JP2010506040A - 電気鋳造方法とこの方法によって得られた部品または層 - Google Patents

電気鋳造方法とこの方法によって得られた部品または層 Download PDF

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Publication number
JP2010506040A
JP2010506040A JP2009530878A JP2009530878A JP2010506040A JP 2010506040 A JP2010506040 A JP 2010506040A JP 2009530878 A JP2009530878 A JP 2009530878A JP 2009530878 A JP2009530878 A JP 2009530878A JP 2010506040 A JP2010506040 A JP 2010506040A
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JP
Japan
Prior art keywords
gold
copper
zinc
electroforming
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009530878A
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English (en)
Japanese (ja)
Inventor
ヨハンヒム グルップ
Original Assignee
ザ スウォッチ グループ リサーチ アンド ディベロップメント リミティド．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ザ スウォッチ グループ リサーチ アンド ディベロップメント リミティド． filed Critical ザ スウォッチ グループ リサーチ アンド ディベロップメント リミティド．
Publication of JP2010506040A publication Critical patent/JP2010506040A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adornments (AREA)
  • Laminated Bodies (AREA)
JP2009530878A 2006-10-03 2007-10-03 電気鋳造方法とこの方法によって得られた部品または層 Pending JP2010506040A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01583/06A CH714243B1 (fr) 2006-10-03 2006-10-03 Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
PCT/EP2007/060506 WO2008040761A2 (fr) 2006-10-03 2007-10-03 Procede d'electroformage et piece ou couche obtenue par ce procede

Publications (1)

Publication Number Publication Date
JP2010506040A true JP2010506040A (ja) 2010-02-25

Family

ID=38799403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009530878A Pending JP2010506040A (ja) 2006-10-03 2007-10-03 電気鋳造方法とこの方法によって得られた部品または層

Country Status (7)

Country Link
US (1) US20100024930A1 (fr)
EP (1) EP2079859A2 (fr)
JP (1) JP2010506040A (fr)
KR (1) KR101326883B1 (fr)
CN (1) CN101611176A (fr)
CH (1) CH714243B1 (fr)
WO (1) WO2008040761A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2505691B1 (fr) * 2011-03-31 2014-03-12 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N
CN102539217A (zh) * 2011-12-26 2012-07-04 昆山全亚冠环保科技有限公司 一种银金合金金相腐蚀剂以及金相显示方法
CN112725653A (zh) * 2020-12-21 2021-04-30 有研亿金新材料有限公司 一种新型高塑性金基电刷材料及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662984A (en) * 1979-10-25 1981-05-29 Seiko Epson Corp Gold plating constitution of external parts for watch
JPS5723089A (en) * 1980-05-31 1982-02-06 Degussa Alkaline bath for electrically precipitating gold alloy layer with low carat from rose color to yellow color
JPS6389694A (ja) * 1986-10-02 1988-04-20 エル・ペー・ヴェー−ヘミー、ゲゼルシャフト、ミツト、ベシュレンクテル、ハフツング 低カラットの金／銅／亜鉛合金の電気メツキ方法
US4980035A (en) * 1987-08-21 1990-12-25 Engelhard Corporation Bath for electrolytic deposition of a gold-copper-zinc alloy
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
EP0480876A2 (fr) * 1990-10-08 1992-04-15 Metaux Precieux Sa Metalor Dépôt electrolytique sous forme d'un alliage d'or contenant du cuivre et du zinc ainsi que son procédé de production

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596454A (en) * 1949-09-10 1952-05-13 Metals & Controls Corp Gold alloys
US2660554A (en) * 1950-11-10 1953-11-24 Barnet D Ostrow Bright gold and gold alloy plating baths
CH286123A (fr) * 1952-05-08 1952-10-15 Spreter Victor Bain pour le dépôt par voie galvanique d'alliages d'or.
US2976180A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of silver plating by chemical reduction
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
CH622829A5 (fr) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
JPH01247540A (ja) * 1988-03-29 1989-10-03 Seiko Instr Inc 硬質金合金外装部品の製造方法
DE3929569C1 (fr) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
US5244593A (en) * 1992-01-10 1993-09-14 The Procter & Gamble Company Colorless detergent compositions with enhanced stability
US5256275A (en) * 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
US5340529A (en) * 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
WO1997017482A1 (fr) * 1995-11-03 1997-05-15 Enthone-Omi Inc. Procedes de depot electrolytique, compositions et depots
JP3933930B2 (ja) * 1999-06-17 2007-06-20 デグサ ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング 光沢のある金層および金合金層を電着するための酸性浴および電着用光沢剤
JP4023138B2 (ja) * 2001-02-07 2007-12-19 日立金属株式会社 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
EP1548525B2 (fr) * 2003-12-23 2017-08-16 Rolex Sa Elément en céramique pour boîte de montre et procédé de fabrication de cet élément
JP4566667B2 (ja) * 2004-01-16 2010-10-20 キヤノン株式会社 めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662984A (en) * 1979-10-25 1981-05-29 Seiko Epson Corp Gold plating constitution of external parts for watch
JPS5723089A (en) * 1980-05-31 1982-02-06 Degussa Alkaline bath for electrically precipitating gold alloy layer with low carat from rose color to yellow color
JPS6389694A (ja) * 1986-10-02 1988-04-20 エル・ペー・ヴェー−ヘミー、ゲゼルシャフト、ミツト、ベシュレンクテル、ハフツング 低カラットの金／銅／亜鉛合金の電気メツキ方法
US4980035A (en) * 1987-08-21 1990-12-25 Engelhard Corporation Bath for electrolytic deposition of a gold-copper-zinc alloy
EP0480876A2 (fr) * 1990-10-08 1992-04-15 Metaux Precieux Sa Metalor Dépôt electrolytique sous forme d'un alliage d'or contenant du cuivre et du zinc ainsi que son procédé de production
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys

Also Published As

Publication number Publication date
WO2008040761A2 (fr) 2008-04-10
WO2008040761A3 (fr) 2008-11-06
US20100024930A1 (en) 2010-02-04
CN101611176A (zh) 2009-12-23
KR20090069324A (ko) 2009-06-30
KR101326883B1 (ko) 2013-11-11
EP2079859A2 (fr) 2009-07-22
CH714243B1 (fr) 2019-04-15

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