JP2010111853A - 剥離層材料、それを含む基板構造およびその作製方法 - Google Patents
剥離層材料、それを含む基板構造およびその作製方法 Download PDFInfo
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Abstract
【解決手段】特定の構造を有する、フレキシブル電子デバイスに適用される環状オレフィンコポリマー(COC)の剥離層材料。及び、キャリア12、1つまたはそれ以上のブロックでキャリアを第1の面積で覆う、特定の構造を有する環状オレフィンコポリマー(COC)を含む剥離層14、ならびに、剥離層およびキャリアを第2の面積で覆うフレキシブル基板16、を含み、第2の面積は第1の面積より大きく、かつフレキシブル基板16は、剥離層14のキャリア12に対する密着度よりも高い密着度を有する基板構造10。
【選択図】図1
Description
本出願は、2008年12月8日に出願され、題名を“フレキシブル電子デバイスに適用される基板構造およびその作製方法”とする継続中の米国特許出願シリアルNo.12/330,061号の一部継続出願である。
添付の図面を参照に下記の詳細な説明および実施例を読むことによって、本発明をより完全に理解することができる。
ポリイミド(B1317−BAPPm,BB)/Topas(X=50, Y=50)/ガラス基板構造の作製
様々な固形成分含有量(1%、3%、6%、7%および8%)の各種Topas溶液を準備した。次いで、そのTopas溶液を各種ガラスキャリア上にそれぞれ塗布して湿潤(wet)Topas層を形成した。湿潤Topas層の厚さはそれぞれ30μm、60μm、90μmおよび120μmとした。50℃で5分間および300℃で1時間べークした後、そのTopas層上にポリイミド基板材料(1%の接着促進剤を含む)を塗布した。べーク後、表1に示されるように、剥離試験(separation test)を行った。
ポリイミド(B1317−BAPPm,BB)/Arton(X=50, Y=50,R=H)/ガラス基板構造の作製
様々な固形成分含有量(5%、10%、15%、20%および25%)の各種Arton溶液を準備した。次いで、そのArton溶液を各種ガラスキャリア上にそれぞれ塗布して湿潤Arton層を形成した。湿潤Arton層の厚さはそれぞれ30μm、60μm、90μmおよび120μmとした。50℃で5分間および300℃で1時間べークした後、そのArton層上にポリイミド基板材料(1%の接着促進剤を含む)を塗布した。べーク後、表2に示されるように、剥離試験を行った。
パリレン剥離層の作製
パリレン前駆体(パリレンの二量体)を熱蒸着装置内に入れた。中空パッド(8cm×8cm)で覆われたクリーンなガラス(15cm×15cm)を試料室に置いた。真空中にてパリレン前駆体を150℃で気化させ650℃で分解してから、試料室に導入した。室温で、パッドに覆われていない領域上にパリレンを蒸着し、パリレン剥離層(8cm×8cm)を作製した。
Arton、TopasおよびZeonor剥離層の作製
Arton、TopasおよびZeonor(トルエン中に固形成分含有量10%で溶解)をスクレーパーを用いてガラス上に塗布した。そのガラスを各種のオーブン(80℃および150℃)でそれぞれ0.5時間ずつべークし、剥離層(8cm×8cm)を作製した。
ポリイミド(B1317−BAPPm,BB)/パリレン/ガラス基板構造の作製
二酸化シリコン/ポリイミド(BB−37)/パリレン/ガラス基板構造の作製
二酸化シリコン3g(DMAc中に固形成分含有量20%で溶解) およびB1317−BAPPm(BB)7g(DMAc中に固形成分含有量20%で溶解)を試料瓶に入れた。次いで、アミノシロキサン(amino siloxane)0.3gを加えて溶液を作り、室温下で30分間攪拌した。次に、その溶液を、パリレンがめっきされたガラス上にスクレーパーを用いて塗布した。そして、そのガラスを各種のオーブン(80℃および150℃)でそれぞれ1時間ずつべークし、二酸化シリコン/ポリイミド(BB−37)/パリレン/ガラス基板構造を作製した。
二酸化シリコン/ポリイミド(BB−55)/パリレン/ガラス基板構造の作製
二酸化シリコン5g(DMAc中に固形成分含有量20%で溶解) およびB1317−BAPPm(BB)5g(DMAc中に固形成分含有量20%で溶解)を試料瓶に入れた。次いで、アミノシロキサン0.2gを加えて溶液を作り、室温下で30分間攪拌した。次に、その溶液を、パリレンがめっきされたガラス上にスクレーパーを用いて塗布した。そして、そのガラスを各種のオーブン(80℃および150℃)でそれぞれ1時間ずつべークし、二酸化シリコン/ポリイミド(BB−55)/パリレン/ガラス基板構造を作製した。
二酸化シリコン/ポリイミド(BB−73)/パリレン/ガラス基板構造の作製
二酸化シリコン7g(DMAc中に固形成分含有量20%で溶解) およびB1317−BAPPm(BB)3g(DMAc中に固形成分含有量20%で溶解)を試料瓶に入れた。次いで、アミノシロキサン0.12gを加えて溶液を作り、室温下で30分間攪拌した。次に、その溶液を、パリレンがめっきされたガラス上にスクレーパーを用いて塗布した。そして、そのガラスを各種のオーブン(80℃および150℃)でそれぞれ1時間ずつべークし、二酸化シリコン/ポリイミド(BB−73)/パリレン/ガラス基板構造を作製した。
テトラエトキシシラン(TEOS)/ポリイミド(BB)/Topas/ガラス基板構造の作製
テトラエトキシシラン(TEOS)0.2gおよびB1317−BAPPm(BB)10g(DMAc中に固形成分含有量20%で溶解)を試料瓶に入れて溶液を作った。次いで、その溶液を、Topasが塗布されたガラス上にスクレーパーを用いて塗布した。そして、そのガラスを各種のオーブン(80℃および150℃)でそれぞれ1時間ずつべークし、テトラエトキシシラン(TEOS)/ポリイミド(BB)/Topas/ガラス基板構造を作製した。
アミノシラン/ポリイミド(BB)/Zeonor/ガラス基板構造の作製
