JP2011177842A - 研磨装置及び研磨方法 - Google Patents

研磨装置及び研磨方法 Download PDF

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Publication number
JP2011177842A
JP2011177842A JP2010044846A JP2010044846A JP2011177842A JP 2011177842 A JP2011177842 A JP 2011177842A JP 2010044846 A JP2010044846 A JP 2010044846A JP 2010044846 A JP2010044846 A JP 2010044846A JP 2011177842 A JP2011177842 A JP 2011177842A
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JP
Japan
Prior art keywords
polishing
polishing tape
substrate
tape
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010044846A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011177842A5 (enExample
Inventor
Masayuki Nakanishi
正行 中西
Tetsuji Togawa
哲二 戸川
Kenya Ito
賢也 伊藤
Masaya Seki
正也 関
Kenji Iwade
健次 岩出
Takeo Kubota
壮男 窪田
Takeshi Nishioka
岳 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP2010044846A priority Critical patent/JP2011177842A/ja
Priority to US13/036,114 priority patent/US8641480B2/en
Publication of JP2011177842A publication Critical patent/JP2011177842A/ja
Publication of JP2011177842A5 publication Critical patent/JP2011177842A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2010044846A 2010-03-02 2010-03-02 研磨装置及び研磨方法 Pending JP2011177842A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010044846A JP2011177842A (ja) 2010-03-02 2010-03-02 研磨装置及び研磨方法
US13/036,114 US8641480B2 (en) 2010-03-02 2011-02-28 Polishing apparatus and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010044846A JP2011177842A (ja) 2010-03-02 2010-03-02 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
JP2011177842A true JP2011177842A (ja) 2011-09-15
JP2011177842A5 JP2011177842A5 (enExample) 2013-03-14

Family

ID=44531743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010044846A Pending JP2011177842A (ja) 2010-03-02 2010-03-02 研磨装置及び研磨方法

Country Status (2)

Country Link
US (1) US8641480B2 (enExample)
JP (1) JP2011177842A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018075684A (ja) * 2016-11-10 2018-05-17 株式会社サンシン 目詰まり除去装置
WO2018173421A1 (ja) * 2017-03-22 2018-09-27 株式会社 荏原製作所 基板の研磨装置および研磨方法
EP3928882A1 (en) * 2020-06-26 2021-12-29 Ebara Corporation Substrate processing apparatus and substrate processing method
CN116787261A (zh) * 2022-03-17 2023-09-22 铠侠股份有限公司 研磨装置及研磨方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011224680A (ja) * 2010-04-16 2011-11-10 Ebara Corp 研磨方法及び研磨装置
TWI663018B (zh) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 研磨方法及研磨裝置
JP2014143247A (ja) * 2013-01-22 2014-08-07 Toshiba Corp 研磨装置
US9339912B2 (en) 2013-01-31 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer polishing tool using abrasive tape
WO2016068327A1 (ja) * 2014-10-31 2016-05-06 株式会社 荏原製作所 ワークピースを研磨するための化学機械研磨装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP2021176661A (ja) * 2020-05-07 2021-11-11 株式会社ディスコ 研削装置
CN113579943B (zh) * 2021-08-06 2023-07-18 江苏库纳实业有限公司 一种铝型材表面处理设备及其表面处理方法

Citations (5)

* Cited by examiner, † Cited by third party
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JPH0929634A (ja) * 1995-07-13 1997-02-04 Riken Korandamu Kk 研磨ベルトのドレス装置
JP2001062685A (ja) * 1999-08-27 2001-03-13 Okamoto Machine Tool Works Ltd 研削装置
JP2003273053A (ja) * 2002-03-14 2003-09-26 Disco Abrasive Syst Ltd 平面研削方法
JP2009224702A (ja) * 2008-03-18 2009-10-01 Tokyo Seimitsu Co Ltd ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法
JP2009262249A (ja) * 2008-04-23 2009-11-12 Ebara Corp 研磨装置

