JP2011508456A5 - - Google Patents
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- Publication number
- JP2011508456A5 JP2011508456A5 JP2010540840A JP2010540840A JP2011508456A5 JP 2011508456 A5 JP2011508456 A5 JP 2011508456A5 JP 2010540840 A JP2010540840 A JP 2010540840A JP 2010540840 A JP2010540840 A JP 2010540840A JP 2011508456 A5 JP2011508456 A5 JP 2011508456A5
- Authority
- JP
- Japan
- Prior art keywords
- interface member
- electronic component
- surface layer
- layer
- thermal interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/964,219 US8076773B2 (en) | 2007-12-26 | 2007-12-26 | Thermal interface with non-tacky surface |
| PCT/US2008/088009 WO2009086299A1 (en) | 2007-12-26 | 2008-12-22 | Thermal interface with non-tacky surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011508456A JP2011508456A (ja) | 2011-03-10 |
| JP2011508456A5 true JP2011508456A5 (enExample) | 2011-12-22 |
Family
ID=40797157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010540840A Pending JP2011508456A (ja) | 2007-12-26 | 2008-12-22 | 非粘着性表面を有する熱的界面 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8076773B2 (enExample) |
| EP (1) | EP2247995B1 (enExample) |
| JP (1) | JP2011508456A (enExample) |
| CN (1) | CN101918906B (enExample) |
| WO (1) | WO2009086299A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2034520B1 (en) * | 2006-06-08 | 2013-04-03 | International Business Machines Corporation | Highly heat conductive, flexible sheet |
| US7791188B2 (en) * | 2007-06-18 | 2010-09-07 | Chien-Min Sung | Heat spreader having single layer of diamond particles and associated methods |
| US8545987B2 (en) * | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
| US9795059B2 (en) * | 2007-11-05 | 2017-10-17 | Laird Technologies, Inc. | Thermal interface materials with thin film or metallization |
| US8445102B2 (en) * | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
| US7826222B2 (en) * | 2008-07-03 | 2010-11-02 | Juniper Networks, Inc. | Front-to-back cooling system for modular systems with orthogonal midplane configuration |
| US8535787B1 (en) | 2009-06-29 | 2013-09-17 | Juniper Networks, Inc. | Heat sinks having a thermal interface for cooling electronic devices |
| US8223498B2 (en) | 2009-11-11 | 2012-07-17 | Juniper Networks, Inc. | Thermal interface members for removable electronic devices |
| JP2012077988A (ja) * | 2010-09-30 | 2012-04-19 | Fujitsu Ltd | 熱中継機構及び放熱フィン |
| CN102711416B (zh) * | 2012-05-24 | 2015-10-21 | 中兴通讯股份有限公司 | 散热处理装置及移动终端 |
| CN103676027B (zh) * | 2012-09-14 | 2016-01-27 | 泰科电子(上海)有限公司 | 连接器 |
| CN203013703U (zh) * | 2012-12-17 | 2013-06-19 | 中怡(苏州)科技有限公司 | 散热元件及应用该散热元件的通讯装置 |
| US10319660B2 (en) * | 2013-10-31 | 2019-06-11 | Nxp Usa, Inc. | Semiconductor device packages using a thermally enhanced conductive molding compound |
| EP3077578A4 (en) | 2013-12-05 | 2017-07-26 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
| CN105980512A (zh) | 2014-02-13 | 2016-09-28 | 霍尼韦尔国际公司 | 可压缩热界面材料 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| JP6341822B2 (ja) * | 2014-09-26 | 2018-06-13 | 三菱電機株式会社 | 半導体装置 |
| US9318450B1 (en) * | 2014-11-24 | 2016-04-19 | Raytheon Company | Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC) |
| CN112080258A (zh) | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| CN107924908B (zh) * | 2015-07-13 | 2020-10-23 | 莱尔德电子材料(深圳)有限公司 | 具有定制着色的外表面的热管理和/或emi减轻材料 |
| TWM519879U (zh) * | 2015-08-03 | 2016-04-01 | 道登電子材料股份有限公司 | 電子裝置之改良散熱結構 |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US10555439B2 (en) * | 2017-11-02 | 2020-02-04 | Laird Technologies, Inc. | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components |
| EP3522211B1 (en) * | 2018-01-31 | 2020-09-30 | Nolato Silikonteknik AB | Delivery roll and method for manufacturing thereof |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN209843434U (zh) * | 2019-01-21 | 2019-12-24 | 斯特华(佛山)磁材有限公司 | 电感器系统、片上系统和电子装置 |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| TWI896542B (zh) * | 2019-07-23 | 2025-09-11 | 德商漢高股份有限及兩合公司 | 高熱通量多元件總成之熱管理 |
| US12317456B2 (en) * | 2020-10-09 | 2025-05-27 | Ut-Battelle, Llc | Heat sink system |
| KR102565178B1 (ko) * | 2020-11-12 | 2023-08-08 | 성균관대학교산학협력단 | 연성-강성-연성 다층 구조 열 계면 소재, 이의 제조 방법 및 이를 포함하는 방열 장치 또는 시스템 |
Family Cites Families (37)
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| EP0264122B1 (en) * | 1986-10-17 | 1992-03-18 | Hitachi, Ltd. | Method of producing a composite structure for a semiconductor device |
