TWI414361B - Liquid vaporization system - Google Patents
Liquid vaporization system Download PDFInfo
- Publication number
- TWI414361B TWI414361B TW099120490A TW99120490A TWI414361B TW I414361 B TWI414361 B TW I414361B TW 099120490 A TW099120490 A TW 099120490A TW 99120490 A TW99120490 A TW 99120490A TW I414361 B TWI414361 B TW I414361B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- liquid material
- diaphragm
- vaporizer
- pump
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 234
- 230000008016 vaporization Effects 0.000 title claims abstract description 168
- 238000009834 vaporization Methods 0.000 title claims abstract description 162
- 239000011344 liquid material Substances 0.000 claims abstract description 314
- 239000006200 vaporizer Substances 0.000 claims abstract description 118
- 230000001737 promoting effect Effects 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims description 46
- 238000006073 displacement reaction Methods 0.000 claims description 37
- 230000000903 blocking effect Effects 0.000 claims description 24
- 238000009736 wetting Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 6
- 230000000670 limiting effect Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000009954 braiding Methods 0.000 claims 1
- 238000005338 heat storage Methods 0.000 abstract description 108
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 42
- 238000010586 diagram Methods 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 19
- 229910001873 dinitrogen Inorganic materials 0.000 description 17
- 239000010408 film Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 230000008859 change Effects 0.000 description 11
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 230000005484 gravity Effects 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 239000011810 insulating material Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 230000009471 action Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 239000012159 carrier gas Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 6
- 230000037361 pathway Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 230000015654 memory Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000009428 plumbing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D1/00—Evaporating
- B01D1/22—Evaporating by bringing a thin layer of the liquid into contact with a heated surface
- B01D1/221—Composite plate evaporators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
- B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
- B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J7/00—Apparatus for generating gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Nozzles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009226691 | 2009-09-30 | ||
| PCT/JP2010/055652 WO2011040067A1 (ja) | 2009-09-30 | 2010-03-30 | 液体気化システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201111043A TW201111043A (en) | 2011-04-01 |
| TWI414361B true TWI414361B (zh) | 2013-11-11 |
Family
ID=43825904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099120490A TWI414361B (zh) | 2009-09-30 | 2010-06-23 | Liquid vaporization system |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8361231B2 (enExample) |
