好なCuの移動性を確保することができ、トレンチやホールの間口を塞ぐオーバーハングを生じ難くすることができる。このため、微細なトレンチまたはホールにもボイドを発生させずに確実にCuを埋め込むことができる。
Cu膜206は、PVDにより成膜されるが、上述したように、iPVD、例えばプラズマスパッタを用いることが好ましい。
次に、本発明の実施形態に係るCu配線の形成方法の実施に好適な成膜システムについて説明する。図8は本発明の実施形態に係るCu配線の形成方法の実施に好適なマルチチャンバタイプの成膜システムの一例を示す平面図である。
次に、Cu膜を形成する第1のCu膜成膜装置22a,22bの好適な例について説明する。
図9は、第1のCu膜成膜装置の一例を示す断面図である。なお、第2のCu膜成膜装置も同様に構成されている。
次に、バリア膜を形成するためのバリア膜成膜装置12a(12b)について説明する。図10は、バリア膜成膜装置12a(12b)の一例を示す断面図であり、熱ALDによりTaAlN膜を形成するものである。なお、熱CVDによっても成膜可能である。
次に、Ruライナー膜を形成するためのRuライナー膜成膜装置14a(14b)について説明する。Ruライナー膜は熱CVDにより好適に形成することができる。図11は、Ruライナー膜成膜装置の一例を示す断面図であり、熱CVDによりRu膜を形成するものである。
以上の成膜システム1により上記実施形態におけるCu膜の形成(積み増し部の形成)までを行うことができるが、それ以降のアニール工程、CMP工程、キャップ層成膜工程は、成膜システム1から搬出した後のウエハWに対し、アニール装置、CMP装置、キャップ層成膜装置を用いて行うことができる。なお、アニール工程を成膜システム1のいずれかのモジュールで行うようにすることもできる。これらの装置は、通常用いられる構成のものでよい。これら装置と成膜システム1とでCu配線形成システムを構成し、制御部40と同じ機能を有する共通の制御部により一括して制御するようにすることにより、上記実施形態に示された方法を一つのレシピにより一括して制御することができる。
以上、本発明の実施形態について説明したが、本発明は上記実施形態に限定されることなく種々変形可能である。例えば、成膜システムとしては、図8のようなタイプに限らず、一つの搬送装置に全ての成膜装置が接続されているタイプであってもよい。また、図8のようなマルチチャンバタイプのシステムではなく、バリア膜、Ruライナー膜、Cu膜のうち、一部のみを同一の成膜システムで形成し、残部を別個に設けた装置により大気暴露を経て成膜するようにしてもよいし、全てを別個の装置で大気暴露を経て成膜するようにしてもよい。
12a,12b;バリア膜成膜装置
14a,14b;Ruライナー膜成膜装置
22a,22b;Cu膜成膜装置
201;下部構造
202;層間絶縁膜
203;トレンチ
204;バリア膜
205;Ruライナー膜
206;Cu膜
208;Cu配線
W;半導体ウエハ(被処理基板)
Claims (11)
- 表面に所定パターンの凹部が形成された基板に対し、前記凹部を埋めるCu配線を形成するCu配線の形成方法であって、
少なくとも前記凹部の表面に、熱ALDにより非晶質バリア膜を形成する工程と、
Cu膜を形成して前記凹部内に前記Cu膜を埋め込む工程と、
CMPにより全面を研磨して前記凹部内にCu配線を形成する工程と
を有し、
前記非晶質バリア膜はTaAlN膜であり、該TaAlN膜を形成する場合に、
処理容器内にTa原料であるTa化合物を供給して基板に吸着させる工程と、前記処理容器内をパージする工程と、吸着した前記Ta化合物を窒化・還元してTaNとする工程と、前記処理容器内をパージする工程とのサイクルを所定回有するTaN単位膜形成段階と、
処理容器内にAl原料であるAl化合物を供給して基板に吸着させる工程と、前記処理容器内をパージする工程と、吸着した前記Al化合物を窒化・還元してAlNとする工程と、前記処理容器内をパージする工程とのサイクルを所定回有するAlN単位膜形成段階と、
前記TaN単位膜形成段階と前記AlN単位膜形成段階の間、または前記AlN単位膜形成段階の後に、前記TaAlN膜の成膜中の膜に対しイオン衝撃を与えて改質するプラズマ処理段階と、
を有し、
前記TaN単位膜形成段階における前記サイクルと、前記AlN単位膜形成段階における前記サイクルとの比を、膜中のTa:Alが原子数比で所定の値となるように設定し、
前記TaN単位膜形成段階、前記AlN単位膜形成段階、および前記プラズマ処理段階の一連を所定回繰り返すことを特徴とするCu配線の形成方法。 - 前記非晶質バリア膜を成膜した後、前記Cu膜を形成する前に、Ru膜を形成する工程をさらに有することを特徴とする請求項1に記載のCu配線の形成方法。
- 前記Ru膜は、CVDにより形成されることを特徴とする請求項2に記載のCu配線の形成方法。
- 前記プラズマは、基板を載置する載置台に高周波電力を印加することにより形成されることを特徴とする請求項1から請求項3のいずれか1項に記載のCu配線の形成方法。
- 前記プラズマはアルゴンプラズマであることを特徴とする請求項1から請求項4のいずれか1項に記載のCu配線の形成方法。
- 前記TaAlN膜を形成する場合に、前記TaN単位膜形成段階における前記サイクルの回数を4〜8回とし、前記AlN単位膜形成段階における前記サイクルの回数を1回とすることを特徴とする請求項1から請求項5のいずれか1項に記載のCu配線の形成方法。
- 前記TaAlN膜の成膜の最初にAl原料を基板に吸着させることを特徴とする請求項1から請求項6のいずれか1項に記載のCu配線の形成方法。
- 前記非晶質バリア膜を構成するTaAlN膜の厚さは2nm以下であることを特徴とする請求項1から請求項7のいずれか1項に記載のCu配線の形成方法。
- 前記Cu膜は、PVDにより形成されることを特徴とする請求項1から請求項8のいずれか1項に記載のCu配線の形成方法。
- 前記Cu膜の形成は、基板が収容された処理容器内にプラズマ生成ガスによりプラズマを生成し、Cuターゲットから粒子を飛翔させて、粒子を前記プラズマ中でイオン化させ、前記基板にバイアス電力を印加してイオンを基板上に引きこむ装置により行われることを特徴とする請求項9に記載のCu配線の形成方法。
- コンピュータ上で動作し、Cu配線形成システムを制御するためのプログラムが記憶された記憶媒体であって、前記プログラムは、実行時に、請求項1から請求項10のいずれかのCu配線の形成方法が行われるように、コンピュータに前記Cu配線形成システムを制御させることを特徴とする記憶媒体。
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