TWI414361B - Liquid vaporization system - Google Patents

Liquid vaporization system Download PDF

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Publication number
TWI414361B
TWI414361B TW099120490A TW99120490A TWI414361B TW I414361 B TWI414361 B TW I414361B TW 099120490 A TW099120490 A TW 099120490A TW 99120490 A TW99120490 A TW 99120490A TW I414361 B TWI414361 B TW I414361B
Authority
TW
Taiwan
Prior art keywords
liquid
liquid material
diaphragm
vaporizer
pump
Prior art date
Application number
TW099120490A
Other languages
English (en)
Chinese (zh)
Other versions
TW201111043A (en
Inventor
纐纈雅之
板藤寬
Original Assignee
Ｃｋｄ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｃｋｄ股份有限公司 filed Critical Ｃｋｄ股份有限公司
Publication of TW201111043A publication Critical patent/TW201111043A/zh
Application granted granted Critical
Publication of TWI414361B publication Critical patent/TWI414361B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D1/00—Evaporating
    • B01D1/22—Evaporating by bringing a thin layer of the liquid into contact with a heated surface
    • B01D1/221—Composite plate evaporators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J7/00—Apparatus for generating gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Nozzles (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
TW099120490A 2009-09-30 2010-06-23 Liquid vaporization system TWI414361B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009226691 2009-09-30
PCT/JP2010/055652 WO2011040067A1 (ja) 2009-09-30 2010-03-30 液体気化システム

Publications (2)

Publication Number Publication Date
TW201111043A TW201111043A (en) 2011-04-01
TWI414361B true TWI414361B (zh) 2013-11-11

Family

ID=43825904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099120490A TWI414361B (zh) 2009-09-30 2010-06-23 Liquid vaporization system

Country Status (6)

Country Link
US (1) US8361231B2 (enExample)
JP (2) JP4673449B1 (enExample)
KR (1) KR101234409B1 (enExample)
CN (1) CN102470282B (enExample)
TW (1) TWI414361B (enExample)
WO (1) WO2011040067A1 (enExample)

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JP5368393B2 (ja) * 2010-08-05 2013-12-18 東京エレクトロン株式会社 気化装置、基板処理装置及び塗布現像装置
KR101845580B1 (ko) 2011-01-19 2018-04-04 시케이디 가부시키가이샤 액체 기화기
US8752544B2 (en) 2011-03-21 2014-06-17 General Electric Company Medical vaporizer and method of monitoring of a medical vaporizer
EP2699710A1 (en) * 2011-04-20 2014-02-26 Koninklijke Philips N.V. Measurement device and method for vapour deposition applications
JP5810004B2 (ja) * 2012-02-27 2015-11-11 Ckd株式会社 液体制御装置
KR101892758B1 (ko) 2011-09-30 2018-10-04 시케이디 가부시키가이샤 액체 제어 장치
JP5989944B2 (ja) 2011-09-30 2016-09-07 Ckd株式会社 液体制御装置
JP5973178B2 (ja) 2012-02-01 2016-08-23 Ckd株式会社 液体制御装置
JP5919089B2 (ja) * 2012-05-15 2016-05-18 Ckd株式会社 液体制御装置
JP5919115B2 (ja) * 2012-07-12 2016-05-18 Ckd株式会社 液体制御装置、及び液体制御装置に適用される網状体組立体
JP5792390B2 (ja) * 2012-07-30 2015-10-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
US8977115B2 (en) * 2013-03-08 2015-03-10 Steris Inc. Vaporizer with secondary flow path
US10490429B2 (en) 2014-11-26 2019-11-26 Applied Materials, Inc. Substrate carrier using a proportional thermal fluid delivery system
US9983892B2 (en) 2015-11-06 2018-05-29 Samsung Electronics Co., Ltd. Deep linking to mobile application states through programmatic replay of user interface events
JP6626322B2 (ja) * 2015-11-27 2019-12-25 Ckd株式会社 気体圧駆動機器、及びその制御方法
US10610659B2 (en) 2017-03-23 2020-04-07 General Electric Company Gas mixer incorporating sensors for measuring flow and concentration
US10946160B2 (en) 2017-03-23 2021-03-16 General Electric Company Medical vaporizer with carrier gas characterization, measurement, and/or compensation
US20190351443A1 (en) * 2018-05-17 2019-11-21 Indose Inc. Vaporizer with clog-free channel
KR101913556B1 (ko) * 2018-06-01 2018-10-31 주식회사 태진중공업 강제 송풍 대기식 기화기
TWI697352B (zh) * 2019-05-08 2020-07-01 翁子勝 液體蒸發裝置
CN115279941B (zh) * 2020-03-23 2024-09-24 株式会社堀场Stec 气化系统和气化装置的固定方法
JP2023176814A (ja) * 2022-05-31 2023-12-13 ワッティー株式会社 集積化ガスシステム用加熱器
CN118653196B (zh) * 2024-08-19 2025-01-21 宁波劳伦斯表面技术有限公司 一种常温蒸发系统
CN119733256B (zh) * 2025-03-04 2025-06-13 泉州泉港区正源新材料有限公司 一种用于甲缩醛精制的脱轻塔
CN120057903B (zh) * 2025-04-25 2025-07-18 新疆中蓄电新材料有限公司 一种气溶胶辅助制备单壁碳纳米管系统和方法

