JP2010522259A - ポリアミド樹脂組成物 - Google Patents
ポリアミド樹脂組成物 Download PDFInfo
- Publication number
- JP2010522259A JP2010522259A JP2009554581A JP2009554581A JP2010522259A JP 2010522259 A JP2010522259 A JP 2010522259A JP 2009554581 A JP2009554581 A JP 2009554581A JP 2009554581 A JP2009554581 A JP 2009554581A JP 2010522259 A JP2010522259 A JP 2010522259A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- copper
- polyamide
- weight percent
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 claims abstract description 52
- 239000004952 Polyamide Substances 0.000 claims abstract description 18
- 229920002647 polyamide Polymers 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003365 glass fiber Substances 0.000 claims abstract description 11
- 239000002667 nucleating agent Substances 0.000 claims abstract description 9
- 239000006229 carbon black Substances 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000000454 talc Substances 0.000 claims description 8
- 229910052623 talc Inorganic materials 0.000 claims description 8
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical class [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims description 3
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 abstract description 7
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 7
- 229920000642 polymer Polymers 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229920002302 Nylon 6,6 Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- -1 copper halide Chemical class 0.000 description 3
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical group I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 3
- 239000010687 lubricating oil Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 2
- 229910021594 Copper(II) fluoride Inorganic materials 0.000 description 2
- 229920000572 Nylon 6/12 Polymers 0.000 description 2
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- GWFAVIIMQDUCRA-UHFFFAOYSA-L copper(ii) fluoride Chemical compound [F-].[F-].[Cu+2] GWFAVIIMQDUCRA-UHFFFAOYSA-L 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 description 1
- OBITVTZBIATBCL-UHFFFAOYSA-L copper;decanoate Chemical compound [Cu+2].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O OBITVTZBIATBCL-UHFFFAOYSA-L 0.000 description 1
- BQVVSSAWECGTRN-UHFFFAOYSA-L copper;dithiocyanate Chemical compound [Cu+2].[S-]C#N.[S-]C#N BQVVSSAWECGTRN-UHFFFAOYSA-L 0.000 description 1
- JDPSPYBMORZJOD-UHFFFAOYSA-L copper;dodecanoate Chemical compound [Cu+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O JDPSPYBMORZJOD-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000013873 oxidized polyethylene wax Nutrition 0.000 description 1
- MLCHBQKMVKNBOV-UHFFFAOYSA-N phenylphosphinic acid Chemical compound OP(=O)C1=CC=CC=C1 MLCHBQKMVKNBOV-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0083—Nucleating agents promoting the crystallisation of the polymer matrix
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US91898907P | 2007-03-19 | 2007-03-19 | |
| PCT/US2008/003706 WO2008115562A1 (en) | 2007-03-19 | 2008-03-20 | Polyamide resin compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010522259A true JP2010522259A (ja) | 2010-07-01 |
| JP2010522259A5 JP2010522259A5 (enExample) | 2011-04-14 |
Family
ID=39434247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009554581A Pending JP2010522259A (ja) | 2007-03-19 | 2008-03-19 | ポリアミド樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2121820B1 (enExample) |
| JP (1) | JP2010522259A (enExample) |
| CN (1) | CN101918482B (enExample) |
| AT (1) | ATE488546T1 (enExample) |
| DE (1) | DE602008003529D1 (enExample) |
| WO (1) | WO2008115562A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014037525A (ja) * | 2012-07-18 | 2014-02-27 | Asahi Kasei Chemicals Corp | ポリアミド樹脂組成物及び成形品 |
| JP2014080611A (ja) * | 2012-09-28 | 2014-05-08 | Kuraray Co Ltd | ポリアミド樹脂組成物 |
| JP2015013984A (ja) * | 2013-06-05 | 2015-01-22 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物及び成形体 |
| JP2015048424A (ja) * | 2013-09-02 | 2015-03-16 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物及び成形品 |
| JP2017014387A (ja) * | 2015-07-01 | 2017-01-19 | 旭化成株式会社 | ポリアミド樹脂組成物および成形品 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9399314B2 (en) * | 2009-03-04 | 2016-07-26 | Dsm Ip Assets B.V. | Process for preparing injection molded parts with decreased glass fiber read out |
| EA022432B1 (ru) * | 2010-10-18 | 2015-12-30 | ДСМ АйПи АССЕТС Б.В. | Термостабилизированная полиамидная композиция |