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Publication number Priority date Publication date Assignee Title
US3596413A (en) * 1969-11-26 1971-08-03 Donald R Stewart Abrading tool chip extractor and remover
US3753269A (en) * 1971-05-21 1973-08-21 R Budman Abrasive cloth cleaner
US4525955A (en) * 1981-10-20 1985-07-02 Timesavers, Inc. Abrasive belt cleaning system
JPH0485827A (ja) 1990-07-26 1992-03-18 Fujitsu Ltd 半導体装置の製造方法
JP2832142B2 (ja) * 1993-10-29 1998-12-02 信越半導体株式会社 ウェーハのノッチ部研磨装置
JPH08192360A (ja) 1995-01-13 1996-07-30 Kobe Steel Ltd テープ研磨装置
JPH11347917A (ja) * 1998-06-09 1999-12-21 Ebara Corp ポリッシング装置
TW396084B (en) * 1998-08-12 2000-07-01 Worldwild Semiconductor Mfg Co Chemical mechanic polishing machine
JP2001212750A (ja) * 1999-11-25 2001-08-07 Fujikoshi Mach Corp ポリシングマシンの洗浄装置およびポリシングマシン
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP3778436B2 (ja) 2002-03-05 2006-05-24 有限会社フィルブリッジ ウェーハ研磨装置
WO2005005693A1 (en) * 2003-07-01 2005-01-20 Superpower, Inc. Process control methods of electropolishing for metal substrate preparation in producing ybco coated conductors
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
US20050220986A1 (en) * 2004-04-01 2005-10-06 Superpower, Inc. Superconductor fabrication processes
JP2007005661A (ja) 2005-06-24 2007-01-11 Ses Co Ltd ベベル研磨方法及びベベル研磨装置
JP2008036783A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP4374038B2 (ja) * 2007-04-11 2009-12-02 株式会社東芝 基板処理方法
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP5274993B2 (ja) 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
JP5393039B2 (ja) * 2008-03-06 2014-01-22 株式会社荏原製作所 研磨装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0929634A (ja) * 1995-07-13 1997-02-04 Riken Korandamu Kk 研磨ベルトのドレス装置
JP2001062685A (ja) * 1999-08-27 2001-03-13 Okamoto Machine Tool Works Ltd 研削装置
JP2003273053A (ja) * 2002-03-14 2003-09-26 Disco Abrasive Syst Ltd 平面研削方法
JP2009224702A (ja) * 2008-03-18 2009-10-01 Tokyo Seimitsu Co Ltd ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法
JP2009262249A (ja) * 2008-04-23 2009-11-12 Ebara Corp 研磨装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018075684A (ja) * 2016-11-10 2018-05-17 株式会社サンシン 目詰まり除去装置
WO2018173421A1 (ja) * 2017-03-22 2018-09-27 株式会社 荏原製作所 基板の研磨装置および研磨方法
JP2018158399A (ja) * 2017-03-22 2018-10-11 株式会社荏原製作所 基板の研磨装置および研磨方法
CN110461542A (zh) * 2017-03-22 2019-11-15 株式会社荏原制作所 基板的研磨装置及研磨方法
KR20190131501A (ko) * 2017-03-22 2019-11-26 가부시키가이샤 에바라 세이사꾸쇼 기판의 연마 장치 및 연마 방법
KR102482181B1 (ko) * 2017-03-22 2022-12-29 가부시키가이샤 에바라 세이사꾸쇼 기판의 연마 장치 및 연마 방법
EP3928882A1 (en) * 2020-06-26 2021-12-29 Ebara Corporation Substrate processing apparatus and substrate processing method
US11667008B2 (en) 2020-06-26 2023-06-06 Ebara Corporation Substrate processing apparatus and substrate processing method
CN116787261A (zh) * 2022-03-17 2023-09-22 铠侠股份有限公司 研磨装置及研磨方法

Also Published As

Publication number Publication date
US20110217906A1 (en) 2011-09-08
US8641480B2 (en) 2014-02-04

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