CN101611176A - 电铸方法和由该方法得到的制件或层 - Google Patents
电铸方法和由该方法得到的制件或层 Download PDFInfo
- Publication number
- CN101611176A CN101611176A CNA2007800368276A CN200780036827A CN101611176A CN 101611176 A CN101611176 A CN 101611176A CN A2007800368276 A CNA2007800368276 A CN A2007800368276A CN 200780036827 A CN200780036827 A CN 200780036827A CN 101611176 A CN101611176 A CN 101611176A
- Authority
- CN
- China
- Prior art keywords
- weight
- electroforming
- gold
- layer
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 24
- 239000010931 gold Substances 0.000 claims abstract description 18
- 238000005323 electroforming Methods 0.000 claims abstract description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052737 gold Inorganic materials 0.000 claims abstract description 15
- 239000011701 zinc Substances 0.000 claims abstract description 15
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 11
- 230000008021 deposition Effects 0.000 claims description 10
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical group N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 238000007669 thermal treatment Methods 0.000 claims description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000013543 active substance Substances 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 229910052700 potassium Inorganic materials 0.000 claims description 6
- 239000011591 potassium Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 3
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N ortho-butylphenol Natural products CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 claims description 3
- 238000010791 quenching Methods 0.000 claims description 3
- 230000000171 quenching effect Effects 0.000 claims description 3
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 claims description 3
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical group [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 claims description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 claims description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 150000003751 zinc Chemical class 0.000 claims description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- 238000005868 electrolysis reaction Methods 0.000 description 8
- 229910052793 cadmium Inorganic materials 0.000 description 7
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 5
- 239000012071 phase Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002939 deleterious effect Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- -1 polyoxyethylene Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- FFRBMBIXVSCUFS-UHFFFAOYSA-N 2,4-dinitro-1-naphthol Chemical compound C1=CC=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FFRBMBIXVSCUFS-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- JRQIZBUXMVMQKA-UHFFFAOYSA-N [K].N#C[SeH] Chemical compound [K].N#C[SeH] JRQIZBUXMVMQKA-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229940026189 antimony potassium tartrate Drugs 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 229910001380 potassium hypophosphite Inorganic materials 0.000 description 1
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Adornments (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH01583/06A CH714243B1 (fr) | 2006-10-03 | 2006-10-03 | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| CH1583/06 | 2006-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101611176A true CN101611176A (zh) | 2009-12-23 |
Family
ID=38799403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800368276A Pending CN101611176A (zh) | 2006-10-03 | 2007-10-03 | 电铸方法和由该方法得到的制件或层 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100024930A1 (fr) |
| EP (1) | EP2079859A2 (fr) |
| JP (1) | JP2010506040A (fr) |
| KR (1) | KR101326883B1 (fr) |
| CN (1) | CN101611176A (fr) |
| CH (1) | CH714243B1 (fr) |
| WO (1) | WO2008040761A2 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539217A (zh) * | 2011-12-26 | 2012-07-04 | 昆山全亚冠环保科技有限公司 | 一种银金合金金相腐蚀剂以及金相显示方法 |
| CN102732920A (zh) * | 2011-03-31 | 2012-10-17 | 斯沃奇集团研究及开发有限公司 | 18开3n金合金的制备方法 |
