JPS62124571U - - Google Patents
Info
- Publication number
- JPS62124571U JPS62124571U JP1986013069U JP1306986U JPS62124571U JP S62124571 U JPS62124571 U JP S62124571U JP 1986013069 U JP1986013069 U JP 1986013069U JP 1306986 U JP1306986 U JP 1306986U JP S62124571 U JPS62124571 U JP S62124571U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- attached
- plastic parts
- emulator
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 5
- 239000012779 reinforcing material Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 239000013039 cover film Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0838—Parallel wires, sandwiched between two insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第1図はこの考案による実施例の構成図、第2
図は従来技術によるプローブの外観図、第3図は
ネツク部分2の断面図。 1……フレキシブル基板、2……ネツク部分、
3……接続部、4……コネクタ、5……パターン
、6……ベースフイルム、7……プラスチツク部
分、8……プラスチツク部分、11……補強材、
12……補強材。
図は従来技術によるプローブの外観図、第3図は
ネツク部分2の断面図。 1……フレキシブル基板、2……ネツク部分、
3……接続部、4……コネクタ、5……パターン
、6……ベースフイルム、7……プラスチツク部
分、8……プラスチツク部分、11……補強材、
12……補強材。
補正 昭61.3.10
図面の簡単な説明を次のように補正する。
明細書第6ページ第13行の「……補強材。」
を次のとおり補正する。 「……補強材、13……カバーフイルム。」
を次のとおり補正する。 「……補強材、13……カバーフイルム。」
Claims (1)
- 【実用新案登録請求の範囲】 1 ベースフイルム6の中央部分にパターン5を
設け、両端にプラスチツク部分7,8を形成する
フレキシブル基板1の一端に接続部3を取り付け
るインサーキツトエミユレータ用プローブにおい
て、 プラスチツク部分7,8に補強材を取り付ける
ことを特徴とするインサーキツトエミユレータ用
プローブ。 2 プラスチツク部分7,8の両面に補強材を取
り付ける実用新案登録請求の範囲第1項記載のイ
ンサーキツトエミユレータ用プローブ。 3 プラスチツク部分7,8の片面に補強材を取
り付ける実用新案登録請求の範囲第1項記載のイ
ンサーキツトエミユレータ用プローブ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986013069U JPS62124571U (ja) | 1986-01-31 | 1986-01-31 | |
US07/009,157 US4832621A (en) | 1986-01-31 | 1987-01-30 | Probe for in-circuit emulator |
AU68253/87A AU576982B2 (en) | 1986-01-31 | 1987-02-02 | In-circuit emulator probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986013069U JPS62124571U (ja) | 1986-01-31 | 1986-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62124571U true JPS62124571U (ja) | 1987-08-07 |
Family
ID=11822859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986013069U Pending JPS62124571U (ja) | 1986-01-31 | 1986-01-31 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4832621A (ja) |
JP (1) | JPS62124571U (ja) |
AU (1) | AU576982B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019121616A (ja) * | 2017-12-28 | 2019-07-22 | 日立オートモティブシステムズ株式会社 | 電子回路基板および電子回路装置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62124572U (ja) * | 1986-01-31 | 1987-08-07 | ||
US5073683A (en) * | 1990-06-21 | 1991-12-17 | Hughes Aircraft Company | Edge repair and reinforcement of flexible flat cables |
JPH05313936A (ja) * | 1992-05-08 | 1993-11-26 | Nec Corp | インサーキットエミュレータ |
US5481069A (en) * | 1994-01-03 | 1996-01-02 | International Business Machines Corporation | Ribbon cable with terminal edge reinforcement |
FR2735854B1 (fr) * | 1995-06-22 | 1997-08-01 | Valeo Thermique Moteur Sa | Dispositif de raccordement electrique d'un moto-ventilateur pour un echangeur de chaleur de vehicule automobile |
