JP2011505690A - プリント回路基板及びその製造方法並びにプリント回路基板製造用のパネル - Google Patents
プリント回路基板及びその製造方法並びにプリント回路基板製造用のパネル Download PDFInfo
- Publication number
- JP2011505690A JP2011505690A JP2010535890A JP2010535890A JP2011505690A JP 2011505690 A JP2011505690 A JP 2011505690A JP 2010535890 A JP2010535890 A JP 2010535890A JP 2010535890 A JP2010535890 A JP 2010535890A JP 2011505690 A JP2011505690 A JP 2011505690A
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- Prior art keywords
- printed circuit
- circuit board
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- manufacturing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 claims description 22
- 239000011241 protective layer Substances 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Abstract
【解決手段】本発明のプリント回路基板は、第1領域と第2領域とが定義された絶縁部材110と、第1領域に形成された回路パターン120と、第2領域に形成された支持部材130と、を備える。
【選択図】図1
Description
Claims (19)
- 第1領域と第2領域とが定義された絶縁部材と、
前記第1領域に形成された回路パターンと、
前記第2領域に形成された支持部材と、を備えるプリント回路基板。 - 前記第2領域は、前記第1領域の端部に配置される請求項1に記載のプリント回路基板。
- 前記第2領域は、前記第1領域を囲むようにして配置される請求項1に記載のプリント回路基板。
- 前記支持部材と前記絶縁部材との間に配置された導電パターンをさらに備える請求項1に記載のプリント回路基板。
- 前記支持部材は金属材質を含む請求項4に記載のプリント回路基板。
- 前記支持部材と前記回路パターンとは同一材質からなる請求項1に記載のプリント回路基板。
- 前記支持部材は前記回路パターンより厚く形成される請求項1に記載のプリント回路基板。
- 前記絶縁部材、回路パターン及び支持部材を覆う保護層を含む請求項1に記載のプリント回路基板。
- 前記支持部材は前記絶縁部材の少なくともいずれか一面に形成される請求項1に記載のプリント回路基板。
- 複数の領域に定義される第1領域と、前記第1領域と隣接する第2領域を含むフレームと、
前記第1領域に形成される複数のプリント回路基板と、
前記第2領域に形成される支持部材と、を備えるプリント回路基板製造用のパネル。 - 前記第2領域は前記第1領域を囲むようにして配置される請求項10に記載のプリント回路基板製造用のパネル。
- 前記プリント回路基板には回路パターンが形成され、前記支持部材は前記回路パターンより厚く形成される請求項10に記載のプリント回路基板製造用のパネル。
- 前記支持部材は金属材質からなる請求項10に記載のプリント回路基板製造用のパネル。
- 絶縁部材を準備する段階と、
前記絶縁部材の第1領域に回路パターンを形成する段階と、
前記絶縁部材の第2領域に支持部材を形成する段階と、
を備えるプリント回路基板の製造方法。 - 前記絶縁部材、回路パターン及び支持部材を覆うように保護層を形成する段階をさらに備える請求項14に記載のプリント回路基板の製造方法。
- 前記第2領域に導電パターンを形成する段階をさらに備え、前記支持部材は前記導電パターン上にめっき法により形成される請求項14に記載のプリント回路基板の製造方法。
- 前記支持部材は金属材質からなる請求項14に記載のプリント回路基板の製造方法。
- 前記支持部材は前記回路パターンより厚く形成される請求項14に記載のプリント回路基板の製造方法。
- 前記第2領域は前記第1領域を囲むようにして配置される請求項14に記載のプリント回路基板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070123059A KR20090056077A (ko) | 2007-11-29 | 2007-11-29 | 인쇄회로기판과 그 제조방법 및 인쇄회로기판 제조용 패널 |
KR10-2007-0123059 | 2007-11-29 | ||
PCT/KR2008/007088 WO2009069987A2 (en) | 2007-11-29 | 2008-12-01 | Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011505690A true JP2011505690A (ja) | 2011-02-24 |
JP5426567B2 JP5426567B2 (ja) | 2014-02-26 |
Family
ID=40679164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010535890A Active JP5426567B2 (ja) | 2007-11-29 | 2008-12-01 | プリント回路基板及びその製造方法並びにプリント回路基板製造用のパネル |
Country Status (6)
Country | Link |
---|---|
US (1) | US8426739B2 (ja) |
JP (1) | JP5426567B2 (ja) |
KR (1) | KR20090056077A (ja) |
CN (1) | CN101919319A (ja) |
TW (1) | TWI440407B (ja) |
WO (1) | WO2009069987A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017057553A1 (ja) * | 2015-09-30 | 2017-04-06 | 積水化学工業株式会社 | 積層体 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560454B (en) * | 2014-11-07 | 2016-12-01 | Primax Electronics Ltd | Testing base |
