JP2011174180A - 太陽電池電極を提供するための無電解めっき溶液 - Google Patents
太陽電池電極を提供するための無電解めっき溶液 Download PDFInfo
- Publication number
- JP2011174180A JP2011174180A JP2011022036A JP2011022036A JP2011174180A JP 2011174180 A JP2011174180 A JP 2011174180A JP 2011022036 A JP2011022036 A JP 2011022036A JP 2011022036 A JP2011022036 A JP 2011022036A JP 2011174180 A JP2011174180 A JP 2011174180A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- nickel plating
- electroless nickel
- acid
- basic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007772 electroless plating Methods 0.000 title abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 411
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 200
- 238000007747 plating Methods 0.000 claims abstract description 174
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 36
- 239000002738 chelating agent Substances 0.000 claims abstract description 34
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 17
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 91
- 239000010703 silicon Substances 0.000 claims description 91
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 59
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 59
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 24
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 20
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 18
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 18
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims description 17
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 17
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- 239000003381 stabilizer Substances 0.000 claims description 16
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 14
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 12
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 12
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 12
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 12
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 claims description 12
- 239000012279 sodium borohydride Substances 0.000 claims description 11
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 11
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 10
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 9
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 9
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 8
- 235000011054 acetic acid Nutrition 0.000 claims description 8
- GJYJYFHBOBUTBY-UHFFFAOYSA-N alpha-camphorene Chemical compound CC(C)=CCCC(=C)C1CCC(CCC=C(C)C)=CC1 GJYJYFHBOBUTBY-UHFFFAOYSA-N 0.000 claims description 8
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 8
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 8
- VDTVZBCTOQDZSH-UHFFFAOYSA-N borane N-ethylethanamine Chemical compound B.CCNCC VDTVZBCTOQDZSH-UHFFFAOYSA-N 0.000 claims description 8
- YJROYUJAFGZMJA-UHFFFAOYSA-N boron;morpholine Chemical compound [B].C1COCCN1 YJROYUJAFGZMJA-UHFFFAOYSA-N 0.000 claims description 8
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 8
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 8
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 7
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 7
