JP2010236088A - マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ - Google Patents

マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ Download PDF

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Publication number
JP2010236088A
JP2010236088A JP2010026112A JP2010026112A JP2010236088A JP 2010236088 A JP2010236088 A JP 2010236088A JP 2010026112 A JP2010026112 A JP 2010026112A JP 2010026112 A JP2010026112 A JP 2010026112A JP 2010236088 A JP2010236088 A JP 2010236088A
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JP
Japan
Prior art keywords
cleaning
mask member
mask
vapor deposition
deposition material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010026112A
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English (en)
Japanese (ja)
Inventor
Kenji Yumiba
賢治 弓場
Nobuhiro Nirasawa
信広 韮沢
Kenji Katagiri
賢司 片桐
Makoto Izaki
良 井崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2010026112A priority Critical patent/JP2010236088A/ja
Publication of JP2010236088A publication Critical patent/JP2010236088A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2010026112A 2009-03-09 2010-02-09 マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ Pending JP2010236088A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010026112A JP2010236088A (ja) 2009-03-09 2010-02-09 マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009054466 2009-03-09
JP2010026112A JP2010236088A (ja) 2009-03-09 2010-02-09 マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ

Publications (1)

Publication Number Publication Date
JP2010236088A true JP2010236088A (ja) 2010-10-21

Family

ID=42718148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010026112A Pending JP2010236088A (ja) 2009-03-09 2010-02-09 マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ

Country Status (4)

Country Link
JP (1) JP2010236088A (zh)
KR (1) KR101135657B1 (zh)
CN (1) CN101834118B (zh)
TW (1) TWI426962B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100101601A1 (en) * 2008-10-29 2010-04-29 Yoichi Takahara Cleaning equipment and cleaning method of deposition mask
US20130126490A1 (en) * 2011-11-17 2013-05-23 Imt Co., Ltd. Large-area mask cleaning apparatus using laser and large-area mask cleaning system including the same
JP2015017320A (ja) * 2013-07-08 2015-01-29 上海和輝光電有限公司Ｅｖｅｒｄｉｓｐｌａｙ Ｏｐｔｒｏｎｉｃｓ （Ｓｈａｎｇｈａｉ） Ｌｉｍｉｔｅｄ マスクに付着した有機物や汚れを除去する装置
WO2020021722A1 (ja) * 2018-07-27 2020-01-30 シャープ株式会社 表示デバイスの製造方法
CN111346861A (zh) * 2018-12-21 2020-06-30 三星显示有限公司 掩膜部件的清洗装置以及掩膜部件的清洗系统
CN111534790A (zh) * 2020-04-09 2020-08-14 常州高光半导体材料有限公司 一种金属掩膜版的清洗装置、清洗方法
CN114995052A (zh) * 2022-05-18 2022-09-02 上海图灵智算量子科技有限公司 光罩版清洁装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201323102A (zh) * 2011-12-15 2013-06-16 Dongwoo Fine Chem Co Ltd 清洗製造有機el裝置的氣相沉積掩模的方法及清洗液
KR101534832B1 (ko) * 2012-09-13 2015-07-07 주식회사 에스디앤티 습,건식 복합 마스크 세정장치
CN103341463B (zh) * 2013-07-01 2015-05-06 深圳市华星光电技术有限公司 超声波清洁装置
CN104152846B (zh) * 2014-02-21 2016-08-17 深圳浚漪科技有限公司 一种掩模板清洗系统
CN108267929A (zh) * 2017-01-03 2018-07-10 昆山国显光电有限公司 掩膜板的清洗方法及装置
WO2018236135A1 (ko) * 2017-06-20 2018-12-27 주식회사 다원시스 마스크의 세정 장치 및 마스크 세정 방법
KR20180138110A (ko) * 2017-06-20 2018-12-28 주식회사 다원시스 마스크의 세정 장치 및 마스크 세정 방법
CN107177818B (zh) * 2017-07-19 2019-05-21 武汉天马微电子有限公司 有机材料蒸镀用掩膜板
CN110026372A (zh) * 2019-03-29 2019-07-19 云谷（固安）科技有限公司 一种掩模版清洗装置
CN109976088A (zh) * 2019-04-03 2019-07-05 深圳市华星光电半导体显示技术有限公司 掩模板热清洗装置及掩模板的热清洗方法
KR102214104B1 (ko) * 2020-12-03 2021-02-09 주식회사 아성 레이저 클리닝을 이용한 마스크 프레임 표면처리 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197265A (ja) * 1995-01-18 1996-08-06 Dainippon Screen Mfg Co Ltd 基板のレーザ洗浄装置およびこれを用いた基板洗浄装置
JP2004103512A (ja) * 2002-09-12 2004-04-02 Fujitsu Ltd 有機ｅｌ素子の製造方法および製造装置
JP2004192851A (ja) * 2002-12-09 2004-07-08 Toray Eng Co Ltd メタルマスクの洗浄方法およびその装置
JP2006169573A (ja) * 2004-12-14 2006-06-29 Laser Gijutsu Sogo Kenkyusho 蒸着マスクのクリーニング方法、蒸着マスククリーニング装置、有機ｅｌ素子の製造方法、および、有機ｅｌ素子の製造装置
JP2006192426A (ja) * 2004-11-18 2006-07-27 Samsung Sdi Co Ltd マスク洗浄方法
JP2008293699A (ja) * 2007-05-22 2008-12-04 Toyota Industries Corp メタルマスクの浄化方法
JP2009117231A (ja) * 2007-11-08 2009-05-28 Hitachi Displays Ltd 有機ｅｌ表示装置の製造方法

