JP2010153864A5 - - Google Patents
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- Publication number
- JP2010153864A5 JP2010153864A5 JP2009287436A JP2009287436A JP2010153864A5 JP 2010153864 A5 JP2010153864 A5 JP 2010153864A5 JP 2009287436 A JP2009287436 A JP 2009287436A JP 2009287436 A JP2009287436 A JP 2009287436A JP 2010153864 A5 JP2010153864 A5 JP 2010153864A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- power transistor
- transistor device
- conductivity type
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000746 body region Anatomy 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 230000005669 field effect Effects 0.000 claims 3
- 230000005527 interface trap Effects 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 239000000969 carrier Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/317,294 US8093621B2 (en) | 2008-12-23 | 2008-12-23 | VTS insulated gate bipolar transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010153864A JP2010153864A (ja) | 2010-07-08 |
| JP2010153864A5 true JP2010153864A5 (enExample) | 2013-02-07 |
Family
ID=42027891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009287436A Pending JP2010153864A (ja) | 2008-12-23 | 2009-12-18 | 半導体ダイ上に製造されるパワートランジスタデバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8093621B2 (enExample) |
| EP (3) | EP2202800A1 (enExample) |
| JP (1) | JP2010153864A (enExample) |
| CN (1) | CN101840919B (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7871882B2 (en) | 2008-12-20 | 2011-01-18 | Power Integrations, Inc. | Method of fabricating a deep trench insulated gate bipolar transistor |
| US20100155831A1 (en) * | 2008-12-20 | 2010-06-24 | Power Integrations, Inc. | Deep trench insulated gate bipolar transistor |
| US8115457B2 (en) | 2009-07-31 | 2012-02-14 | Power Integrations, Inc. | Method and apparatus for implementing a power converter input terminal voltage discharge circuit |
| US8207577B2 (en) * | 2009-09-29 | 2012-06-26 | Power Integrations, Inc. | High-voltage transistor structure with reduced gate capacitance |
| CN102792448B (zh) * | 2010-03-09 | 2015-09-09 | 富士电机株式会社 | 半导体器件 |
| US8525260B2 (en) * | 2010-03-19 | 2013-09-03 | Monolithic Power Systems, Inc. | Super junction device with deep trench and implant |
| US9048104B2 (en) * | 2010-07-12 | 2015-06-02 | Microchip Technology Inc. | Multi-chip package module and a doped polysilicon trench for isolation and connection |
| JP5631752B2 (ja) * | 2011-01-12 | 2014-11-26 | 株式会社 日立パワーデバイス | 半導体装置および電力変換装置 |
| JP5627494B2 (ja) * | 2011-02-09 | 2014-11-19 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP2013115225A (ja) * | 2011-11-29 | 2013-06-10 | Toshiba Corp | 電力用半導体装置およびその製造方法 |
| US9443972B2 (en) * | 2011-11-30 | 2016-09-13 | Infineon Technologies Austria Ag | Semiconductor device with field electrode |
| CN103390650B (zh) * | 2012-05-04 | 2017-08-08 | 朱江 | 一种具有无源金属肖特基半导体装置及其制备方法 |
| US8921934B2 (en) | 2012-07-11 | 2014-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET with trench field plate |
| CN104241341A (zh) * | 2012-07-27 | 2014-12-24 | 俞国庆 | 一种高频低功耗的功率mos场效应管器件 |
| JP5802636B2 (ja) | 2012-09-18 | 2015-10-28 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP2014120656A (ja) * | 2012-12-18 | 2014-06-30 | Toshiba Corp | 半導体装置 |