JP7065617B2 (ja) * | 2018-01-12 | 2022-05-12 | 新光電気工業株式会社 | 支持体付基板及びその製造方法 |
CN109275272A (zh) * | 2018-11-27 | 2019-01-25 | 景旺电子科技(龙川)有限公司 | 一种薄pcb板处理方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5667982A (en) * | 1979-11-07 | 1981-06-08 | Tdk Electronics Co Ltd | Printed circuit board and method of manufacturing same |
JPH02148787A (ja) * | 1988-11-29 | 1990-06-07 | Nec Corp | フレキシブルプリント基板シート |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62124571U (ja) * | 1986-01-31 | 1987-08-07 | ||
JP3437369B2 (ja) * | 1996-03-19 | 2003-08-18 | 松下電器産業株式会社 | チップキャリアおよびこれを用いた半導体装置 |
US6020221A (en) * | 1996-12-12 | 2000-02-01 | Lsi Logic Corporation | Process for manufacturing a semiconductor device having a stiffener member |
JPH11214806A (ja) | 1998-01-23 | 1999-08-06 | Nec Saitama Ltd | プリント基板補強構造 |
JP2000164997A (ja) | 1998-11-27 | 2000-06-16 | Denso Corp | プリント基板およびプリント基板への部品実装方法 |
JP3635219B2 (ja) * | 1999-03-11 | 2005-04-06 | 新光電気工業株式会社 | 半導体装置用多層基板及びその製造方法 |
US6204559B1 (en) * | 1999-11-22 | 2001-03-20 | Advanced Semiconductor Engineering, Inc. | Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking |
JP2003209366A (ja) * | 2002-01-15 | 2003-07-25 | Sony Corp | フレキシブル多層配線基板およびその製造方法 |
CN1672475B (zh) * | 2002-06-27 | 2011-11-23 | Ppg工业俄亥俄公司 | 有凹入或伸长分离接头片的单层或多层印刷电路板及其制造方法 |
KR100992637B1 (ko) | 2003-07-24 | 2010-11-05 | 엘지이노텍 주식회사 | 인쇄회로기판 제조용 모재와 그를 사용한 인쇄회로기판의제조방법 |
KR100736633B1 (ko) | 2005-12-19 | 2007-07-06 | 삼성전기주식회사 | 보강 기판 및 제조 방법 |
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2007
- 2007-11-29 KR KR1020070123059A patent/KR20090056077A/ko active Search and Examination
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- 2008-11-28 TW TW097146120A patent/TWI440407B/zh active
- 2008-12-01 JP JP2010535890A patent/JP5426567B2/ja active Active
- 2008-12-01 WO PCT/KR2008/007088 patent/WO2009069987A2/en active Application Filing
- 2008-12-01 US US12/745,667 patent/US8426739B2/en active Active
- 2008-12-01 CN CN2008801236813A patent/CN101919319A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5667982A (en) * | 1979-11-07 | 1981-06-08 | Tdk Electronics Co Ltd | Printed circuit board and method of manufacturing same |
JPH02148787A (ja) * | 1988-11-29 | 1990-06-07 | Nec Corp | フレキシブルプリント基板シート |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017057553A1 (ja) * | 2015-09-30 | 2017-04-06 | 積水化学工業株式会社 | 積層体 |
JPWO2017057553A1 (ja) * | 2015-09-30 | 2017-10-05 | 積水化学工業株式会社 | 積層体 |
US10477671B2 (en) | 2015-09-30 | 2019-11-12 | Sekisui Chemical Co., Ltd. | Laminated body |
Also Published As
Publication number | Publication date |
---|---|
TW200934310A (en) | 2009-08-01 |
US8426739B2 (en) | 2013-04-23 |
JP5426567B2 (ja) | 2014-02-26 |
KR20090056077A (ko) | 2009-06-03 |
CN101919319A (zh) | 2010-12-15 |
TWI440407B (zh) | 2014-06-01 |
US20110036618A1 (en) | 2011-02-17 |
WO2009069987A3 (en) | 2009-08-20 |
WO2009069987A2 (en) | 2009-06-04 |
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