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- 235000019270 ammonium chloride Nutrition 0.000 claims description 7
- 239000006172 buffering agent Substances 0.000 claims description 7
- 239000001508 potassium citrate Substances 0.000 claims description 7
- 229960002635 potassium citrate Drugs 0.000 claims description 7
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims description 7
- 235000011082 potassium citrates Nutrition 0.000 claims description 7
- 239000001509 sodium citrate Substances 0.000 claims description 7
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 7
- 239000011775 sodium fluoride Substances 0.000 claims description 7
- 235000013024 sodium fluoride Nutrition 0.000 claims description 7
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 6
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 6
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 6
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004327 boric acid Substances 0.000 claims description 6
- 235000010338 boric acid Nutrition 0.000 claims description 6
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 6
- 239000004310 lactic acid Substances 0.000 claims description 6
- 235000014655 lactic acid Nutrition 0.000 claims description 6
- 235000006408 oxalic acid Nutrition 0.000 claims description 6
- 235000019260 propionic acid Nutrition 0.000 claims description 6
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 6
- 239000011975 tartaric acid Substances 0.000 claims description 6
- 235000002906 tartaric acid Nutrition 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 5
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 claims description 5
- 239000000872 buffer Substances 0.000 claims description 5
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 150000003585 thioureas Chemical class 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 150000002823 nitrates Chemical class 0.000 claims description 4
- SDVHRXOTTYYKRY-UHFFFAOYSA-J tetrasodium;dioxido-oxo-phosphonato-$l^{5}-phosphane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)P([O-])([O-])=O SDVHRXOTTYYKRY-UHFFFAOYSA-J 0.000 claims description 4
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000085 borane Inorganic materials 0.000 claims description 2
- 239000011698 potassium fluoride Substances 0.000 claims 3
- 235000003270 potassium fluoride Nutrition 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 38
- 229910052782 aluminium Inorganic materials 0.000 abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 88
- 238000000034 method Methods 0.000 description 61
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 239000002105 nanoparticle Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229920000620 organic polymer Polymers 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 7
- 229940053662 nickel sulfate Drugs 0.000 description 7
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- CXIHYTLHIDQMGN-UHFFFAOYSA-L methanesulfonate;nickel(2+) Chemical compound [Ni+2].CS([O-])(=O)=O.CS([O-])(=O)=O CXIHYTLHIDQMGN-UHFFFAOYSA-L 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 239000011856 silicon-based particle Substances 0.000 description 6
- -1 silver-aluminum Chemical compound 0.000 description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 5
