JP2010523378A - 微細パターン形成方法 - Google Patents
微細パターン形成方法 Download PDFInfo
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- JP2010523378A JP2010523378A JP2010502950A JP2010502950A JP2010523378A JP 2010523378 A JP2010523378 A JP 2010523378A JP 2010502950 A JP2010502950 A JP 2010502950A JP 2010502950 A JP2010502950 A JP 2010502950A JP 2010523378 A JP2010523378 A JP 2010523378A
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- 238000000034 method Methods 0.000 title claims abstract description 72
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000000295 complement effect Effects 0.000 claims description 14
- 229920001971 elastomer Polymers 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- -1 polyethylene Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 description 11
- 238000007645 offset printing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000007611 bar coating method Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F3/00—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
- B41F3/02—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed with impression cylinder or cylinders rotating unidirectionally
- B41F3/06—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed with impression cylinder or cylinders rotating unidirectionally continuously
- B41F3/10—Two-revolution presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F3/00—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
- B41F3/18—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed of special construction or for particular purposes
- B41F3/36—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed of special construction or for particular purposes for intaglio or heliogravure printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/003—Preparing for use and conserving printing surfaces of intaglio formes, e.g. application of a wear-resistant coating, such as chrome, on the already-engraved plate or cylinder; Preparing for reuse, e.g. removing of the Ballard shell; Correction of the engraving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Printing Methods (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
【選択図】図2
Description
まず、陰刻にパターニングされたハードモールド215にクリシェ形成用フィルム214を密着させて使い捨てクリシェを製造する(S1)。
次いで、弾性ブランケットシリンダー211に微細パターン形成用インクまたは樹脂212を塗布する(S2)。 前記弾性ブランケットシリンダー211は代表的に、円筒状ロールの外部に弾性ゴムをコートすることによって製造されるか、弾性ゴムを含んでなった平板パッドを円筒状ロールの外部に装着することによっても製造されることができる。ここで、前記弾性ゴムとしてはシリコーンゴムを代表的に用いることができるが、これに必ず限定されるのではない。微細パターン形成のための前記インク及び樹脂212は、関連分野で通常使われるものが制限なく使うことができ、その中で熱硬化型または光硬化型であることが望ましい。前記インクまたは樹脂212を弾性ブランケットシリンダー211に塗布する方法は、スロットダイコーティング法、バーコーティング法、ナイフコーティング法及びロールコーティング法などの多様なコーティング法を挙げることができるが、これに限定されるのではない。
次いで、インクまたは樹脂212が塗布された前記弾性ブランケットシリンダー211を使い捨てクリシェに圧着してクリシェの相対的に突出された陽刻部分と接する部分のインクまたは樹脂を弾性ブランケットシリンダー211面からクリシェの陽刻部分に転写させて除去し(S3)、これを通じて弾性ブランケットシリンダー211面に塗布されたインクまたは樹脂212に所望のパターンが形成される。
前記段階を経由すれば、弾性ブランケットシリンダー211面にインクまたは樹脂212のパターンが形成されており、そのパターンを基材に転写すれば基材上部面に微細パターンが形成される。
Claims (13)
- (S1)陰刻にパターニングされたハードモールドにクリシェ形成用フィルムを密着させて使い捨てクリシェを製造する段階;
(S2)弾性ブランケットシリンダーにインクまたは樹脂を塗布する段階;
(S3)前記弾性ブランケットシリンダーを前記使い捨てクリシェに圧着して前記使い捨てクリシェの相対的に突出された陽刻部分と接する部分に塗布された前記弾性ブランケットシリンダー面のインクまたは樹脂を除去する段階;及び
(S4)前記弾性ブランケットシリンダー面に残ったインクまたは樹脂を基材に転写させる段階;を含んでなることを特徴とする微細パターン形成方法。 - 前記(S1)段階は、前記ハードモールドに空気吸入のためのホールを開け、前記ホールを通じて空気を吸入して前記クリシェ形成用フィルムを前記ハードモールドに真空密着させて使い捨てクリシェを製造することを特徴とする請求項1に記載の微細パターン形成方法。
