JP2012502796A5 - - Google Patents

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Publication number
JP2012502796A5
JP2012502796A5 JP2011528058A JP2011528058A JP2012502796A5 JP 2012502796 A5 JP2012502796 A5 JP 2012502796A5 JP 2011528058 A JP2011528058 A JP 2011528058A JP 2011528058 A JP2011528058 A JP 2011528058A JP 2012502796 A5 JP2012502796 A5 JP 2012502796A5
Authority
JP
Japan
Prior art keywords
supply device
fluid supply
fluid
tube member
difficult
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011528058A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012502796A (ja
Filing date
Publication date
Priority claimed from US12/284,418 external-priority patent/US20100071614A1/en
Application filed filed Critical
Publication of JP2012502796A publication Critical patent/JP2012502796A/ja
Publication of JP2012502796A5 publication Critical patent/JP2012502796A5/ja
Pending legal-status Critical Current

Links

JP2011528058A 2008-09-22 2009-09-22 流体供給装置及びその形成方法 Pending JP2012502796A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/284,418 US20100071614A1 (en) 2008-09-22 2008-09-22 Fluid distribution apparatus and method of forming the same
US12/284,418 2008-09-22
PCT/US2009/057803 WO2010033973A1 (en) 2008-09-22 2009-09-22 Fluid distribution apparatus and method of forming the same

Publications (2)

Publication Number Publication Date
JP2012502796A JP2012502796A (ja) 2012-02-02
JP2012502796A5 true JP2012502796A5 (enExample) 2013-05-23

Family

ID=42036317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011528058A Pending JP2012502796A (ja) 2008-09-22 2009-09-22 流体供給装置及びその形成方法

Country Status (5)

Country Link
US (1) US20100071614A1 (enExample)
EP (1) EP2328832A1 (enExample)
JP (1) JP2012502796A (enExample)
CN (1) CN102159495A (enExample)
WO (1) WO2010033973A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130145989A1 (en) * 2011-12-12 2013-06-13 Intermolecular, Inc. Substrate processing tool showerhead
TWI754765B (zh) * 2017-08-25 2022-02-11 美商應用材料股份有限公司 用於磊晶沉積製程之注入組件

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62132798A (ja) * 1985-12-03 1987-06-16 Denki Kagaku Kogyo Kk 化合物半導体育成用るつぼとその製造方法
US4774416A (en) * 1986-09-24 1988-09-27 Plaser Corporation Large cross-sectional area molecular beam source for semiconductor processing
DE3713987A1 (de) * 1987-04-27 1988-11-10 Siemens Ag Verfahren zur herstellung einer strukturierten keramikfolie bzw. eines aus solchen folien aufgebauten keramikkoerpers
JPH03272587A (ja) * 1990-03-22 1991-12-04 Oki Electric Ind Co Ltd 耐食性部材
US5460684A (en) * 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
KR950020993A (ko) * 1993-12-22 1995-07-26 김광호 반도체 제조장치
GB9411911D0 (en) * 1994-06-14 1994-08-03 Swan Thomas & Co Ltd Improvements in or relating to chemical vapour deposition
JP3360098B2 (ja) * 1995-04-20 2002-12-24 東京エレクトロン株式会社 処理装置のシャワーヘッド構造
JPH0945624A (ja) * 1995-07-27 1997-02-14 Tokyo Electron Ltd 枚葉式の熱処理装置
DE29517100U1 (de) * 1995-10-17 1997-02-13 Zimmer, Johannes, Klagenfurt Strömungsteilungs- und -umformungskörper
US6086677A (en) * 1998-06-16 2000-07-11 Applied Materials, Inc. Dual gas faceplate for a showerhead in a semiconductor wafer processing system
EP1242819A2 (en) * 1999-12-15 2002-09-25 Motorola, Inc. Apparatus for performing biological reactions
JP3654142B2 (ja) * 2000-01-20 2005-06-02 住友電気工業株式会社 半導体製造装置用ガスシャワー体
TWI297510B (enExample) * 2000-09-08 2008-06-01 Tokyo Electron Ltd
DE10100670A1 (de) * 2001-01-09 2002-08-14 Univ Braunschweig Tech Zuführvorrichtung für eine CVD-Anlage
JP2003209074A (ja) * 2002-01-11 2003-07-25 Shibaura Mechatronics Corp エッチング装置及びエッチング方法
US20040074898A1 (en) * 2002-10-21 2004-04-22 Mariner John T. Encapsulated graphite heater and process
US6955777B2 (en) * 2003-01-07 2005-10-18 International Business Machines Corporation Method of forming a plate for dispensing chemicals
US20050069462A1 (en) * 2003-09-30 2005-03-31 International Business Machines Corporation Microfluidics Packaging
US20060096946A1 (en) * 2004-11-10 2006-05-11 General Electric Company Encapsulated wafer processing device and process for making thereof
GB0426766D0 (en) * 2004-12-06 2005-01-12 Q Chip Ltd Device for fluid transport
US7799371B2 (en) * 2005-11-17 2010-09-21 Palo Alto Research Center Incorporated Extruding/dispensing multiple materials to form high-aspect ratio extruded structures
US8268078B2 (en) * 2006-03-16 2012-09-18 Tokyo Electron Limited Method and apparatus for reducing particle contamination in a deposition system
US7901509B2 (en) * 2006-09-19 2011-03-08 Momentive Performance Materials Inc. Heating apparatus with enhanced thermal uniformity and method for making thereof
JP2008114218A (ja) * 2006-10-11 2008-05-22 Canon Inc 流体処理装置および流体処理システム

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