| JP (2) | JP4673449B1 (enExample) |
| KR (1) | KR101234409B1 (enExample) |
| CN (1) | CN102470282B (enExample) |
| TW (1) | TWI414361B (enExample) |
| WO (1) | WO2011040067A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5368393B2 (ja) * | 2010-08-05 | 2013-12-18 | 東京エレクトロン株式会社 | 気化装置、基板処理装置及び塗布現像装置 |
| KR101845580B1 (ko) | 2011-01-19 | 2018-04-04 | 시케이디 가부시키가이샤 | 액체 기화기 |
| US8752544B2 (en) | 2011-03-21 | 2014-06-17 | General Electric Company | Medical vaporizer and method of monitoring of a medical vaporizer |
| CN103608484B (zh) * | 2011-04-20 | 2016-06-22 | Oled工厂有限责任公司 | 用于气相沉积应用的测量设备和方法 |
| JP5810004B2 (ja) * | 2012-02-27 | 2015-11-11 | Ckd株式会社 | 液体制御装置 |
| JP5989944B2 (ja) * | 2011-09-30 | 2016-09-07 | Ckd株式会社 | 液体制御装置 |
| KR101892758B1 (ko) | 2011-09-30 | 2018-10-04 | 시케이디 가부시키가이샤 | 액체 제어 장치 |
| JP5973178B2 (ja) * | 2012-02-01 | 2016-08-23 | Ckd株式会社 | 液体制御装置 |
| JP5919089B2 (ja) * | 2012-05-15 | 2016-05-18 | Ckd株式会社 | 液体制御装置 |
| JP5919115B2 (ja) * | 2012-07-12 | 2016-05-18 | Ckd株式会社 | 液体制御装置、及び液体制御装置に適用される網状体組立体 |
| CN104520975B (zh) * | 2012-07-30 | 2018-07-31 | 株式会社日立国际电气 | 衬底处理装置及半导体器件的制造方法 |
| US8977115B2 (en) * | 2013-03-08 | 2015-03-10 | Steris Inc. | Vaporizer with secondary flow path |
| US10490429B2 (en) | 2014-11-26 | 2019-11-26 | Applied Materials, Inc. | Substrate carrier using a proportional thermal fluid delivery system |
| US9983892B2 (en) | 2015-11-06 | 2018-05-29 | Samsung Electronics Co., Ltd. | Deep linking to mobile application states through programmatic replay of user interface events |
| JP6626322B2 (ja) * | 2015-11-27 | 2019-12-25 | Ckd株式会社 | 気体圧駆動機器、及びその制御方法 |
| US10610659B2 (en) | 2017-03-23 | 2020-04-07 | General Electric Company | Gas mixer incorporating sensors for measuring flow and concentration |
| US10946160B2 (en) | 2017-03-23 | 2021-03-16 | General Electric Company | Medical vaporizer with carrier gas characterization, measurement, and/or compensation |
| US20190351443A1 (en) * | 2018-05-17 | 2019-11-21 | Indose Inc. | Vaporizer with clog-free channel |
| KR101913556B1 (ko) * | 2018-06-01 | 2018-10-31 | 주식회사 태진중공업 | 강제 송풍 대기식 기화기 |
| TWI697352B (zh) * | 2019-05-08 | 2020-07-01 | 翁子勝 | 液體蒸發裝置 |
| CN115279941B (zh) * | 2020-03-23 | 2024-09-24 | 株式会社堀场Stec | 气化系统和气化装置的固定方法 |
| JP2023176814A (ja) * | 2022-05-31 | 2023-12-13 | ワッティー株式会社 | 集積化ガスシステム用加熱器 |
| CN118653196B (zh) * | 2024-08-19 | 2025-01-21 | 宁波劳伦斯表面技术有限公司 | 一种常温蒸发系统 |
| CN119733256B (zh) * | 2025-03-04 | 2025-06-13 | 泉州泉港区正源新材料有限公司 | 一种用于甲缩醛精制的脱轻塔 |
| CN120057903B (zh) * | 2025-04-25 | 2025-07-18 | 新疆中蓄电新材料有限公司 | 一种气溶胶辅助制备单壁碳纳米管系统和方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099653A (en) * | 1997-12-12 | 2000-08-08 | Advanced Technology Materials, Inc. | Liquid reagent delivery system with constant thermal loading of vaporizer |
| JP2005057193A (ja) * | 2003-08-07 | 2005-03-03 | Shimadzu Corp | 気化器 |
| US7368047B2 (en) * | 2005-11-11 | 2008-05-06 | Byung Chul Park | Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3074871B2 (ja) | 1991-12-05 | 2000-08-07 | 石川島播磨重工業株式会社 | Ｃｖｄ用原料蒸発器 |