| KR20150011185A (ko) | 2013-07-22 | 2015-01-30 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| US9111766B2 (en) | 2013-09-24 | 2015-08-18 | Infineon Technologies Austria Ag | Transistor device with a field electrode |
| JP6566512B2 (ja) * | 2014-04-15 | 2019-08-28 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| US9570577B2 (en) | 2014-05-12 | 2017-02-14 | Infineon Technologies Ag | Semiconductor device and insulated gate bipolar transistor with source zones formed in semiconductor mesas |
| US9231091B2 (en) * | 2014-05-12 | 2016-01-05 | Infineon Technologies Ag | Semiconductor device and reverse conducting insulated gate bipolar transistor with isolated source zones |
| JP6385755B2 (ja) * | 2014-08-08 | 2018-09-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US9324823B2 (en) * | 2014-08-15 | 2016-04-26 | Infineon Technologies Austria Ag | Semiconductor device having a tapered gate structure and method |
| DE102014113189B4 (de) * | 2014-09-12 | 2023-04-20 | Infineon Technologies Austria Ag | Halbleitervorrichtungen mit Feldelektrodenstrukturen, Gatestrukturen und Hilfsdiodenstrukturen |
| DE102014113375A1 (de) * | 2014-09-17 | 2016-03-17 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit feldeffektstruktur |
| US9722036B2 (en) * | 2014-09-17 | 2017-08-01 | Infineon Technologies Austria Ag | Semiconductor device with field electrode structure |
| KR102382856B1 (ko) * | 2014-10-13 | 2022-04-05 | 아이디얼 파워 인크. | 이중-베이스 양방향 양극성 트랜지스터의 두 대향면 상의 필드 플레이트: 장치, 방법 및 시스템 |
| US20160181409A1 (en) * | 2014-10-20 | 2016-06-23 | Ideal Power Inc. | Bidirectional Power Switching with Bipolar Conduction and with Two Control Terminals Gated by Two Merged Transistors |
| US9478639B2 (en) | 2015-02-27 | 2016-10-25 | Infineon Technologies Austria Ag | Electrode-aligned selective epitaxy method for vertical power devices |
| DE102015103211B4 (de) * | 2015-03-05 | 2018-05-30 | Infineon Technologies Austria Ag | Verfahren zum herstellen einer halbleitervorrichtung mit ersten und zweiten feldelektrodenstrukturen |
| CN104716192B (zh) * | 2015-03-31 | 2017-09-05 | 无锡新洁能股份有限公司 | 利用电荷耦合实现耐压的功率mos器件及其制备方法 |
| CN105428241B (zh) * | 2015-12-25 | 2018-04-17 | 上海华虹宏力半导体制造有限公司 | 具有屏蔽栅的沟槽栅功率器件的制造方法 |
| JP6622611B2 (ja) * | 2016-02-10 | 2019-12-18 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| CN108886054B (zh) * | 2016-03-31 | 2021-05-25 | 新电元工业株式会社 | 半导体装置的制造方法以及半导体装置 |
| JP6519894B2 (ja) * | 2016-03-31 | 2019-05-29 | 新電元工業株式会社 | 半導体装置の製造方法及び半導体装置 |
| CN105870180B (zh) * | 2016-04-26 | 2018-08-24 | 电子科技大学 | 双分裂沟槽栅电荷存储型rc-igbt及其制造方法 |
| CN105789291B (zh) * | 2016-04-26 | 2018-06-19 | 电子科技大学 | 一种双分裂沟槽栅电荷存储型igbt及其制造方法 |
| CN105742346B (zh) * | 2016-04-26 | 2018-06-01 | 电子科技大学 | 双分裂沟槽栅电荷存储型rc-igbt及其制造方法 |
| JP6909666B2 (ja) * | 2017-07-27 | 2021-07-28 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| CN107425052A (zh) * | 2017-07-28 | 2017-12-01 | 电子科技大学 | 一种横向高压器件 |
| US10600897B2 (en) * | 2017-11-08 | 2020-03-24 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP2019096840A (ja) * | 2017-11-28 | 2019-06-20 | 新電元工業株式会社 | Mosfet及び電力変換回路 |
| KR102246501B1 (ko) * | 2017-12-29 | 2021-04-30 | 수 조우 오리엔탈 세미컨덕터 콤퍼니 리미티드 | 반도체 전력 소자 |
| CN110620147B (zh) * | 2018-09-14 | 2023-05-23 | 电子科技大学 | 超高速大电流纵向绝缘栅双极型晶体管 |