アミノシラン0.2gおよびB1317−BAPPm(BB)10g(DMAc中に固形成分含有量20%で溶解)を試料瓶に入れて溶液を作った。次いで、その溶液を、Zeonorが塗布されたガラス上にスクレーパーを用いて塗布した。そして、そのガラスを各種のオーブン(80℃および150℃)でそれぞれ1時間ずつべークし、アミノシラン/ポリイミド(BB)/Zeonor/ガラス基板構造を作製した。
3−(メタクリロキシ)プロピルトリメトキシシラン(3-(methacryloxy) propyl trimethoxy silane,MPMS)/ポリイミド(BB)/Arton/ガラス基板構造の作製
3−(メタクリロキシ)プロピルトリメトキシシラン(MPMS)0.2gおよびB1317−BAPPm(BB)10g(DMAc中に固形成分含有量20%で溶解)を試料瓶に入れて溶液を作った。次いで、その溶液を、Artonが塗布されたガラス上にスクレーパーを用いて塗布した。そして、そのガラスを各種のオーブン(80℃および150℃)でそれぞれ1時間ずつべークし、3−(メタクリロキシ)プロピルトリメトキシシラン(MPMS)/ポリイミド(BB)/Arton/ガラス基板構造を作製した。
12 キャリア
14 剥離層
16 フレキシブル基板
A1、A2 面積
Claims (16)
- 前記剥離層材料が可溶性である請求項1に記載のフレキシブル電子デバイスに適用される環状オレフィンコポリマー(COC)の剥離層材料。
- フレキシブル電子デバイスに適用される基板構造であって、
キャリア(carrier)、
1つまたはそれ以上のブロックで前記キャリアを第1の面積で覆う、式(I)または(II)により表される環状オレフィンコポリマー(COC)を含む剥離層(release layer)、ならびに、
前記剥離層および前記キャリアを第2の面積で覆うフレキシブル基板、
を含み、
前記第2の面積が前記第1の面積より大きく、かつ、前記フレキシブル基板が、前記剥離層の前記キャリアに対する密着度よりも高い密着度を有する、フレキシブル電子デバイスに適用される基板構造。
- 前記キャリアがガラスまたはシリコンウェハーを含む請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記剥離層の前記キャリアに対する密着度が0B〜1Bである請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記剥離層の固形成分含有量が1〜20%である請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記剥離層の厚さが0.2〜20μmである請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記剥離層の厚さが0.5〜5μmである請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記フレキシブル基板の前記キャリアに対する密着度が1〜5Bである請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記フレキシブル基板が、ポリイミド(polyimide,PI)、ポリカーボネート(polycarbonate,PC)、ポリエーテルスルホン(polyethersulfone,PES)、ポリアクリレート(polyacrylate,PA)、ポリノルボルネン(polynorbornene,PNB)、ポリエチレンテレフタレート(polyethylene terephthalate,PET)、ポリエーテルエーテルケトン(polyetheretherketone ,PEEK)、ポリエチレンナフタレート(polyethylene naphthalate,PEN)またはポリエーテルイミド(polyetherimide,PEI)を含む請求項3に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記ポリイミド(PI)が式(III)を有する請求項10に記載のフレキシブル電子デバイスに適用される基板構造。
Bは、
nは1よりも大きい整数である。 - 前記フレキシブル基板がシロキサン化合物をさらに含む請求項10に記載のフレキシブル電子デバイスに適用される基板構造。
- 前記フレキシブル基板が酸化シリコンをさらに含む請求項12に記載のフレキシブル電子デバイスに適用される基板構造。
- フレキシブル電子デバイスに適用される基板構造の作製方法であって、
キャリア(carrier)を準備する工程、
1つまたはそれ以上のブロックで前記キャリア上に第1の面積で、式(I)または(II)により表される環状オレフィンコポリマー(COC)を含む剥離層(release layer)を塗布する工程、ならびに、
前記剥離層および前記キャリア上に第2の面積でフレキシブル基板を形成する工程、
を含み、
前記第2の面積が前記第1の面積より大きく、かつ、前記フレキシブル基板が、前記剥離層の前記キャリアに対する密着度よりも高い密着度を有する、作製方法。
- 前記フレキシブル基板が塗布によって前記剥離層および前記キャリア上に形成される請求項14に記載のフレキシブル電子デバイスに適用される基板構造の作製方法。
- 前記剥離層の両端または内側に沿って前記フレキシブル基板および前記キャリアの一部をカットして、前記剥離層、前記フレキシブル基板と前記キャリアとを分離する工程をさらに含む請求項14に記載のフレキシブル電子デバイスに適用される基板構造の作製方法。
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US8173249B2 (en) | 2012-05-08 |
JP4834758B2 (ja) | 2011-12-14 |
US20120201961A1 (en) | 2012-08-09 |
JP2010067957A (ja) | 2010-03-25 |
TWI354854B (en) | 2011-12-21 |
US8388779B2 (en) | 2013-03-05 |
TW201011427A (en) | 2010-03-16 |
JP5357675B2 (ja) | 2013-12-04 |
US20100068483A1 (en) | 2010-03-18 |
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