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US5916374A (en) * 1998-02-09 1999-06-29 International Business Machines Corporation Optimized in-line mask cleaning system
DE19901002B4 (de) * 1999-01-13 2005-09-22 Infineon Technologies Ag Verfahren zum Strukturieren einer Schicht
CA2375365A1 (en) * 1999-05-27 2001-02-15 Patterning Technologies Limited Method of forming a masking pattern on a surface
US6984334B2 (en) 2000-06-08 2006-01-10 Canon Kabushiki Kaisha Method of manufacturing optical element
US6582875B1 (en) * 2002-01-23 2003-06-24 Eastman Kodak Company Using a multichannel linear laser light beam in making OLED devices by thermal transfer
US6703179B2 (en) * 2002-03-13 2004-03-09 Eastman Kodak Company Transfer of organic material from a donor to form a layer in an OLED device
JP2004097881A (ja) 2002-09-05 2004-04-02 Dainippon Screen Mfg Co Ltd 薄膜除去装置
KR100487834B1 (ko) * 2004-05-01 2005-05-09 주식회사 아이엠티 레이저를 이용한 패턴마스크 세정방법 및 장치
JP2008504714A (ja) * 2004-06-28 2008-02-14 ラム　リサーチ　コーポレーション 基板を洗浄及びエッチングするシステム及び方法
JP4267604B2 (ja) * 2004-09-01 2009-05-27 三洋電機株式会社 洗浄装置
JP2008147314A (ja) * 2006-12-07 2008-06-26 Canon Inc 洗浄装置及び方法、洗浄装置を有する露光装置
CN101226337A (zh) * 2007-01-17 2008-07-23 台湾积体电路制造股份有限公司 除去位于被护膜覆盖的掩模上的杂质的装置及方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197265A (ja) * 1995-01-18 1996-08-06 Dainippon Screen Mfg Co Ltd 基板のレーザ洗浄装置およびこれを用いた基板洗浄装置
JP2004103512A (ja) * 2002-09-12 2004-04-02 Fujitsu Ltd 有機ｅｌ素子の製造方法および製造装置
JP2004192851A (ja) * 2002-12-09 2004-07-08 Toray Eng Co Ltd メタルマスクの洗浄方法およびその装置
JP2006192426A (ja) * 2004-11-18 2006-07-27 Samsung Sdi Co Ltd マスク洗浄方法
JP2006169573A (ja) * 2004-12-14 2006-06-29 Laser Gijutsu Sogo Kenkyusho 蒸着マスクのクリーニング方法、蒸着マスククリーニング装置、有機ｅｌ素子の製造方法、および、有機ｅｌ素子の製造装置
JP2008293699A (ja) * 2007-05-22 2008-12-04 Toyota Industries Corp メタルマスクの浄化方法
JP2009117231A (ja) * 2007-11-08 2009-05-28 Hitachi Displays Ltd 有機ｅｌ表示装置の製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100101601A1 (en) * 2008-10-29 2010-04-29 Yoichi Takahara Cleaning equipment and cleaning method of deposition mask
US8182610B2 (en) * 2008-10-29 2012-05-22 Hitachi High-Technologies Corporation Cleaning equipment and cleaning method of deposition mask
US20130126490A1 (en) * 2011-11-17 2013-05-23 Imt Co., Ltd. Large-area mask cleaning apparatus using laser and large-area mask cleaning system including the same
JP2015017320A (ja) * 2013-07-08 2015-01-29 上海和輝光電有限公司Ｅｖｅｒｄｉｓｐｌａｙ Ｏｐｔｒｏｎｉｃｓ （Ｓｈａｎｇｈａｉ） Ｌｉｍｉｔｅｄ マスクに付着した有機物や汚れを除去する装置
WO2020021722A1 (ja) * 2018-07-27 2020-01-30 シャープ株式会社 表示デバイスの製造方法
CN111346861A (zh) * 2018-12-21 2020-06-30 三星显示有限公司 掩膜部件的清洗装置以及掩膜部件的清洗系统
CN111346861B (zh) * 2018-12-21 2023-09-22 三星显示有限公司 掩膜部件的清洗装置以及掩膜部件的清洗系统
CN111534790A (zh) * 2020-04-09 2020-08-14 常州高光半导体材料有限公司 一种金属掩膜版的清洗装置、清洗方法
CN114995052A (zh) * 2022-05-18 2022-09-02 上海图灵智算量子科技有限公司 光罩版清洁装置

Also Published As

Publication number Publication date
TWI426962B (zh) 2014-02-21
KR101135657B1 (ko) 2012-04-13
CN101834118B (zh) 2012-12-26
TW201105428A (en) 2011-02-16
CN101834118A (zh) 2010-09-15
KR20100101537A (ko) 2010-09-17

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