- 239000003002 pH adjusting agent Substances 0.000 description 5
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 4
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 4
- 229940081974 saccharin Drugs 0.000 description 4
- 235000019204 saccharin Nutrition 0.000 description 4
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 4
- 229960001124 trientine Drugs 0.000 description 4
- 229910017855 NH 4 F Inorganic materials 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 3
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 3
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 3
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 150000004685 tetrahydrates Chemical class 0.000 description 3
- 238000001994 activation Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005543 nano-size silicon particle Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910003771 Gold(I) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical group [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 150000003567 thiocyanates Chemical class 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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Abstract
【解決手段】無電解めっき溶液は、ニッケルイオン;還元剤;第一キレート剤;第二キレート剤;及び水を含む。
【効果】無電解めっき溶液は、Si及びSiNxの間の高い選択性を有し、かつアルミニウム系の層に対して無害である。
【選択図】なし
Description
本出願は、35USC第119条(e)(1)項の下で2010年2月5日に出願された「太陽電池電極用の無電解ニッケルめっき溶液及びそれを使用した方法」という名称の米国仮出願番号61/282,420の出願日の優先権を請求する。
工程1:シリコン基板を提供すること;
工程2:シリコン基板への前処理(任意工程);及び
工程3:本発明の塩基性無電解ニッケルめっき溶液を使うことによって電極を形成すること;を含み得る。
34g/Lのニッケル硫酸、18g/Lの次リン酸ナトリウム;50g/Lのクエン酸アンモニウム;8g/Lの塩化アンモニウム;10g/Lのトリエタノールアミン;4g/Lのフッ化ナトリウム;及び0.0009g/Lのチオ尿素;の組成を有する本実施例の無電解ニッケルめっき溶液が調製される。さらに、無電解ニッケルめっき溶液のpHは約7.5〜8.2に調整される。
34g/Lの塩化ニッケル;7g/LのDMAB(ジメチルアミン・ボラン);50g/Lのクエン酸アンモニム;8g/Lの塩化アンモニウム;60g/Lのトリエタノールアミン;8g/Lのフッ化ナトリウム;0.001g/Lのチオ尿素;及び1g/Lのサッカリン;の組成を有する本実施例の無電解ニッケルめっき溶液が調製される。さらに、無電解ニッケルめっき溶液のpHは約8.0〜9.0に調整される。
35g/Lの硫酸ニッケル;15g/Lの次亜リン酸ナトリウム;5g/LのDMAB(ジメチルアミン・ボラン);40g/Lのクエン酸アンモニム;5g/Lの硫酸アンモニウム;20g/Lのトリエタノールアミン;6g/Lのフッ化ナトリウム;及び0.001g/LのPb2+;の組成を有する本実施例の無電解ニッケルめっき溶液が調製される。さらに、無電解ニッケルめっき溶液のpHは約8.0〜8.5に調整される。
35g/Lの硫酸ニッケル;25g/Lの次亜リン酸ナトリウム;1.25g/LのDMAB(ジメチルアミン・ボラン);55g/Lのクエン酸アンモニム;(13g/Lの硫酸アンモニウム;40g/Lのトリエタノールアミン;5g/Lのフッ化ナトリウム;及び0.001g/LのPb2+の組成を有する本実施例の無電解ニッケルめっき溶液が調製される。なお、無電解ニッケルめっき溶液のpHは約8.5〜9.3に調整される。
30g/Lの硫酸ニッケル;10g/Lの次亜リン酸ナトリウム;65g/Lのクエン酸アンモニム;50g/Lの塩化アンモニウム;及び0.001g/LのPb2+;の組成を有する本実施例の無電解ニッケルめっき溶液が調製される。さらに、無電解ニッケルめっき溶液のpHは約8.2〜8.8に調整される。
Claims (28)
- シリコン及び窒化ケイ素を含むパターン化された構造を有する太陽電池の電極を形成するための塩基性無電解ニッケルめっき溶液であって、
(a)4.5g/L〜10.0g/Lのニッケルイオン;
(b)還元剤;
(c)30g/L〜60g/Lの、クエン酸、クエン酸アンモニウム、クエン酸ナトリウム、クエン酸カリウム、及びそれらの混合物から成る群から選ばれる第一キレート剤;
(d)5g/L〜80g/Lの第二キレート剤;
(e)0.0005g/L〜0.002g/Lの安定剤;及び
(f)水;を含み、
ここで、無電解ニッケルめっき溶液のpH値が7.0〜10.0の範囲にあり;第二キレート剤が、アルキロールアミン、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、及びそれらの組合せから成る群から選ばれるものである、
塩基性無電解ニッケルめっき溶液。 - アルキロールアミンが、ジエタノールアミン、トリエタノールアミン、及びそれらの混合物から成る群から選ばれる、請求項1に記載の塩基性無電解ニッケルめっき溶液。
- 還元剤が、水素化ホウ素ナトリウム、ジメチルアミン・ボラン、ジエチルアミン・ボラン、モルホリン・ボラン、及びそれらの組合せから成る群から選ばれ、かつ還元剤の含有量が0.5〜20g/Lである、請求項1に記載の塩基性無電解ニッケルめっき溶液。
- 還元剤が、次亜リン酸ナトリウム、次亜リン酸アンモニウム、ホスフィン酸、ヒドラジンから成る群から選ばれ、かつ還元剤の含有量が5〜40g/Lである、請求項1に記載の塩基性無電解ニッケルめっき溶液。
- 塩化アンモニウム、硫酸アンモニウム、ホウ酸、酢酸、プロピオン酸、シュウ酸、コハク酸、乳酸、グリコール酸、酒石酸、及びそれらの組合せから成る群から選ばれる緩衝剤を更に含む、請求項1に記載の塩基性無電解ニッケルめっき溶液。
- 緩衝剤の含有量が1g/L〜20g/Lである、請求項5に記載の塩基性無電解ニッケルめっき溶液。