Citations (3)

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US6099653A (en) * 1997-12-12 2000-08-08 Advanced Technology Materials, Inc. Liquid reagent delivery system with constant thermal loading of vaporizer
JP2005057193A (ja) * 2003-08-07 2005-03-03 Shimadzu Corp 気化器
US7368047B2 (en) * 2005-11-11 2008-05-06 Byung Chul Park Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating

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JP3074871B2 (ja) * 1991-12-05 2000-08-07 石川島播磨重工業株式会社 Ｃｖｄ用原料蒸発器
EP0602595B1 (en) 1992-12-15 1997-07-23 Applied Materials, Inc. Vaporizing reactant liquids for CVD
JP2870719B2 (ja) 1993-01-29 1999-03-17 東京エレクトロン株式会社 処理装置
JP2872891B2 (ja) 1993-08-06 1999-03-24 株式会社東芝 気化装置
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JP3938391B2 (ja) * 1997-06-04 2007-06-27 シーケーディ株式会社 液体原料の気化装置
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JP2001295050A (ja) 2000-04-11 2001-10-26 Sony Corp 気化器、気化器の使用方法および液体原料の気化方法
JP2003268552A (ja) * 2002-03-18 2003-09-25 Watanabe Shoko:Kk 気化器及びそれを用いた各種装置並びに気化方法
EP1533835A1 (en) * 2002-05-29 2005-05-25 Kabushiki Kaisha Watanabe Shoko Vaporizer, various apparatuses including the same and method of vaporization
US20070045587A1 (en) 2003-04-14 2007-03-01 Terrence Kolenc Diaphragm valve seat
JP4035728B2 (ja) 2003-07-07 2008-01-23 Ｓｍｃ株式会社 サックバックバルブ
JP2005101454A (ja) * 2003-09-26 2005-04-14 Watanabe Shoko:Kk 気化器
JP4607474B2 (ja) * 2004-02-12 2011-01-05 東京エレクトロン株式会社 成膜装置
JP2006352001A (ja) * 2005-06-20 2006-12-28 Dainippon Screen Mfg Co Ltd 処理ガス供給装置および基板処理装置
WO2007097024A1 (ja) * 2006-02-27 2007-08-30 Youtec Co., Ltd. 気化器、半導体製造装置及び半導体製造方法
JP2009038047A (ja) * 2006-04-26 2009-02-19 Entegris Inc 液体気化装置
JP5385002B2 (ja) * 2008-06-16 2014-01-08 株式会社日立国際電気 基板処理装置及び半導体デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099653A (en) * 1997-12-12 2000-08-08 Advanced Technology Materials, Inc. Liquid reagent delivery system with constant thermal loading of vaporizer
JP2005057193A (ja) * 2003-08-07 2005-03-03 Shimadzu Corp 気化器
US7368047B2 (en) * 2005-11-11 2008-05-06 Byung Chul Park Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating

Also Published As

Publication number Publication date
TW201111043A (en) 2011-04-01
JP5410456B2 (ja) 2014-02-05
JP4673449B1 (ja) 2011-04-20
US20120180724A1 (en) 2012-07-19
JP2011097088A (ja) 2011-05-12
KR20120049387A (ko) 2012-05-16
JPWO2011040067A1 (ja) 2013-02-21
CN102470282A (zh) 2012-05-23
WO2011040067A1 (ja) 2011-04-07
CN102470282B (zh) 2013-02-13
US8361231B2 (en) 2013-01-29
KR101234409B1 (ko) 2013-02-18

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