JP2011219674A - 回路基板用熱硬化樹脂性組成物 - Google Patents
回路基板用熱硬化樹脂性組成物 Download PDFInfo
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- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
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- UJGFGHBOZLCAQI-UHFFFAOYSA-N tris(phosphanyl) borate Chemical group POB(OP)OP UJGFGHBOZLCAQI-UHFFFAOYSA-N 0.000 description 1
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| JP2012041386A (ja) * | 2010-08-12 | 2012-03-01 | Sumitomo Bakelite Co Ltd | 回路基板用熱硬化性樹脂組成物 |
| WO2012057171A1 (ja) * | 2010-10-29 | 2012-05-03 | エア・ウォーター株式会社 | 樹脂組成物、それを用いたプリプレグ及び積層板 |
| WO2013115069A1 (ja) * | 2012-01-31 | 2013-08-08 | 三菱瓦斯化学株式会社 | プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板 |
| JP2014028905A (ja) * | 2012-07-31 | 2014-02-13 | Arisawa Manufacturing Co Ltd | エポキシ樹脂組成物 |
| JP2014111719A (ja) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | 積層板、金属張積層板、プリント配線板、多層プリント配線板 |
| JP2015074686A (ja) * | 2013-10-07 | 2015-04-20 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板 |
| KR20190038859A (ko) | 2016-07-29 | 2019-04-09 | 혹꼬우 가가꾸 고오교오 가부시끼가이샤 | 신규 포스포늄 화합물 |
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| JP2020036011A (ja) * | 2018-08-27 | 2020-03-05 | 積水化学工業株式会社 | 多層プリント配線板の製造方法、樹脂フィルム及び多層プリント配線板 |
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| WO2020195236A1 (ja) * | 2019-03-27 | 2020-10-01 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板 |
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| JP2012041386A (ja) * | 2010-08-12 | 2012-03-01 | Sumitomo Bakelite Co Ltd | 回路基板用熱硬化性樹脂組成物 |
| WO2012057171A1 (ja) * | 2010-10-29 | 2012-05-03 | エア・ウォーター株式会社 | 樹脂組成物、それを用いたプリプレグ及び積層板 |
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| WO2013115069A1 (ja) * | 2012-01-31 | 2013-08-08 | 三菱瓦斯化学株式会社 | プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板 |
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