| CN112725653A (zh) * | 2020-12-21 | 2021-04-30 | 有研亿金新材料有限公司 | 一种新型高塑性金基电刷材料及其制备方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2596454A (en) * | 1949-09-10 | 1952-05-13 | Metals & Controls Corp | Gold alloys |
| US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
| CH286123A (fr) * | 1952-05-08 | 1952-10-15 | Spreter Victor | Bain pour le dépôt par voie galvanique d'alliages d'or. |
| US2976180A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of silver plating by chemical reduction |
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
| US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
| DE2244434C3 (de) * | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
| CH622829A5 (fr) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
| JPS5662984A (en) * | 1979-10-25 | 1981-05-29 | Seiko Epson Corp | Gold plating constitution of external parts for watch |
| DE3020765A1 (de) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten |
| GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
| CH662583A5 (fr) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. |
| DE3633529A1 (de) * | 1986-10-02 | 1988-05-19 | Lpw Chemie Gmbh | Verfahren zum galvanischen abscheiden niedrigkaraetiger gold/kupfer/zink-legierungen |
| EP0304315B1 (fr) * | 1987-08-21 | 1993-03-03 | Engelhard Limited | Bain de déposition électrolytique d'un alliage or-cuivre-zinc |
| JPH01247540A (ja) * | 1988-03-29 | 1989-10-03 | Seiko Instr Inc | 硬質金合金外装部品の製造方法 |
| DE3929569C1 (fr) * | 1989-09-06 | 1991-04-18 | Degussa Ag, 6000 Frankfurt, De | |
| GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
| CH680927A5 (fr) * | 1990-10-08 | 1992-12-15 | Metaux Precieux Sa | |
| US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
| US5244593A (en) * | 1992-01-10 | 1993-09-14 | The Procter & Gamble Company | Colorless detergent compositions with enhanced stability |
| US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
| US5340529A (en) * | 1993-07-01 | 1994-08-23 | Dewitt Troy C | Gold jewelry alloy |
| DE69622431T2 (de) * | 1995-11-03 | 2003-01-30 | Enthone Omi Inc | Elektroplattierungsverfahren, zusammensetzungen und überzügen |
| WO2000079031A1 (fr) * | 1999-06-17 | 2000-12-28 | Degussa Galvanotechnik Gmbh | Bain acide pour deposer par voie electrolytique des couches d'or ou d'alliage d'or brillantes, et agent de brillantage prevu a cet effet |
| JP4023138B2 (ja) * | 2001-02-07 | 2007-12-19 | 日立金属株式会社 | 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石 |
| FR2828889B1 (fr) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
| EP1548525B2 (fr) * | 2003-12-23 | 2017-08-16 | Rolex Sa | Elément en céramique pour boîte de montre et procédé de fabrication de cet élément |
| JP4566667B2 (ja) * | 2004-01-16 | 2010-10-20 | キヤノン株式会社 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
| SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
-
2006
- 2006-10-03 CH CH01583/06A patent/CH714243B1/fr unknown
-
2007
- 2007-10-03 WO PCT/EP2007/060506 patent/WO2008040761A2/fr active Search and Examination
- 2007-10-03 US US12/444,046 patent/US20100024930A1/en not_active Abandoned
- 2007-10-03 KR KR1020097008807A patent/KR101326883B1/ko not_active IP Right Cessation
- 2007-10-03 EP EP07820883A patent/EP2079859A2/fr not_active Withdrawn
- 2007-10-03 JP JP2009530878A patent/JP2010506040A/ja active Pending
- 2007-10-03 CN CNA2007800368276A patent/CN101611176A/zh active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102732920A (zh) * | 2011-03-31 | 2012-10-17 | 斯沃奇集团研究及开发有限公司 | 18开3n金合金的制备方法 |
| CN102732920B (zh) * | 2011-03-31 | 2015-07-22 | 斯沃奇集团研究及开发有限公司 | 18开3n金合金的制备方法 |
| CN102539217A (zh) * | 2011-12-26 | 2012-07-04 | 昆山全亚冠环保科技有限公司 | 一种银金合金金相腐蚀剂以及金相显示方法 |
| CN112725653A (zh) * | 2020-12-21 | 2021-04-30 | 有研亿金新材料有限公司 | 一种新型高塑性金基电刷材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010506040A (ja) | 2010-02-25 |
| WO2008040761A3 (fr) | 2008-11-06 |
| US20100024930A1 (en) | 2010-02-04 |
| EP2079859A2 (fr) | 2009-07-22 |
| KR101326883B1 (ko) | 2013-11-11 |
| CH714243B1 (fr) | 2019-04-15 |
| KR20090069324A (ko) | 2009-06-30 |
| WO2008040761A2 (fr) | 2008-04-10 |
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