JP5480722B2 - 放熱用部品及びそれを備えた半導体パッケージ - Google Patents

放熱用部品及びそれを備えた半導体パッケージ Download PDF

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Publication number
JP5480722B2
JP5480722B2 JP2010123326A JP2010123326A JP5480722B2 JP 5480722 B2 JP5480722 B2 JP 5480722B2 JP 2010123326 A JP2010123326 A JP 2010123326A JP 2010123326 A JP2010123326 A JP 2010123326A JP 5480722 B2 JP5480722 B2 JP 5480722B2
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Japan
Prior art keywords
layer
semiconductor element
thermal expansion
expansion coefficient
thickness
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Application number
JP2010123326A
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English (en)
Japanese (ja)
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JP2011249684A5 (enExample
JP2011249684A (ja
Inventor
啓 村山
茂明 菅沼
正邦 北島
隆一 松木
宏行 宮島
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010123326A priority Critical patent/JP5480722B2/ja
Priority to US13/114,188 priority patent/US8674499B2/en
Publication of JP2011249684A publication Critical patent/JP2011249684A/ja
Publication of JP2011249684A5 publication Critical patent/JP2011249684A5/ja
Application granted granted Critical
Publication of JP5480722B2 publication Critical patent/JP5480722B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/04—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes comprising shape memory alloys or bimetallic elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/06—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes composite, e.g. polymers with fillers or fibres
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/26—Safety or protection arrangements; Arrangements for preventing malfunction for allowing differential expansion between elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2010123326A 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ Active JP5480722B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010123326A JP5480722B2 (ja) 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ
US13/114,188 US8674499B2 (en) 2010-05-28 2011-05-24 Heat radiation component and semiconductor package including same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010123326A JP5480722B2 (ja) 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2011249684A JP2011249684A (ja) 2011-12-08
JP2011249684A5 JP2011249684A5 (enExample) 2013-03-21
JP5480722B2 true JP5480722B2 (ja) 2014-04-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010123326A Active JP5480722B2 (ja) 2010-05-28 2010-05-28 放熱用部品及びそれを備えた半導体パッケージ

Country Status (2)

Country Link
US (1) US8674499B2 (enExample)
JP (1) JP5480722B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838065B2 (ja) * 2011-09-29 2015-12-24 新光電気工業株式会社 熱伝導部材及び熱伝導部材を用いた接合構造
JP6189015B2 (ja) * 2012-04-19 2017-08-30 昭和電工株式会社 放熱装置および放熱装置の製造方法
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
US20130308273A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Laser sintered matching set radiators
US9041192B2 (en) 2012-08-29 2015-05-26 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US20140117527A1 (en) * 2012-11-01 2014-05-01 Nvidia Corporation Reduced integrated circuit package lid height
JP6160698B2 (ja) * 2013-08-23 2017-07-12 富士電機株式会社 半導体装置
US9892990B1 (en) * 2014-07-24 2018-02-13 Amkor Technology, Inc. Semiconductor package lid thermal interface material standoffs
JP6109274B1 (ja) * 2015-11-09 2017-04-05 かがつう株式会社 ヒートシンク及び該ヒートシンクの製造方法並びに該ヒートシンクを用いた電子部品パッケージ
JP6409846B2 (ja) * 2016-10-18 2018-10-24 トヨタ自動車株式会社 半導体装置
US10551132B2 (en) * 2017-11-28 2020-02-04 International Business Machines Corporation Heat removal element with thermal expansion coefficient mismatch
US10607857B2 (en) * 2017-12-06 2020-03-31 Indium Corporation Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
US11410905B2 (en) * 2019-03-18 2022-08-09 International Business Machines Corporation Optimized weight heat spreader for an electronic package
US11817369B2 (en) * 2019-06-07 2023-11-14 Intel Corporation Lids for integrated circuit packages with solder thermal interface materials
US11915991B2 (en) * 2021-03-26 2024-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof
US20240365510A1 (en) 2021-06-04 2024-10-31 Kuprion Inc. Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using Same

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JPH04186869A (ja) 1990-11-21 1992-07-03 Denki Kagaku Kogyo Kk 金属板ベース回路基板
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
JPH09306954A (ja) * 1996-05-20 1997-11-28 Hitachi Ltd 半導体装置及びその実装方法並びに実装構造体
JP2856192B2 (ja) * 1997-04-10 1999-02-10 日本電気株式会社 半導体装置
JP3216620B2 (ja) * 1998-11-11 2001-10-09 日本電気株式会社 半導体装置
US6288900B1 (en) * 1999-12-02 2001-09-11 International Business Machines Corporation Warpage compensating heat spreader
KR100447867B1 (ko) * 2001-10-05 2004-09-08 삼성전자주식회사 반도체 패키지
US6882535B2 (en) * 2003-03-31 2005-04-19 Intel Corporation Integrated heat spreader with downset edge, and method of making same
JP2004327711A (ja) 2003-04-24 2004-11-18 Toyota Motor Corp 半導体モジュール
JP4186869B2 (ja) 2004-05-14 2008-11-26 ブラザー工業株式会社 インクジェット記録装置
US7180179B2 (en) * 2004-06-18 2007-02-20 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
JP2006019535A (ja) * 2004-07-02 2006-01-19 Sony Corp 半導体パッケージ
JP4768024B2 (ja) * 2006-07-28 2011-09-07 京セラ株式会社 電子部品収納用パッケージおよび電子装置
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US7737550B2 (en) * 2007-08-30 2010-06-15 International Business Machines Corporation Optimization of electronic package geometry for thermal dissipation

Also Published As

Publication number Publication date
US20110291258A1 (en) 2011-12-01
US8674499B2 (en) 2014-03-18
JP2011249684A (ja) 2011-12-08

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