| US11404540B2 (en) | 2019-10-01 | 2022-08-02 | Analog Devices International Unlimited Company | Bipolar junction transistor, and a method of forming a collector for a bipolar junction transistor |
| US11355585B2 (en) * | 2019-10-01 | 2022-06-07 | Analog Devices International Unlimited Company | Bipolar junction transistor, and a method of forming a charge control structure for a bipolar junction transistor |
| CN113690294A (zh) * | 2020-05-18 | 2021-11-23 | 华润微电子(重庆)有限公司 | Igbt器件及其制备方法 |
| CN114361248A (zh) * | 2020-05-18 | 2022-04-15 | 华润微电子(重庆)有限公司 | 沟槽栅金属氧化物半导体场效应管及其制备方法 |
| CN111785642B (zh) * | 2020-08-26 | 2023-03-21 | 上海华虹宏力半导体制造有限公司 | 一种半导体器件的制造方法 |
| CN112271134B (zh) * | 2020-10-20 | 2021-10-22 | 苏州东微半导体股份有限公司 | 半导体功率器件的制造方法 |
Family Cites Families (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4769685A (en) | 1986-10-27 | 1988-09-06 | General Motors Corporation | Recessed-gate junction-MOS field effect transistor |
| US20020074585A1 (en) | 1988-05-17 | 2002-06-20 | Advanced Power Technology, Inc., Delaware Corporation | Self-aligned power MOSFET with enhanced base region |
| US5008794A (en) | 1989-12-21 | 1991-04-16 | Power Integrations, Inc. | Regulated flyback converter with spike suppressing coupled inductors |
| JP2635828B2 (ja) | 1991-01-09 | 1997-07-30 | 株式会社東芝 | 半導体装置 |
| US5072268A (en) | 1991-03-12 | 1991-12-10 | Power Integrations, Inc. | MOS gated bipolar transistor |
| US5164891A (en) | 1991-08-21 | 1992-11-17 | Power Integrations, Inc. | Low noise voltage regulator and method using a gated single ended oscillator |
| US5258636A (en) | 1991-12-12 | 1993-11-02 | Power Integrations, Inc. | Narrow radius tips for high voltage semiconductor devices with interdigitated source and drain electrodes |
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| DE19905421B4 (de) | 1999-02-10 | 2005-07-28 | Semikron Elektronik Gmbh | Leistungshalbleiterbauelement mit reduzierter Millerkapazität |
| US6084277A (en) | 1999-02-18 | 2000-07-04 | Power Integrations, Inc. | Lateral power MOSFET with improved gate design |
| JP2000349288A (ja) | 1999-06-09 | 2000-12-15 | Fuji Electric Co Ltd | 縦型mosfet |
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| JP2005340626A (ja) | 2004-05-28 | 2005-12-08 | Toshiba Corp | 半導体装置 |
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| US7875962B2 (en) | 2007-10-15 | 2011-01-25 | Power Integrations, Inc. | Package for a power semiconductor device |
| US7964912B2 (en) * | 2008-09-18 | 2011-06-21 | Power Integrations, Inc. | High-voltage vertical transistor with a varied width silicon pillar |
| US7871882B2 (en) | 2008-12-20 | 2011-01-18 | Power Integrations, Inc. | Method of fabricating a deep trench insulated gate bipolar transistor |
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-
2008
- 2008-12-23 US US12/317,294 patent/US8093621B2/en not_active Expired - Fee Related
-
2009
- 2009-12-18 EP EP09179776A patent/EP2202800A1/en not_active Withdrawn
- 2009-12-18 EP EP12165160A patent/EP2482322A3/en not_active Withdrawn
- 2009-12-18 EP EP12165161A patent/EP2482323A3/en not_active Withdrawn
- 2009-12-18 JP JP2009287436A patent/JP2010153864A/ja active Pending
- 2009-12-21 CN CN2009102619161A patent/CN101840919B/zh not_active Expired - Fee Related
-
2011
- 2011-09-30 US US13/200,793 patent/US8399907B2/en not_active Expired - Fee Related
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