JPWO2017057553A1 - 積層体 - Google Patents
積層体 Download PDFInfo
- Publication number
- JPWO2017057553A1 JPWO2017057553A1 JP2016560838A JP2016560838A JPWO2017057553A1 JP WO2017057553 A1 JPWO2017057553 A1 JP WO2017057553A1 JP 2016560838 A JP2016560838 A JP 2016560838A JP 2016560838 A JP2016560838 A JP 2016560838A JP WO2017057553 A1 JPWO2017057553 A1 JP WO2017057553A1
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- Prior art keywords
- metal material
- resin layer
- insulating resin
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- opposite
- Prior art date
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- 239000011347 resin Substances 0.000 claims abstract description 207
- 239000007769 metal material Substances 0.000 claims abstract description 204
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 42
- 239000011888 foil Substances 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims description 38
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 38
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- 238000010438 heat treatment Methods 0.000 abstract description 23
- 238000001816 cooling Methods 0.000 abstract description 11
- 150000001875 compounds Chemical class 0.000 description 60
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- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 21
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 21
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 21
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 5
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
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- 239000000395 magnesium oxide Substances 0.000 description 3
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- KFUSXMDYOPXKKT-UHFFFAOYSA-N 2-[(2-methylphenoxy)methyl]oxirane Chemical group CC1=CC=CC=C1OCC1OC1 KFUSXMDYOPXKKT-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
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- 229920001577 copolymer Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 238000009413 insulation Methods 0.000 description 2
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- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
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- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
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- SLWOPZBLNKPZCQ-UHFFFAOYSA-N 2-(naphthalen-1-ylmethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1CC1CO1 SLWOPZBLNKPZCQ-UHFFFAOYSA-N 0.000 description 1
