JP2011177842A5 - - Google Patents
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- Publication number
- JP2011177842A5 JP2011177842A5 JP2010044846A JP2010044846A JP2011177842A5 JP 2011177842 A5 JP2011177842 A5 JP 2011177842A5 JP 2010044846 A JP2010044846 A JP 2010044846A JP 2010044846 A JP2010044846 A JP 2010044846A JP 2011177842 A5 JP2011177842 A5 JP 2011177842A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate surface
- outer peripheral
- peripheral portion
- polishing tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 69
- 239000000758 substrate Substances 0.000 claims description 28
- 239000006061 abrasive grain Substances 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 11
- 230000003750 conditioning effect Effects 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 230000001143 conditioned effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010044846A JP2011177842A (ja) | 2010-03-02 | 2010-03-02 | 研磨装置及び研磨方法 |
| US13/036,114 US8641480B2 (en) | 2010-03-02 | 2011-02-28 | Polishing apparatus and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010044846A JP2011177842A (ja) | 2010-03-02 | 2010-03-02 | 研磨装置及び研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011177842A JP2011177842A (ja) | 2011-09-15 |
| JP2011177842A5 true JP2011177842A5 (enExample) | 2013-03-14 |
Family
ID=44531743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010044846A Pending JP2011177842A (ja) | 2010-03-02 | 2010-03-02 | 研磨装置及び研磨方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8641480B2 (enExample) |
| JP (1) | JP2011177842A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011224680A (ja) * | 2010-04-16 | 2011-11-10 | Ebara Corp | 研磨方法及び研磨装置 |
| TWI663018B (zh) * | 2012-09-24 | 2019-06-21 | 日商荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
| JP2014143247A (ja) * | 2013-01-22 | 2014-08-07 | Toshiba Corp | 研磨装置 |
| US9339912B2 (en) | 2013-01-31 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer polishing tool using abrasive tape |
| WO2016068327A1 (ja) * | 2014-10-31 | 2016-05-06 | 株式会社 荏原製作所 | ワークピースを研磨するための化学機械研磨装置 |
| JP6463717B2 (ja) * | 2016-11-10 | 2019-02-06 | 株式会社サンシン | 目詰まり除去装置 |
| JP6884015B2 (ja) * | 2017-03-22 | 2021-06-09 | 株式会社荏原製作所 | 基板の研磨装置および研磨方法 |
| JP6920849B2 (ja) * | 2017-03-27 | 2021-08-18 | 株式会社荏原製作所 | 基板処理方法および装置 |
| JP2021176661A (ja) * | 2020-05-07 | 2021-11-11 | 株式会社ディスコ | 研削装置 |
| JP7451324B2 (ja) * | 2020-06-26 | 2024-03-18 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| CN113579943B (zh) * | 2021-08-06 | 2023-07-18 | 江苏库纳实业有限公司 | 一种铝型材表面处理设备及其表面处理方法 |
| JP2023137069A (ja) * | 2022-03-17 | 2023-09-29 | キオクシア株式会社 | 研磨装置および研磨方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3596413A (en) * | 1969-11-26 | 1971-08-03 | Donald R Stewart | Abrading tool chip extractor and remover |
| US3753269A (en) * | 1971-05-21 | 1973-08-21 | R Budman | Abrasive cloth cleaner |
| US4525955A (en) * | 1981-10-20 | 1985-07-02 | Timesavers, Inc. | Abrasive belt cleaning system |
| JPH0485827A (ja) | 1990-07-26 | 1992-03-18 | Fujitsu Ltd | 半導体装置の製造方法 |
| JP2832142B2 (ja) * | 1993-10-29 | 1998-12-02 | 信越半導体株式会社 | ウェーハのノッチ部研磨装置 |
| JPH08192360A (ja) | 1995-01-13 | 1996-07-30 | Kobe Steel Ltd | テープ研磨装置 |
| JPH0929634A (ja) * | 1995-07-13 | 1997-02-04 | Riken Korandamu Kk | 研磨ベルトのドレス装置 |
| JPH11347917A (ja) * | 1998-06-09 | 1999-12-21 | Ebara Corp | ポリッシング装置 |
| TW396084B (en) * | 1998-08-12 | 2000-07-01 | Worldwild Semiconductor Mfg Co | Chemical mechanic polishing machine |
| JP2001062685A (ja) * | 1999-08-27 | 2001-03-13 | Okamoto Machine Tool Works Ltd | 研削装置 |
| JP2001212750A (ja) * | 1999-11-25 | 2001-08-07 | Fujikoshi Mach Corp | ポリシングマシンの洗浄装置およびポリシングマシン |
| JP2001205549A (ja) * | 2000-01-25 | 2001-07-31 | Speedfam Co Ltd | 基板エッジ部の片面研磨方法およびその装置 |
| US6629875B2 (en) * | 2000-01-28 | 2003-10-07 | Accretech Usa, Inc. | Machine for grinding-polishing of a water edge |
| JP4156200B2 (ja) * | 2001-01-09 | 2008-09-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| JP3778436B2 (ja) | 2002-03-05 | 2006-05-24 | 有限会社フィルブリッジ | ウェーハ研磨装置 |
| JP2003273053A (ja) * | 2002-03-14 | 2003-09-26 | Disco Abrasive Syst Ltd | 平面研削方法 |
| WO2005005693A1 (en) * | 2003-07-01 | 2005-01-20 | Superpower, Inc. | Process control methods of electropolishing for metal substrate preparation in producing ybco coated conductors |
| WO2005081301A1 (en) * | 2004-02-25 | 2005-09-01 | Ebara Corporation | Polishing apparatus and substrate processing apparatus |
| US20050220986A1 (en) * | 2004-04-01 | 2005-10-06 | Superpower, Inc. | Superconductor fabrication processes |
| JP2007005661A (ja) | 2005-06-24 | 2007-01-11 | Ses Co Ltd | ベベル研磨方法及びベベル研磨装置 |
| JP2008036783A (ja) * | 2006-08-08 | 2008-02-21 | Sony Corp | 研磨方法および研磨装置 |
| JP4374038B2 (ja) * | 2007-04-11 | 2009-12-02 | 株式会社東芝 | 基板処理方法 |
| JP2009119537A (ja) * | 2007-11-12 | 2009-06-04 | Toshiba Corp | 基板処理方法及び基板処理装置 |
| JP5274993B2 (ja) | 2007-12-03 | 2013-08-28 | 株式会社荏原製作所 | 研磨装置 |
| JP5393039B2 (ja) * | 2008-03-06 | 2014-01-22 | 株式会社荏原製作所 | 研磨装置 |
| JP5377873B2 (ja) * | 2008-03-18 | 2013-12-25 | 株式会社東京精密 | ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法 |
| JP2009262249A (ja) * | 2008-04-23 | 2009-11-12 | Ebara Corp | 研磨装置 |
-
2010
- 2010-03-02 JP JP2010044846A patent/JP2011177842A/ja active Pending
-
2011
- 2011-02-28 US US13/036,114 patent/US8641480B2/en active Active
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