| US4938992A (en) | 1988-01-07 | 1990-07-03 | Varian Associates, Inc. | Methods for thermal transfer with a semiconductor |
| US5300809A (en) | 1989-12-12 | 1994-04-05 | Sumitomo Special Metals Co., Ltd. | Heat-conductive composite material |
| JP2728607B2 (ja) * | 1992-11-17 | 1998-03-18 | 信越化学工業株式会社 | 熱伝導性複合シートの製造方法 |
| JP3182257B2 (ja) * | 1993-02-02 | 2001-07-03 | 電気化学工業株式会社 | 放熱シート |
| US6197859B1 (en) | 1993-06-14 | 2001-03-06 | The Bergquist Company | Thermally conductive interface pads for electronic devices |
| US5679457A (en) | 1995-05-19 | 1997-10-21 | The Bergquist Company | Thermally conductive interface for electronic devices |
| US6090484A (en) | 1995-05-19 | 2000-07-18 | The Bergquist Company | Thermally conductive filled polymer composites for mounting electronic devices and method of application |
| US5950066A (en) | 1996-06-14 | 1999-09-07 | The Bergquist Company | Semisolid thermal interface with low flow resistance |
| JP4080030B2 (ja) * | 1996-06-14 | 2008-04-23 | 住友電気工業株式会社 | 半導体基板材料、半導体基板、半導体装置、及びその製造方法 |
| US5738936A (en) | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
| JP3425521B2 (ja) * | 1998-01-09 | 2003-07-14 | 信越化学工業株式会社 | 低硬度熱伝導性シリコーンゴムシートの表面粘着性低減方法 |
| US6399209B1 (en) | 1999-04-16 | 2002-06-04 | The Bergquist Company | Integrated release films for phase-change interfaces |
| US6162663A (en) * | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
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| US20040009353A1 (en) * | 1999-06-14 | 2004-01-15 | Knowles Timothy R. | PCM/aligned fiber composite thermal interface |
| US6391442B1 (en) * | 1999-07-08 | 2002-05-21 | Saint-Gobain Performance Plastics Corporation | Phase change thermal interface material |
| US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
| JP2001110965A (ja) * | 1999-10-07 | 2001-04-20 | Fujikura Ltd | 高熱伝導性粘着シート |
| US6451422B1 (en) * | 1999-12-01 | 2002-09-17 | Johnson Matthey, Inc. | Thermal interface materials |
| JP2001291807A (ja) * | 2000-04-10 | 2001-10-19 | Three M Innovative Properties Co | 熱伝導性シート |
| US6399309B1 (en) * | 2000-12-07 | 2002-06-04 | Becton, Dickinson And Company | Amplification and detection of mycoplasma pneumoniae targeting the ORF9 region of the hmw gene cluster |
| US6667548B2 (en) * | 2001-04-06 | 2003-12-23 | Intel Corporation | Diamond heat spreading and cooling technique for integrated circuits |
| JP4459470B2 (ja) * | 2001-04-06 | 2010-04-28 | 信越化学工業株式会社 | 電子部品の放熱構造体及びそれに用いる放熱シート |
| JP2002329989A (ja) * | 2001-05-02 | 2002-11-15 | Shin Etsu Chem Co Ltd | 熱軟化性放熱シート |
| US6657296B2 (en) | 2001-09-25 | 2003-12-02 | Siliconware Precision Industries Co., Ltd. | Semicondctor package |
| US6657297B1 (en) * | 2002-08-15 | 2003-12-02 | The Bergquist Company | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
| US6956739B2 (en) * | 2002-10-29 | 2005-10-18 | Parker-Hannifin Corporation | High temperature stable thermal interface material |
| US6919504B2 (en) * | 2002-12-19 | 2005-07-19 | 3M Innovative Properties Company | Flexible heat sink |
| US6841867B2 (en) * | 2002-12-30 | 2005-01-11 | Intel Corporation | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
| CN1799107A (zh) * | 2003-04-02 | 2006-07-05 | 霍尼韦尔国际公司 | 热互连和界面系统,其制备方法和应用 |
| US20050016714A1 (en) * | 2003-07-09 | 2005-01-27 | Chung Deborah D.L. | Thermal paste for improving thermal contacts |
| US6898084B2 (en) * | 2003-07-17 | 2005-05-24 | The Bergquist Company | Thermal diffusion apparatus |
| US20050072334A1 (en) * | 2003-10-07 | 2005-04-07 | Saint-Gobain Performance Plastics, Inc. | Thermal interface material |
| TWI306296B (en) * | 2006-04-06 | 2009-02-11 | Siliconware Precision Industries Co Ltd | Semiconductor device with a heat sink and method for fabricating the same |
| US8545987B2 (en) * | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
-
2007
- 2007-12-26 US US11/964,219 patent/US8076773B2/en active Active
-
2008
- 2008-12-22 WO PCT/US2008/088009 patent/WO2009086299A1/en not_active Ceased
- 2008-12-22 JP JP2010540840A patent/JP2011508456A/ja active Pending
- 2008-12-22 EP EP08869145.6A patent/EP2247995B1/en active Active
- 2008-12-22 CN CN2008801252252A patent/CN101918906B/zh active Active
-
2010
- 2010-08-18 US US12/858,849 patent/US8110919B2/en active Active
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