- 前記(S1)段階は、前記クリシェ形成用フィルムを前記ハードモールドと相補的なパターンを有する相補ハードモールド及び前記ハードモールドの間に置き、前記相補ハードモールド及び前記ハードモールドを圧着して嵌合させた後、前記相補ハードモールドを脱去させて使い捨てクリシェを製造することを特徴とする請求項1に記載の微細パターン形成方法。
- 前記ハードモールドは、ガラス、金属、金属酸化物及びプラスチックからなる群より選択される物質を用いて製造されたことを特徴とする請求項1に記載の微細パターン形成方法。
- 前記ハードモールドは、湿式食刻法、乾式食刻法、フォトリソグラフィー法及びレーザー成形法のうち選択された一つの方法によって陰刻パターニングされたことを特徴とする請求項1に記載の微細パターン形成方法。
- 前記クリシェ形成用フィルムは、その厚さが70? 以下であることを特徴とする請求項1に記載の微細パターン形成方法。
- 前記クリシェ形成用フィルムは、その表面エネルギーが前記インクの表面エネルギーより高いことを特徴とする請求項1に記載の微細パターン形成方法。
- 前記クリシェ形成用フィルムは、ポリエチレンフィルム、ポリエチレンテレフタレートフィルム及びアルミニウムフィルムのうち選択された一つのフィルムであることを特徴とする請求項7に記載の微細パターン形成方法。
- 前記弾性ブランケットシリンダーは、円筒状ロールの外部に弾性ゴムがコートされて製造されたことを特徴とする請求項1に記載の微細パターン形成方法。
- 前記弾性ブランケットシリンダーは、弾性ゴムを含んでなった平板パッドを円筒状ロールの外部に装着させて製造されたことを特徴とする請求項1に記載の微細パターン形成方法。
- 前記弾性ゴムは、シリコーンゴムであることを特徴とする請求項9または請求項10に記載の微細パターン形成方法。
- 前記インクは、熱硬化型または光硬化型であることを特徴とする請求項1に記載の微細パターン形成方法。
- 前記樹脂は、熱硬化型または光硬化型であることを特徴とする請求項1に記載の微細パターン形成方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070036402A KR100957703B1 (ko) | 2007-04-13 | 2007-04-13 | 미세패턴 형성 방법 |
KR10-2007-0036402 | 2007-04-13 | ||
PCT/KR2008/002094 WO2008127055A1 (en) | 2007-04-13 | 2008-04-14 | Method for forming fine patterns |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010523378A true JP2010523378A (ja) | 2010-07-15 |
JP2010523378A5 JP2010523378A5 (ja) | 2012-03-08 |
JP5044691B2 JP5044691B2 (ja) | 2012-10-10 |
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ID=39864104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010502950A Active JP5044691B2 (ja) | 2007-04-13 | 2008-04-14 | 微細パターン形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9365025B2 (ja) |
JP (1) | JP5044691B2 (ja) |
KR (1) | KR100957703B1 (ja) |
CN (1) | CN101657883B (ja) |
TW (1) | TWI388433B (ja) |
WO (1) | WO2008127055A1 (ja) |
Cited By (1)
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KR101445442B1 (ko) * | 2011-02-24 | 2014-09-26 | 주식회사 엘지화학 | 롤 프린팅 장치 및 이를 이용한 롤 프린팅 방법 |
WO2012124979A2 (ko) | 2011-03-15 | 2012-09-20 | 주식회사 엘지화학 | 도전성 잉크 조성물, 이를 이용한 인쇄 방법 및 이에 의하여 제조된 도전성 패턴 |
KR101324493B1 (ko) * | 2011-03-22 | 2013-11-01 | (주)뉴옵틱스 | 원통 금형에 패턴을 복제하는 방법 |
TWI481510B (zh) * | 2011-06-10 | 2015-04-21 | Au Optronics Corp | 移印方法 |
KR101094864B1 (ko) * | 2011-07-07 | 2011-12-15 | 한국기계연구원 | 일회용 클리쉐를 이용한 리버스 그라비아 옵셋 인쇄 방법 및 장치 |
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CN104520971A (zh) * | 2012-08-07 | 2015-04-15 | 株式会社Lg化学 | 印刷品及这种印刷品的制造方法 |
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KR102702952B1 (ko) * | 2024-05-02 | 2024-09-04 | (주)서린 | 가공이 용이한 수용성 바인더를 이용한 세라믹 소재의 제조방법 및 이에 따라 제조된 세라믹 물품 |
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KR101147079B1 (ko) * | 2005-08-25 | 2012-05-17 | 엘지디스플레이 주식회사 | 인쇄판의 제조방법 |
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JP2014529819A (ja) * | 2011-12-23 | 2014-11-13 | エルジー・ケム・リミテッド | タッチパネルおよびそれを含むディスプレイ装置 |
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KR20080092707A (ko) | 2008-10-16 |
TW200848267A (en) | 2008-12-16 |
JP5044691B2 (ja) | 2012-10-10 |
US9365025B2 (en) | 2016-06-14 |
TWI388433B (zh) | 2013-03-11 |
WO2008127055A1 (en) | 2008-10-23 |
CN101657883B (zh) | 2012-06-06 |
CN101657883A (zh) | 2010-02-24 |
US20100139513A1 (en) | 2010-06-10 |
KR100957703B1 (ko) | 2010-05-12 |
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