US5847324A (en) * | 1996-04-01 | 1998-12-08 | International Business Machines Corporation | High performance electrical cable |
DE19914907C1 (de) * | 1999-04-01 | 2000-11-02 | Bosch Gmbh Robert | Leiterfolie |
DE10331710B4 (de) * | 2003-07-11 | 2008-05-08 | W. L. Gore & Associates Gmbh | Bandkabel |
KR100752660B1 (ko) * | 2006-03-31 | 2007-08-29 | 삼성전자주식회사 | 가요성 인쇄회로 및 이를 구비한 하드디스크 드라이브 |
DE102006035695A1 (de) * | 2006-08-01 | 2008-02-14 | Tyco Electronics Amp Gmbh | Elektrisches Flachbandkabel für eine Wickelfeder |
KR20090056077A (ko) * | 2007-11-29 | 2009-06-03 | 엘지전자 주식회사 | 인쇄회로기판과 그 제조방법 및 인쇄회로기판 제조용 패널 |
US7643305B2 (en) * | 2008-03-07 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | System and method of preventing damage to metal traces of flexible printed circuits |
JP2010135418A (ja) | 2008-12-02 | 2010-06-17 | Shinko Electric Ind Co Ltd | 配線基板及び電子部品装置 |
TW201115596A (en) * | 2009-10-23 | 2011-05-01 | Adv Flexible Circuits Co Ltd | Double-side-conducting flexible-circuit flat cable with cluster sections |
WO2014104763A1 (ko) * | 2012-12-27 | 2014-07-03 | 주식회사 레이언스 | 엑스레이 검출 장치 및 시스템 |
CN111656868B (zh) | 2017-12-28 | 2023-09-08 | 日立安斯泰莫株式会社 | 电子控制装置 |
US11596056B2 (en) * | 2018-10-02 | 2023-02-28 | Skyworks Solutions, Inc. | Methods and devices related to reduced packaging substrate deformation |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
US3188601A (en) * | 1962-08-15 | 1965-06-08 | Litton Prec Products Inc | Electrical connector for tape-like electrical cable |
GB1040871A (en) * | 1964-05-04 | 1966-09-01 | Midland Silicones Ltd | Method of making electrical connections |
FR2274123A1 (fr) * | 1974-06-07 | 1976-01-02 | Thomson Brandt | Cable plat opto-electrique, son procede de fabrication, et dispositif de mise en oeuvre de ce procede |
US4219928A (en) * | 1979-05-25 | 1980-09-02 | Thomas & Betts Corporation | Flat cable and installing method |
DE3123627A1 (de) * | 1981-06-15 | 1982-12-30 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum gleichzeitigen kontaktieren mehrerer eng beisammenliegender pruefpunkte, insbesondere von rasterfeldern |
JPS61195507A (ja) * | 1985-02-25 | 1986-08-29 | 沖電気工業株式会社 | フレキシブルケ−ブルおよびその製造方法 |
JPS62124572U (ja) * | 1986-01-31 | 1987-08-07 | ||
JPH111684A (ja) * | 1997-06-16 | 1999-01-06 | Mitsubishi Materials Corp | 耐水性の向上した路面凍結防止剤とその製造方法及びそれを含む路面舗装材 |
-
1986
- 1986-01-31 JP JP1986013069U patent/JPS62124571U/ja active Pending
-
1987
- 1987-01-30 US US07/009,157 patent/US4832621A/en not_active Expired - Fee Related
- 1987-02-02 AU AU68253/87A patent/AU576982B2/en not_active Ceased
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019121616A (ja) * | 2017-12-28 | 2019-07-22 | 日立オートモティブシステムズ株式会社 | 電子回路基板および電子回路装置 |
Also Published As
Publication number | Publication date |
---|---|
AU576982B2 (en) | 1988-09-08 |
US4832621A (en) | 1989-05-23 |
AU6825387A (en) | 1987-08-06 |