| DE69312436T2 (de) | 1992-12-15 | 1998-02-05 | Applied Materials Inc | Verdampfung von flüssigen Reaktionspartnern für CVD |
| JP2870719B2 (ja) * | 1993-01-29 | 1999-03-17 | 東京エレクトロン株式会社 | 処理装置 |
| JP2872891B2 (ja) | 1993-08-06 | 1999-03-24 | 株式会社東芝 | 気化装置 |
| US5777300A (en) * | 1993-11-19 | 1998-07-07 | Tokyo Electron Kabushiki Kaisha | Processing furnace for oxidizing objects |
| DE19605500C1 (de) * | 1996-02-14 | 1997-04-17 | Linde Ag | Vorrichtung und Verfahren zum Verdampfen einer Flüssigkeit |
| TW322602B (enExample) * | 1996-04-05 | 1997-12-11 | Ehara Seisakusho Kk | |
| JP3938391B2 (ja) * | 1997-06-04 | 2007-06-27 | シーケーディ株式会社 | 液体原料の気化装置 |
| US7011710B2 (en) * | 2000-04-10 | 2006-03-14 | Applied Materials Inc. | Concentration profile on demand gas delivery system (individual divert delivery system) |
| JP2001295050A (ja) | 2000-04-11 | 2001-10-26 | Sony Corp | 気化器、気化器の使用方法および液体原料の気化方法 |
| JP2003268552A (ja) * | 2002-03-18 | 2003-09-25 | Watanabe Shoko:Kk | 気化器及びそれを用いた各種装置並びに気化方法 |
| TW200401841A (en) * | 2002-05-29 | 2004-02-01 | Watanabe M & Co Ltd | Vaporizer, various apparatus including the same and method of vaporization |
| JP2006523810A (ja) | 2003-04-14 | 2006-10-19 | スワゲロック カンパニー | ダイヤフラムバルブシート |
| JP4035728B2 (ja) | 2003-07-07 | 2008-01-23 | Ｓｍｃ株式会社 | サックバックバルブ |
| JP2005101454A (ja) * | 2003-09-26 | 2005-04-14 | Watanabe Shoko:Kk | 気化器 |
| JP4607474B2 (ja) * | 2004-02-12 | 2011-01-05 | 東京エレクトロン株式会社 | 成膜装置 |
| JP2006352001A (ja) | 2005-06-20 | 2006-12-28 | Dainippon Screen Mfg Co Ltd | 処理ガス供給装置および基板処理装置 |
| US20100022097A1 (en) * | 2006-02-27 | 2010-01-28 | Youtec Co., Ltd. | Vaporizer, semiconductor production apparatus and process of semiconductor production |
| JP2009038047A (ja) | 2006-04-26 | 2009-02-19 | Entegris Inc | 液体気化装置 |
| JP5385002B2 (ja) * | 2008-06-16 | 2014-01-08 | 株式会社日立国際電気 | 基板処理装置及び半導体デバイスの製造方法 |
-
2010
- 2010-03-30 CN CN201080027864.2A patent/CN102470282B/zh active Active
- 2010-03-30 KR KR1020127008289A patent/KR101234409B1/ko active Active
- 2010-03-30 JP JP2010537983A patent/JP4673449B1/ja active Active
- 2010-03-30 US US13/498,902 patent/US8361231B2/en active Active
- 2010-03-30 WO PCT/JP2010/055652 patent/WO2011040067A1/ja not_active Ceased
- 2010-06-23 TW TW099120490A patent/TWI414361B/zh active
-
2011
- 2011-01-12 JP JP2011003760A patent/JP5410456B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099653A (en) * | 1997-12-12 | 2000-08-08 | Advanced Technology Materials, Inc. | Liquid reagent delivery system with constant thermal loading of vaporizer |
| JP2005057193A (ja) * | 2003-08-07 | 2005-03-03 | Shimadzu Corp | 気化器 |
| US7368047B2 (en) * | 2005-11-11 | 2008-05-06 | Byung Chul Park | Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5410456B2 (ja) | 2014-02-05 |
| KR20120049387A (ko) | 2012-05-16 |
| US20120180724A1 (en) | 2012-07-19 |
| JPWO2011040067A1 (ja) | 2013-02-21 |
| CN102470282A (zh) | 2012-05-23 |
| TW201111043A (en) | 2011-04-01 |
| KR101234409B1 (ko) | 2013-02-18 |
| CN102470282B (zh) | 2013-02-13 |
| WO2011040067A1 (ja) | 2011-04-07 |
| JP2011097088A (ja) | 2011-05-12 |
| JP4673449B1 (ja) | 2011-04-20 |
| US8361231B2 (en) | 2013-01-29 |
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