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- OCOLKPHPPUVUMZ-UHFFFAOYSA-N 2-[[4-[9-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]-2,6-dimethylphenoxy]methyl]oxirane Chemical compound CC1=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(OCC3OC3)=C(C)C=2)=CC(C)=C1OCC1CO1 OCOLKPHPPUVUMZ-UHFFFAOYSA-N 0.000 description 1
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- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
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- H—ELECTRICITY
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Abstract
Description
上記絶縁樹脂層の材料としては、硬化性化合物(A)及び硬化剤(B)等が挙げられる。上記絶縁樹脂層は、例えば、硬化性化合物及び熱硬化剤を含む硬化性組成物(絶縁樹脂層の材料)の硬化物である。また、上記絶縁樹脂層の材料は、無機フィラー(C)を含むことが好ましい。上記絶縁樹脂層は、無機フィラー(C)を含むことが好ましい。
上記分子量が10000未満である硬化性化合物(A1)としては、環状エーテル基を有する硬化性化合物が挙げられる。上記環状エーテル基としては、エポキシ基及びオキセタニル基等が挙げられる。上記環状エーテル基を有する硬化性化合物は、エポキシ基又はオキセタニル基を有する硬化性化合物であることが好ましい。硬化性化合物(A1)は、1種のみが用いられてもよく、2種以上が併用されてもよい。
硬化性化合物(A2)は、分子量が10000以上である硬化性化合物である。分子量が10000以上である硬化性化合物(A2)は、一般にポリマーであり、上記分子量は、一般に重量平均分子量を意味する。
上記絶縁樹脂層の材料は硬化剤(B)を含むことが好ましい。硬化剤(B)は、1種のみが用いられてもよく、2種以上が併用されてもよい。
無機フィラー(C)の使用により、硬化物の熱伝導性がかなり高くなる。無機フィラー(C)は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記絶縁樹脂層の材料は、上述した成分の他に、分散剤、キレート剤、酸化防止剤等の絶縁樹脂層に一般に用いられる他の成分を含んでいてもよい。
上記金属材の材料としては、アルミニウム、銅、金、及びグラファイトシート等が挙げられる。熱伝導性をより一層良好にする観点からは、上記金属材の材料は、金、銅又はアルミニウムであることが好ましく、銅又はアルミニウムであることがより好ましい。熱伝導性をより一層良好にする観点、並びにエッチング処理された金属材を容易に形成する観点からは、上記金属材は、銅であることがより好ましい。また、上記金属材は、金属箔であることが好ましい。
(1)ビスフェノールA型液状エポキシ樹脂(三菱化学社製「エピコート828US」、Mw=370)
(2)ビスフェノールF型液状エポキシ樹脂(三菱化学社製「エピコート806L」、Mw=370)
(3)ナフタレン型液状エポキシ樹脂(DIC社製「EPICLON HP−4032D」、Mw=304)
(1)エポキシ基含有スチレン樹脂(日油社製「マープルーフG−1010S」、Mw=100,000、Tg=93℃)
(2)ビスフェノールA型フェノキシ樹脂(三菱化学社製「E1256」、Mw=51,000、Tg=98℃)
(1)脂環式骨格酸無水物(新日本理化社製「MH−700」)
(2)ビフェニル骨格フェノール樹脂(明和化成社製「MEH−7851−S」)
(3)イソシアヌル変性固体分散型イミダゾール(イミダゾール系硬化促進剤、四国化成工業社製「2MZA−PW」)
(1)5μmアルミナ(破砕アルミナ、日本軽金属社製「LT300C」、平均粒子径5μm)
(2)窒化ホウ素(三井化学社製「MBN−010T」、平均粒子径0.9μm)
(3)窒化アルミニウム(三井化学社製「MAN−2A」、平均粒子径1.3μm)
(1)エポキシシランカップリング剤(信越化学工業社製「KBE403」)
(1)メチルエチルケトン
ホモディスパー型攪拌機を用い、下記の表1〜3に示す配合成分を下記の表1〜3に示す配合量で配合し、混練し、絶縁材料を調製した。
(1)各層の厚みの測定
得られた積層体について、積層体の断面をマイクロスコープ(キーエンス社製「VHX−5000」)により観察し、計測することにより、各層の厚みを測定した。
得られた積層体を、画像寸法測定器(キーエンス社製「IM−6125」)により観察することにより、表面積を測定した。
シート状の絶縁材料を、180℃で1時間硬化させて、硬化物(絶縁樹脂層)を得た。
シート状の絶縁材料を、180℃で1時間硬化させて、硬化物(絶縁樹脂層)を得た。
シート状の絶縁材料を180℃で1時間硬化させて、硬化物(絶縁樹脂層)を得た。
得られた積層体において、第1の金属材の絶縁樹脂層側とは反対側の表面の算術平均粗さRa、第2の金属材の絶縁樹脂層側とは反対側の表面の算術平均粗さRa、第1の金属材の絶縁樹脂層側の表面の算術平均粗さRa、及び、第2の金属材の絶縁樹脂層側の表面の算術平均粗さRaを測定した。
シート状の絶縁材料を、180℃で1時間硬化させて、硬化物(絶縁樹脂層)を得た。
