JP2010080057A5 - - Google Patents

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Publication number
JP2010080057A5
JP2010080057A5 JP2010007240A JP2010007240A JP2010080057A5 JP 2010080057 A5 JP2010080057 A5 JP 2010080057A5 JP 2010007240 A JP2010007240 A JP 2010007240A JP 2010007240 A JP2010007240 A JP 2010007240A JP 2010080057 A5 JP2010080057 A5 JP 2010080057A5
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JP
Japan
Prior art keywords
redundant
memory
array
main
main memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010007240A
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English (en)
Japanese (ja)
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JP2010080057A (ja
JP5033887B2 (ja
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Publication date
Priority claimed from US09/356,805 external-priority patent/US6208569B1/en
Application filed filed Critical
Publication of JP2010080057A publication Critical patent/JP2010080057A/ja
Publication of JP2010080057A5 publication Critical patent/JP2010080057A5/ja
Application granted granted Critical
Publication of JP5033887B2 publication Critical patent/JP5033887B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2010007240A 1999-04-06 2010-01-15 半導体メモリデバイス内のメモリアレイ間で冗長回路を共有するための方法及び装置 Expired - Fee Related JP5033887B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12804099P 1999-04-06 1999-04-06
US60/128040 1999-04-06
US09/356805 1999-07-20
US09/356,805 US6208569B1 (en) 1999-04-06 1999-07-20 Method of and apparatus for sharing redundancy circuits between memory arrays within a semiconductor memory device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000105027A Division JP4554755B2 (ja) 1999-04-06 2000-04-06 半導体メモリデバイス内のメモリアレイ間で冗長回路を共有するための方法及び装置

Publications (3)

Publication Number Publication Date
JP2010080057A JP2010080057A (ja) 2010-04-08
JP2010080057A5 true JP2010080057A5 (zh) 2010-05-27
JP5033887B2 JP5033887B2 (ja) 2012-09-26

Family

ID=26826211

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000105027A Expired - Fee Related JP4554755B2 (ja) 1999-04-06 2000-04-06 半導体メモリデバイス内のメモリアレイ間で冗長回路を共有するための方法及び装置
JP2010007240A Expired - Fee Related JP5033887B2 (ja) 1999-04-06 2010-01-15 半導体メモリデバイス内のメモリアレイ間で冗長回路を共有するための方法及び装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2000105027A Expired - Fee Related JP4554755B2 (ja) 1999-04-06 2000-04-06 半導体メモリデバイス内のメモリアレイ間で冗長回路を共有するための方法及び装置

Country Status (2)

Country Link
US (1) US6208569B1 (zh)
JP (2) JP4554755B2 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465828B2 (en) * 1999-07-30 2002-10-15 Micron Technology, Inc. Semiconductor container structure with diffusion barrier
US6417537B1 (en) 2000-01-18 2002-07-09 Micron Technology, Inc. Metal oxynitride capacitor barrier layer
JP2002008390A (ja) * 2000-06-16 2002-01-11 Fujitsu Ltd 冗長セルを有するメモリデバイス
US20020124203A1 (en) * 2001-02-20 2002-09-05 Henry Fang Method for utilizing DRAM memory
KR100425456B1 (ko) * 2001-08-02 2004-03-30 삼성전자주식회사 메이크-링크를 구비하는 퓨즈 박스, 이를 구비하는 리던던트 어드레스 디코더 및 메모리 셀 대체방법
KR100587076B1 (ko) 2004-04-28 2006-06-08 주식회사 하이닉스반도체 메모리 장치
US7385862B2 (en) * 2005-07-29 2008-06-10 Stmicroelectronics Pvt. Ltd. Shared redundant memory architecture and memory system incorporating same
JP2009087513A (ja) * 2007-10-03 2009-04-23 Nec Electronics Corp 半導体記憶装置、及びメモリセルテスト方法
KR101196907B1 (ko) 2010-10-27 2012-11-05 에스케이하이닉스 주식회사 반도체 메모리 장치 및 그의 동작 방법
JP5870017B2 (ja) * 2012-12-14 2016-02-24 株式会社東芝 不揮発性半導体記憶装置
CN112365916A (zh) * 2020-11-09 2021-02-12 深圳市芯天下技术有限公司 一种NAND Flash存储架构及存储方法
CN112837736A (zh) * 2021-03-16 2021-05-25 江苏时代全芯存储科技股份有限公司 记忆体装置以及其修补方法
JP7392181B2 (ja) 2021-03-24 2023-12-05 長江存儲科技有限責任公司 冗長バンクを使用した故障メインバンクの修理を伴うメモリデバイス

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666394B2 (ja) * 1983-12-16 1994-08-24 富士通株式会社 半導体記憶装置
JPS6150294A (ja) * 1984-08-18 1986-03-12 Mitsubishi Electric Corp 半導体記憶装置の冗長回路
JPS62217498A (ja) * 1986-03-06 1987-09-24 Fujitsu Ltd 半導体記憶装置
JPH02208897A (ja) * 1989-02-08 1990-08-20 Seiko Epson Corp 半導体記憶装置
JPH03263697A (ja) * 1990-03-13 1991-11-25 Sharp Corp 半導体記憶装置
KR960002777B1 (ko) * 1992-07-13 1996-02-26 삼성전자주식회사 반도체 메모리 장치의 로우 리던던시 장치
JP3301047B2 (ja) * 1993-09-16 2002-07-15 株式会社日立製作所 半導体メモリシステム
JPH08153399A (ja) * 1994-11-29 1996-06-11 Nec Corp 半導体記憶装置
JP3338755B2 (ja) * 1996-10-24 2002-10-28 シャープ株式会社 半導体記憶装置
JPH10334690A (ja) * 1997-05-27 1998-12-18 Nec Corp 半導体記憶装置
US6046945A (en) * 1997-07-11 2000-04-04 Integrated Silicon Solution, Inc. DRAM repair apparatus and method
US5999463A (en) * 1997-07-21 1999-12-07 Samsung Electronics Co., Ltd. Redundancy fuse box and semiconductor device including column redundancy fuse box shared by a plurality of memory blocks
JP3841535B2 (ja) * 1997-12-09 2006-11-01 富士通株式会社 半導体記憶装置
JPH11203890A (ja) 1998-01-05 1999-07-30 Mitsubishi Electric Corp 半導体記憶装置
US5889727A (en) 1998-05-11 1999-03-30 Texas Instruments--Acer Incorporated Circuit for reducing the transmission delay of the redundancy evaluation for synchronous DRAM
JP4260247B2 (ja) * 1998-09-02 2009-04-30 富士通マイクロエレクトロニクス株式会社 半導体記憶装置
US6018483A (en) * 1998-12-10 2000-01-25 Siemens Aktiengesellschaft Distributed block redundancy for memory devices
US6052318A (en) * 1998-12-22 2000-04-18 Siemens Aktiengesellschaft Repairable semiconductor memory circuit having parrel redundancy replacement wherein redundancy elements replace failed elements

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