| CN102532884A (zh) * | 2010-12-21 | 2012-07-04 | 上海日之升新技术发展有限公司 | 可用于汽车散热器罩盖的尼龙66组合物及其制备方法 |
| CN102311638B (zh) * | 2010-12-21 | 2012-12-19 | 深圳市科聚新材料有限公司 | 一种耐水解耐醇解玻纤增强ppa材料及其制备方法 |
| CN102115593B (zh) * | 2011-03-16 | 2012-08-22 | 金发科技股份有限公司 | 一种聚酰胺模塑组合物 |
| CN104761886B (zh) * | 2014-01-08 | 2018-08-14 | 旭化成株式会社 | 聚酰胺树脂组合物及成形品 |
| CN110317452A (zh) * | 2018-03-30 | 2019-10-11 | 三菱电机(中国)有限公司 | 热塑性聚合物组合物 |
| CN109666294B (zh) * | 2018-12-27 | 2021-08-20 | 会通新材料(上海)有限公司 | 一种结晶速率提升的聚酰胺56组合物及其应用 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032847A (ja) * | 1983-08-03 | 1985-02-20 | Asahi Chem Ind Co Ltd | 反り変形を改良した強化ポリアミド樹脂組成物 |
| JPH05194841A (ja) * | 1992-01-21 | 1993-08-03 | Toray Ind Inc | ポリアミド樹脂組成物 |
| JPH0948909A (ja) * | 1995-08-02 | 1997-02-18 | Kanebo Ltd | 押出成形用樹脂組成物及びその押出成形品 |
| JPH10219107A (ja) * | 1997-02-13 | 1998-08-18 | Toray Ind Inc | 溶着成形用樹脂組成物 |
| JP2000129121A (ja) * | 1998-10-28 | 2000-05-09 | Toray Ind Inc | 振動溶着用樹脂組成物及び成形品 |
| JP2001011055A (ja) * | 1999-06-30 | 2001-01-16 | Orient Chem Ind Ltd | ニグロシン系化合物及びその関連技術 |
| JP2001011307A (ja) * | 1998-10-26 | 2001-01-16 | Toray Ind Inc | 溶着用樹脂組成物、その製造方法、及び溶着樹脂成形体 |
| WO2008123327A1 (ja) * | 2007-03-19 | 2008-10-16 | Denso Corporation | 自動車冷却システム構成部品 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19925221B4 (de) | 1998-06-02 | 2017-05-18 | Asahi Kasei Kabushiki Kaisha | Schwarz gefärbte verstärkte Polyamidharz-Zusammensetzung |
| KR100640714B1 (ko) * | 1998-10-26 | 2006-10-31 | 도레이 가부시끼가이샤 | 용착용 수지조성물, 그것의 제조법 및 성형품 |
| DE60033608T2 (de) * | 1999-09-29 | 2007-11-22 | Toyo Boseki K.K. | Anorganisch verstärkte Polyamid-Harz-Zusammensetzungen |
| JP2003277605A (ja) | 2002-03-27 | 2003-10-02 | Asahi Kasei Corp | 水に接触する成形品用樹脂組成物 |
| JP2004315606A (ja) | 2003-04-14 | 2004-11-11 | Asahi Kasei Chemicals Corp | ポリアミド樹脂成形体 |
| DE102004022963A1 (de) | 2004-05-10 | 2005-12-08 | Ems-Chemie Ag | Thermoplastische Polyamid-Formmassen |
| US8299160B2 (en) | 2006-04-27 | 2012-10-30 | Asahi Kasei Chemicals Corporation | Resin composition and automobile under-hood parts thereof |
| CN101506286B (zh) | 2006-08-23 | 2011-09-21 | 巴斯夫欧洲公司 | 具有改进的热老化和水解稳定性的聚酰胺模塑材料 |
-
2008
- 2008-03-19 EP EP08727043A patent/EP2121820B1/en active Active
- 2008-03-19 DE DE602008003529T patent/DE602008003529D1/de active Active
- 2008-03-19 AT AT08727043T patent/ATE488546T1/de not_active IP Right Cessation
- 2008-03-19 JP JP2009554581A patent/JP2010522259A/ja active Pending
- 2008-03-20 WO PCT/US2008/003706 patent/WO2008115562A1/en not_active Ceased
- 2008-03-20 CN CN200880008974.7A patent/CN101918482B/zh active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6032847A (ja) * | 1983-08-03 | 1985-02-20 | Asahi Chem Ind Co Ltd | 反り変形を改良した強化ポリアミド樹脂組成物 |
| JPH05194841A (ja) * | 1992-01-21 | 1993-08-03 | Toray Ind Inc | ポリアミド樹脂組成物 |
| JPH0948909A (ja) * | 1995-08-02 | 1997-02-18 | Kanebo Ltd | 押出成形用樹脂組成物及びその押出成形品 |
| JPH10219107A (ja) * | 1997-02-13 | 1998-08-18 | Toray Ind Inc | 溶着成形用樹脂組成物 |
| JP2001011307A (ja) * | 1998-10-26 | 2001-01-16 | Toray Ind Inc | 溶着用樹脂組成物、その製造方法、及び溶着樹脂成形体 |
| JP2000129121A (ja) * | 1998-10-28 | 2000-05-09 | Toray Ind Inc | 振動溶着用樹脂組成物及び成形品 |
| JP2001011055A (ja) * | 1999-06-30 | 2001-01-16 | Orient Chem Ind Ltd | ニグロシン系化合物及びその関連技術 |
| WO2008123327A1 (ja) * | 2007-03-19 | 2008-10-16 | Denso Corporation | 自動車冷却システム構成部品 |
| JP2008261620A (ja) * | 2007-03-19 | 2008-10-30 | Denso Corp | 自動車冷却システム構成部品 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014037525A (ja) * | 2012-07-18 | 2014-02-27 | Asahi Kasei Chemicals Corp | ポリアミド樹脂組成物及び成形品 |
| JP2014037526A (ja) * | 2012-07-18 | 2014-02-27 | Asahi Kasei Chemicals Corp | ポリアミド樹脂組成物及び成形品 |
| JP2014080611A (ja) * | 2012-09-28 | 2014-05-08 | Kuraray Co Ltd | ポリアミド樹脂組成物 |
| JP2015013984A (ja) * | 2013-06-05 | 2015-01-22 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物及び成形体 |
| JP2015048424A (ja) * | 2013-09-02 | 2015-03-16 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物及び成形品 |
| JP2017014387A (ja) * | 2015-07-01 | 2017-01-19 | 旭化成株式会社 | ポリアミド樹脂組成物および成形品 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2121820B1 (en) | 2010-11-17 |
| CN101918482B (zh) | 2013-09-04 |
| ATE488546T1 (de) | 2010-12-15 |
| WO2008115562A1 (en) | 2008-09-25 |
| EP2121820A1 (en) | 2009-11-25 |
| DE602008003529D1 (de) | 2010-12-30 |
| CN101918482A (zh) | 2010-12-15 |
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