積層体と同じサイズを有し、60℃に制御されており、かつ平滑な表面を有する発熱体を用意した。得られた積層体を、上記発熱体に1kgfの圧力で押し付け、発熱体の反対面の温度を熱電対により測定することにより、熱抵抗を評価した。熱抵抗を以下の基準に従って判定した。
○○:発熱体と積層体の発熱体側とは反対の表面との温度差が5℃以下
○:発熱体と積層体の発熱体側とは反対の表面との温度差が5℃を超え、10℃以下
△:発熱体と積層体の発熱体側とは反対の表面との温度差が10℃を超え、30℃以下
×:発熱体と積層体の発熱体側とは反対の表面との温度差が30℃を超える
得られた積層体10個をエスペック社製「モデルTSB−51」で−40℃で5分〜+125℃で5分の冷熱サイクル試験を1000回行い、浮き及び剥離の発生を確認することにより、冷熱サイクル後の剥離防止性を評価した。冷熱サイクル後の剥離防止性を以下の基準に従って判定した。
○○:浮き又は剥離の発生なし
○:浮き又は剥離の発生1〜2個
△:浮き又は剥離の発生3〜5個
×:浮き又は剥離の発生6〜10個
11…絶縁樹脂層
12…第1の金属材
13,13A…第2の金属材
Claims (16)
- 絶縁樹脂層と、
金属箔又は金属板である第1の金属材と、
金属箔又は金属板である第2の金属材とを備え、
前記第1の金属材が、前記絶縁樹脂層の第1の表面に積層されており、かつ、前記第2の金属材が、前記絶縁樹脂層の前記第1の表面とは反対の第2の表面に積層されており、
前記絶縁樹脂層の厚みが200μm以下であり、
前記第1の金属材と前記第2の金属材との合計の厚みが200μm以上であり、
前記第1の金属材の厚みの、前記第2の金属材の厚みに対する比が、0.2以上、5以下であり、
前記第1の金属材の前記絶縁樹脂層側とは反対の表面の表面積の、前記第2の金属材の前記絶縁樹脂層側とは反対の表面の表面積に対する比が、0.5以上、2以下である、積層体。 - 前記絶縁樹脂層の線膨張率の、前記第1の金属材の線膨張率に対する比が、0.5以上、2以下であり、
前記絶縁樹脂層の線膨張率の、前記第2の金属材の線膨張率に対する比が、0.5以上、2以下である、請求項1に記載の積層体。 - 前記絶縁樹脂層の25℃での弾性率が1GPa以上、50GPa以下である、請求項1又は2に記載の積層体。
- 前記第1の金属材の側面が、前記絶縁樹脂層側とは反対の表面側に向かうに従って、内側に傾斜している、請求項1〜3のいずれか1項に記載の積層体。
- 前記第2の金属材の側面が、前記絶縁樹脂層側とは反対の表面側に向かうに従って、内側に傾斜している、請求項1〜4のいずれか1項に記載の積層体。
- 前記第1の金属材が回路である、請求項1〜5のいずれか1項に記載の積層体。
- 前記第1の金属材が積層されていない絶縁樹脂層部分が存在し、
前記第1の金属材の前記絶縁樹脂層側とは反対の表面の算術平均粗さRaが2μm以下であり、かつ前記第1の金属材の絶縁樹脂層側の表面の算術平均粗さRaが0.1μm以上である、請求項1〜6のいずれか1項に記載の積層体。 - 前記第1の金属材の前記絶縁樹脂層側とは反対の表面の表面積の、前記第1の金属材の前記絶縁樹脂層側の表面の表面積に対する比が、0.8以上、1.0未満である、請求項1〜7のいずれか1項に記載の積層体。
- 前記第1の金属材が回路であり、
前記第2の金属材が回路である、請求項1〜8のいずれか1項に記載の積層体。 - 前記第2の金属材が積層されていない絶縁樹脂層部分が存在し、
前記第2の金属材の前記絶縁樹脂層側とは反対の表面の算術平均粗さRaが2μm以下であり、かつ前記第2の金属材の絶縁樹脂層側の表面の算術平均粗さRaが0.1μm以上である、請求項1〜9のいずれか1項に記載の積層体。 - 前記第2の金属材の前記絶縁樹脂層側とは反対の表面の表面積の、前記第2の金属材の前記絶縁樹脂層側の表面の表面積に対する比が、0.8以下である、請求項1〜10のいずれか1項に記載の積層体。
- 前記絶縁樹脂層のガラス転移温度が150℃以上である、請求項1〜11のいずれか1項に記載の積層体。
- 前記絶縁樹脂層がプリプレグではない、請求項1〜12のいずれか1項に記載の積層体。
- 前記第1の金属材の前記絶縁樹脂層側とは反対側の表面が露出しているか、又は、前記第1の金属材の前記絶縁樹脂層側とは反対側の表面に保護フィルムが積層されている、請求項1〜13のいずれか1項に記載の積層体。
- 前記第1の金属材の前記絶縁樹脂層側とは反対側の表面が露出している、請求項1〜14のいずれか1項に記載の積層体。
- 前記絶縁樹脂層が、無機フィラーを含む、請求項1〜15のいずれか1項に記載の積層体。
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JP6235733B2 (ja) | 2017-11-22 |
CN113733688A (zh) | 2021-12-03 |
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EP3339021B1 (en) | 2020-05-06 |
EP3339021A4 (en) | 2019-04-24 |
CN113059875A (zh) | 2021-07-02 |
EP3339021A1 (en) | 2018-06-27 |
KR101887337B1 (ko) | 2018-08-09 |
US20180302976A1 (en) | 2018-10-18 |
CN113059875B (zh) | 2023-07-07 |
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TW201729998A (zh) | 2017-09-01 |
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