JP2011097088A5 - - Google Patents

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Publication number
JP2011097088A5
JP2011097088A5 JP2011003760A JP2011003760A JP2011097088A5 JP 2011097088 A5 JP2011097088 A5 JP 2011097088A5 JP 2011003760 A JP2011003760 A JP 2011003760A JP 2011003760 A JP2011003760 A JP 2011003760A JP 2011097088 A5 JP2011097088 A5 JP 2011097088A5
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JP
Japan
Prior art keywords
liquid
adhesion surface
liquid material
vaporization system
net
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Application number
JP2011003760A
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English (en)
Japanese (ja)
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JP5410456B2 (ja
JP2011097088A (ja
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Priority to JP2011003760A priority Critical patent/JP5410456B2/ja
Priority claimed from JP2011003760A external-priority patent/JP5410456B2/ja
Publication of JP2011097088A publication Critical patent/JP2011097088A/ja
Publication of JP2011097088A5 publication Critical patent/JP2011097088A5/ja
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Publication of JP5410456B2 publication Critical patent/JP5410456B2/ja
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JP2011003760A 2009-09-30 2011-01-12 液体気化システム Active JP5410456B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011003760A JP5410456B2 (ja) 2009-09-30 2011-01-12 液体気化システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009226691 2009-09-30
JP2009226691 2009-09-30
JP2011003760A JP5410456B2 (ja) 2009-09-30 2011-01-12 液体気化システム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2010537983A Division JP4673449B1 (ja) 2009-09-30 2010-03-30 液体気化システム

Publications (3)

Publication Number Publication Date
JP2011097088A JP2011097088A (ja) 2011-05-12
JP2011097088A5 true JP2011097088A5 (enExample) 2011-09-01
JP5410456B2 JP5410456B2 (ja) 2014-02-05

Family

ID=43825904

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010537983A Active JP4673449B1 (ja) 2009-09-30 2010-03-30 液体気化システム
JP2011003760A Active JP5410456B2 (ja) 2009-09-30 2011-01-12 液体気化システム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2010537983A Active JP4673449B1 (ja) 2009-09-30 2010-03-30 液体気化システム

Country Status (6)

Country Link
US (1) US8361231B2 (enExample)
JP (2) JP4673449B1 (enExample)
KR (1) KR101234409B1 (enExample)
CN (1) CN102470282B (enExample)
TW (1) TWI414361B (enExample)
WO (1) WO2011040067A1 (enExample)

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JP5368393B2 (ja) * 2010-08-05 2013-12-18 東京エレクトロン株式会社 気化装置、基板処理装置及び塗布現像装置
KR101845580B1 (ko) 2011-01-19 2018-04-04 시케이디 가부시키가이샤 액체 기화기
US8752544B2 (en) 2011-03-21 2014-06-17 General Electric Company Medical vaporizer and method of monitoring of a medical vaporizer
CN103608484B (zh) * 2011-04-20 2016-06-22 Oled工厂有限责任公司 用于气相沉积应用的测量设备和方法
JP5810004B2 (ja) * 2012-02-27 2015-11-11 Ckd株式会社 液体制御装置
JP5989944B2 (ja) * 2011-09-30 2016-09-07 Ckd株式会社 液体制御装置
KR101892758B1 (ko) 2011-09-30 2018-10-04 시케이디 가부시키가이샤 액체 제어 장치
JP5973178B2 (ja) * 2012-02-01 2016-08-23 Ckd株式会社 液体制御装置
JP5919089B2 (ja) * 2012-05-15 2016-05-18 Ckd株式会社 液体制御装置
JP5919115B2 (ja) * 2012-07-12 2016-05-18 Ckd株式会社 液体制御装置、及び液体制御装置に適用される網状体組立体
CN104520975B (zh) * 2012-07-30 2018-07-31 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
US8977115B2 (en) * 2013-03-08 2015-03-10 Steris Inc. Vaporizer with secondary flow path
US10490429B2 (en) 2014-11-26 2019-11-26 Applied Materials, Inc. Substrate carrier using a proportional thermal fluid delivery system
US9983892B2 (en) 2015-11-06 2018-05-29 Samsung Electronics Co., Ltd. Deep linking to mobile application states through programmatic replay of user interface events
JP6626322B2 (ja) * 2015-11-27 2019-12-25 Ckd株式会社 気体圧駆動機器、及びその制御方法
US10610659B2 (en) 2017-03-23 2020-04-07 General Electric Company Gas mixer incorporating sensors for measuring flow and concentration
US10946160B2 (en) 2017-03-23 2021-03-16 General Electric Company Medical vaporizer with carrier gas characterization, measurement, and/or compensation
US20190351443A1 (en) * 2018-05-17 2019-11-21 Indose Inc. Vaporizer with clog-free channel
KR101913556B1 (ko) * 2018-06-01 2018-10-31 주식회사 태진중공업 강제 송풍 대기식 기화기
TWI697352B (zh) * 2019-05-08 2020-07-01 翁子勝 液體蒸發裝置
CN115279941B (zh) * 2020-03-23 2024-09-24 株式会社堀场Stec 气化系统和气化装置的固定方法
JP2023176814A (ja) * 2022-05-31 2023-12-13 ワッティー株式会社 集積化ガスシステム用加熱器
CN118653196B (zh) * 2024-08-19 2025-01-21 宁波劳伦斯表面技术有限公司 一种常温蒸发系统
CN119733256B (zh) * 2025-03-04 2025-06-13 泉州泉港区正源新材料有限公司 一种用于甲缩醛精制的脱轻塔
CN120057903B (zh) * 2025-04-25 2025-07-18 新疆中蓄电新材料有限公司 一种气溶胶辅助制备单壁碳纳米管系统和方法