- フッ化水素酸、フッ化ナトリウム、フッ化カリウム、フッ化アンモニウム、及びそれらの組合せから成る群から選ばれる促進剤を更に含む、請求項1に記載の塩基性無電解ニッケルめっき溶液。
- 促進剤の含有量が2g/L〜12g/Lである、請求項7に記載の塩基性無電解ニッケルめっき溶液。
- 安定剤が、チオ尿素;チオ尿素の誘導体;チオシアネート;Pb2+、Sb3+及びBi3+の酢酸化合物;Pb2+、Sb3+及びBi3+の硝酸化合物;並びに‐SH基を有する水溶性有機物質から成る群から選ばれる、請求項1に記載の塩基性無電解ニッケルめっき溶液。
- シリコン及び窒化ケイ素を含むパターン化された構造を有する太陽電池の電極を形成するための塩基性無電解ニッケルめっき溶液であって、
(a)ニッケルイオン;
(b)還元剤;
(c)クエン酸、クエン酸アンモニウム、クエン酸ナトリウム、クエン酸カリウム、及びそれらの混合物から成る群から選ばれる第一キレート剤;
(d)第二キレート剤;
(e)安定剤;及び
(f)水;を含み、
ここで、無電解ニッケルめっき溶液のpH値が7.0〜10.0の範囲にあり;塩素イオンの含有量が1000ppm未満であり;第二キレート剤が、アルキロールアミン、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、及びそれらの組合せから成る群から選ばれるものである、
塩基性無電解ニッケルめっき溶液。 - アルキロールアミンが、好ましくは、ジエタノールアミン、トリエタノールアミン、及びそれらの混合物から成る群から選ばれる、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- ニッケルイオンの含有量が4.5g/L〜10.0g/L、第一キレート剤の含有量が30g/L〜60g/L、第二キレート剤の含有量が5g/L〜80g/L、かつ安定剤の含有量が0.0005g/L〜0.002g/Lである、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- 還元剤が、水素化ホウ素ナトリウム、ジメチルアミン・ボラン、ジエチルアミン・ボラン、モルホリン・ボラン、及びそれらの組合せから成る群から選ばれ、かつ還元剤の含有量が0.5〜20g/Lである、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- 還元剤が、次亜リン酸ナトリウム、次亜リン酸アンモニウム、ホスフィン酸、ヒドラジンから成る群から選ばれ、かつ還元剤の含有量が5〜40g/Lである、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- 塩化アンモニウム、硫酸アンモニウム、ホウ酸、酢酸、プロピオン酸、シュウ酸、コハク酸、乳酸、グリコール酸、酒石酸、及びそれらの組合せから成る群から選ばれる緩衝剤を更に含む、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- 緩衝剤の含有量が1g/L〜20g/Lである、請求項15に記載の塩基性無電解ニッケルめっき溶液。
- フッ化水素酸、フッ化ナトリウム、フッ化カリウム、フッ化アンモニウム、及びそれらの組合せから成る群から選ばれる促進剤を更に含む、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- 促進剤の含有量が2g/L〜12g/Lである、請求項17に記載の塩基性無電解ニッケルめっき溶液。
- 安定剤が、チオ尿素;チオ尿素の誘導体;チオシアネート;Pb2+、Sb3+及びBi3+の酢酸化合物;Pb2+、Sb3+及びBi3+の硝酸化合物;並びに‐SH基を有する水溶性有機物質から成る群から選ばれる、請求項10に記載の塩基性無電解ニッケルめっき溶液。
- シリコン及び窒化ケイ素を含むパターン化された構造を有する太陽電池の電極を形成するための塩基性無電解ニッケルめっき溶液であって、
(a)ニッケルイオン;
(b)次リン酸ナトリウム、次亜リン酸アンモニウム、ホスフィン酸、及びそれらの混合物から成る群から選ばれる第一還元剤;
(c)ボランである第二還元剤;
(d)クエン酸、クエン酸アンモニウム、クエン酸ナトリウム、クエン酸カリウム、及びそれらの混合物から成る群から選ばれる第一キレート剤;
(e)第二キレート剤;
(f)安定剤;及び
(g)水;を含み、
ここで、無電解ニッケルめっき溶液のpH値が7.0〜10.0の範囲にあり;第二キレート剤が、アルキロールアミン、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、及びそれらの組合せから成る群から選ばれるものである、
塩基性無電解ニッケルめっき溶液。 - アルキロールアミンが、好ましくはジエタノールアミン、トリエタノールアミン、及びそれらの混合物から成る群から選ばれる、請求項20に記載の塩基性無電解ニッケルめっき溶液
- ニッケルイオンの含有量が4.5g/L〜10.0g/L、第一還元剤の含有量が5g/L〜30g/L、第二還元剤の含有量が0.5g/L〜20g/L、第一キレート剤の含有量が30g/L〜60g/L、第二キレート剤の含有量が5g/L〜80g/L、かつ安定剤の含有量が0.0005g/L〜0.002g/Lである、請求項20に記載の塩基性無電解ニッケルめっき溶液。
- 第二還元剤が、水素化ホウ素ナトリウム、ジメチルアミン・ボラン、ジエチルアミン・ボラン、モルホリン・ボラン、及びそれらの組合せから成る群から選ばれる、請求項20に記載の塩基性無電解ニッケルめっき溶液。
- 硫酸アンモニウム、ホウ酸、酢酸、プロピオン酸、シュウ酸、コハク酸、乳酸、グリコール酸、酒石酸、及びそれらの組合せから成る群から選ばれる緩衝剤を更に含む、請求項20に記載の塩基性無電解ニッケルめっき溶液。
- 緩衝剤の含有量が1g/L〜20g/Lである、請求項24に記載の塩基性無電解ニッケルめっき溶液。
- フッ化水素酸、フッ化ナトリウム、フッ化カリウム、フッ化アンモニウム、及びそれらの組合せから成る群から選ばれる促進剤を更に含む、請求項20に記載の塩基性無電解ニッケルめっき溶液。
- 促進剤の含有量が2g/L〜12g/Lである、請求項26に記載の塩基性無電解ニッケルめっき溶液。
- 安定剤が、チオ尿素;チオシアネート;Pb2+、Sb3+及びBi3+の酢酸化合物;Pb2+、Sb3+及びBi3+の硝酸化合物;並びに‐SH基を有する水溶性有機物質から成る群から選ばれる、請求項20に記載の塩基性無電解ニッケルめっき溶液。
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JP5383723B2 (ja) | 2014-01-08 |
JP2011168889A (ja) | 2011-09-01 |
US20110192316A1 (en) | 2011-08-11 |
DE102011003713A1 (de) | 2011-08-11 |
TW201127986A (en) | 2011-08-16 |
JP5374526B2 (ja) | 2013-12-25 |
CN102146557A (zh) | 2011-08-10 |
CN102168258A (zh) | 2011-08-31 |
TW201129715A (en) | 2011-09-01 |
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