JP2011249684A5 - - Google Patents

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Publication number
JP2011249684A5
JP2011249684A5 JP2010123326A JP2010123326A JP2011249684A5 JP 2011249684 A5 JP2011249684 A5 JP 2011249684A5 JP 2010123326 A JP2010123326 A JP 2010123326A JP 2010123326 A JP2010123326 A JP 2010123326A JP 2011249684 A5 JP2011249684 A5 JP 2011249684A5
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JP
Japan
Prior art keywords
layer
semiconductor element
thickness
thermal expansion
expansion coefficient
Prior art date
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Application number
JP2010123326A
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English (en)
Japanese (ja)
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JP2011249684A (ja
JP5480722B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2010123326A priority Critical patent/JP5480722B2/ja
Priority claimed from JP2010123326A external-priority patent/JP5480722B2/ja
Priority to US13/114,188 priority patent/US8674499B2/en
Publication of JP2011249684A publication Critical patent/JP2011249684A/ja
Publication of JP2011249684A5 publication Critical patent/JP2011249684A5/ja
Application granted granted Critical
Publication of JP5480722B2 publication Critical patent/JP5480722B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010123326A 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ Active JP5480722B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010123326A JP5480722B2 (ja) 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ
US13/114,188 US8674499B2 (en) 2010-05-28 2011-05-24 Heat radiation component and semiconductor package including same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010123326A JP5480722B2 (ja) 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2011249684A JP2011249684A (ja) 2011-12-08
JP2011249684A5 true JP2011249684A5 (enExample) 2013-03-21
JP5480722B2 JP5480722B2 (ja) 2014-04-23

Family

ID=45021405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010123326A Active JP5480722B2 (ja) 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ

Country Status (2)

Country Link
US (1) US8674499B2 (enExample)
JP (1) JP5480722B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838065B2 (ja) * 2011-09-29 2015-12-24 新光電気工業株式会社 熱伝導部材及び熱伝導部材を用いた接合構造
JP6189015B2 (ja) * 2012-04-19 2017-08-30 昭和電工株式会社 放熱装置および放熱装置の製造方法
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
US20130308273A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Laser sintered matching set radiators
US9041192B2 (en) 2012-08-29 2015-05-26 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US20140117527A1 (en) * 2012-11-01 2014-05-01 Nvidia Corporation Reduced integrated circuit package lid height
JP6160698B2 (ja) * 2013-08-23 2017-07-12 富士電機株式会社 半導体装置
US9892990B1 (en) * 2014-07-24 2018-02-13 Amkor Technology, Inc. Semiconductor package lid thermal interface material standoffs
JP6109274B1 (ja) * 2015-11-09 2017-04-05 かがつう株式会社 ヒートシンク及び該ヒートシンクの製造方法並びに該ヒートシンクを用いた電子部品パッケージ
JP6409846B2 (ja) * 2016-10-18 2018-10-24 トヨタ自動車株式会社 半導体装置
US10551132B2 (en) * 2017-11-28 2020-02-04 International Business Machines Corporation Heat removal element with thermal expansion coefficient mismatch
US10607857B2 (en) * 2017-12-06 2020-03-31 Indium Corporation Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
US11410905B2 (en) * 2019-03-18 2022-08-09 International Business Machines Corporation Optimized weight heat spreader for an electronic package
US11817369B2 (en) * 2019-06-07 2023-11-14 Intel Corporation Lids for integrated circuit packages with solder thermal interface materials
US11915991B2 (en) * 2021-03-26 2024-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof
US20240365510A1 (en) 2021-06-04 2024-10-31 Kuprion Inc. Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using Same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186869A (ja) 1990-11-21 1992-07-03 Denki Kagaku Kogyo Kk 金属板ベース回路基板
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
JPH09306954A (ja) * 1996-05-20 1997-11-28 Hitachi Ltd 半導体装置及びその実装方法並びに実装構造体
JP2856192B2 (ja) * 1997-04-10 1999-02-10 日本電気株式会社 半導体装置
JP3216620B2 (ja) * 1998-11-11 2001-10-09 日本電気株式会社 半導体装置
US6288900B1 (en) * 1999-12-02 2001-09-11 International Business Machines Corporation Warpage compensating heat spreader
KR100447867B1 (ko) * 2001-10-05 2004-09-08 삼성전자주식회사 반도체 패키지
US6882535B2 (en) * 2003-03-31 2005-04-19 Intel Corporation Integrated heat spreader with downset edge, and method of making same
JP2004327711A (ja) 2003-04-24 2004-11-18 Toyota Motor Corp 半導体モジュール
JP4186869B2 (ja) 2004-05-14 2008-11-26 ブラザー工業株式会社 インクジェット記録装置
US7180179B2 (en) * 2004-06-18 2007-02-20 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
JP2006019535A (ja) * 2004-07-02 2006-01-19 Sony Corp 半導体パッケージ
JP4768024B2 (ja) * 2006-07-28 2011-09-07 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2008135627A (ja) * 2006-11-29 2008-06-12 Nec Electronics Corp 半導体装置
US7737550B2 (en) * 2007-08-30 2010-06-15 International Business Machines Corporation Optimization of electronic package geometry for thermal dissipation

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