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JP3074871B2 (ja) 1991-12-05 2000-08-07 石川島播磨重工業株式会社 Ｃｖｄ用原料蒸発器
DE69312436T2 (de) 1992-12-15 1998-02-05 Applied Materials Inc Verdampfung von flüssigen Reaktionspartnern für CVD
JP2870719B2 (ja) * 1993-01-29 1999-03-17 東京エレクトロン株式会社 処理装置
JP2872891B2 (ja) 1993-08-06 1999-03-24 株式会社東芝 気化装置
US5777300A (en) * 1993-11-19 1998-07-07 Tokyo Electron Kabushiki Kaisha Processing furnace for oxidizing objects
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TW322602B (enExample) * 1996-04-05 1997-12-11 Ehara Seisakusho Kk
JP3938391B2 (ja) * 1997-06-04 2007-06-27 シーケーディ株式会社 液体原料の気化装置
US6099653A (en) * 1997-12-12 2000-08-08 Advanced Technology Materials, Inc. Liquid reagent delivery system with constant thermal loading of vaporizer
US7011710B2 (en) * 2000-04-10 2006-03-14 Applied Materials Inc. Concentration profile on demand gas delivery system (individual divert delivery system)
JP2001295050A (ja) 2000-04-11 2001-10-26 Sony Corp 気化器、気化器の使用方法および液体原料の気化方法
JP2003268552A (ja) * 2002-03-18 2003-09-25 Watanabe Shoko:Kk 気化器及びそれを用いた各種装置並びに気化方法
TW200401841A (en) * 2002-05-29 2004-02-01 Watanabe M & Co Ltd Vaporizer, various apparatus including the same and method of vaporization
JP2006523810A (ja) 2003-04-14 2006-10-19 スワゲロック カンパニー ダイヤフラムバルブシート
JP4035728B2 (ja) 2003-07-07 2008-01-23 Ｓｍｃ株式会社 サックバックバルブ
JP2005057193A (ja) * 2003-08-07 2005-03-03 Shimadzu Corp 気化器
JP2005101454A (ja) * 2003-09-26 2005-04-14 Watanabe Shoko:Kk 気化器
JP4607474B2 (ja) * 2004-02-12 2011-01-05 東京エレクトロン株式会社 成膜装置
JP2006352001A (ja) 2005-06-20 2006-12-28 Dainippon Screen Mfg Co Ltd 処理ガス供給装置および基板処理装置
KR100629793B1 (ko) * 2005-11-11 2006-09-28 주식회사 방림 전해도금으로 마그네슘합금과 밀착성 좋은 동도금층 형성방법
US20100022097A1 (en) * 2006-02-27 2010-01-28 Youtec Co., Ltd. Vaporizer, semiconductor production apparatus and process of semiconductor production
JP2009038047A (ja) 2006-04-26 2009-02-19 Entegris Inc 液体気化装置
JP5385002B2 (ja) * 2008-06-16 2014-01-08 株式会社日立国際電気 基板処理装置及び半導体デバイスの製造方法

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