JP2010034509A5 - - Google Patents

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Publication number
JP2010034509A5
JP2010034509A5 JP2009106530A JP2009106530A JP2010034509A5 JP 2010034509 A5 JP2010034509 A5 JP 2010034509A5 JP 2009106530 A JP2009106530 A JP 2009106530A JP 2009106530 A JP2009106530 A JP 2009106530A JP 2010034509 A5 JP2010034509 A5 JP 2010034509A5
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JP
Japan
Prior art keywords
water
soluble polymer
polymer compound
wetting agent
mpa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009106530A
Other languages
English (en)
Japanese (ja)
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JP2010034509A (ja
JP5474400B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2009106530A external-priority patent/JP5474400B2/ja
Priority to JP2009106530A priority Critical patent/JP5474400B2/ja
Priority to TW098121187A priority patent/TWI532801B/zh
Priority to US12/496,314 priority patent/US8632693B2/en
Priority to DE102009031356.7A priority patent/DE102009031356B4/de
Priority to KR1020090059984A priority patent/KR101594619B1/ko
Publication of JP2010034509A publication Critical patent/JP2010034509A/ja
Publication of JP2010034509A5 publication Critical patent/JP2010034509A5/ja
Publication of JP5474400B2 publication Critical patent/JP5474400B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009106530A 2008-07-03 2009-04-24 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法 Active JP5474400B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009106530A JP5474400B2 (ja) 2008-07-03 2009-04-24 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
TW098121187A TWI532801B (zh) 2008-07-03 2009-06-24 A semiconductor wetting agent, a polishing composition thereof, and a polishing method
US12/496,314 US8632693B2 (en) 2008-07-03 2009-07-01 Wetting agent for semiconductors, and polishing composition and polishing method employing it
DE102009031356.7A DE102009031356B4 (de) 2008-07-03 2009-07-01 Herstellung eines Benetzungsmittels für Halbleiter, Herstellung einer Polierzusammensetzung und sie verwendendes Polierverfahren
KR1020090059984A KR101594619B1 (ko) 2008-07-03 2009-07-02 반도체용 습윤제, 연마용 조성물 및 이를 사용한 연마 방법, 연마용 조성물 농축물, 반도체용 습윤제 농축물

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008174683 2008-07-03
JP2008174683 2008-07-03
JP2009106530A JP5474400B2 (ja) 2008-07-03 2009-04-24 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011264947A Division JP5575735B2 (ja) 2008-07-03 2011-12-02 研磨用組成物濃縮物

Publications (3)

Publication Number Publication Date
JP2010034509A JP2010034509A (ja) 2010-02-12
JP2010034509A5 true JP2010034509A5 (https=) 2012-01-26
JP5474400B2 JP5474400B2 (ja) 2014-04-16

Family

ID=41427484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009106530A Active JP5474400B2 (ja) 2008-07-03 2009-04-24 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法

Country Status (5)

Country Link
US (1) US8632693B2 (https=)
JP (1) JP5474400B2 (https=)
KR (1) KR101594619B1 (https=)
DE (1) DE102009031356B4 (https=)
TW (1) TWI532801B (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140671A1 (ja) 2009-06-05 2010-12-09 株式会社Sumco シリコンウェーハの研磨方法及びシリコンウェーハ
JP2013004910A (ja) * 2011-06-21 2013-01-07 Disco Abrasive Syst Ltd 埋め込み銅電極を有するウエーハの加工方法
KR101983868B1 (ko) 2011-10-24 2019-05-29 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 그것을 사용한 연마 방법 및 기판의 제조 방법
TWI650408B (zh) * 2012-01-16 2019-02-11 日商福吉米股份有限公司 研磨用組成物，其製造方法，矽基板之製造方法及矽基板
TWI582184B (zh) * 2012-01-16 2017-05-11 福吉米股份有限公司 研磨用組成物、其製造方法、稀釋用原液、矽基板之製造方法、及矽基板
US9133366B2 (en) * 2012-05-25 2015-09-15 Nissan Chemical Industries, Ltd. Polishing liquid composition for wafers
JP2014041978A (ja) * 2012-08-23 2014-03-06 Fujimi Inc 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法
US8821215B2 (en) 2012-09-07 2014-09-02 Cabot Microelectronics Corporation Polypyrrolidone polishing composition and method
JP2014080461A (ja) * 2012-10-12 2014-05-08 Fujimi Inc 研磨用組成物の製造方法及び研磨用組成物
EP2957613B1 (en) 2013-02-13 2020-11-18 Fujimi Incorporated Polishing composition, method for producing polishing composition and method for producing polished article
JP6292816B2 (ja) * 2013-10-18 2018-03-14 東亞合成株式会社 半導体用濡れ剤及び研磨用組成物
JP6266337B2 (ja) * 2013-12-25 2018-01-24 ニッタ・ハース株式会社 半導体基板用濡れ剤及び研磨用組成物
JP6343160B2 (ja) * 2014-03-28 2018-06-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP6389629B2 (ja) 2014-03-31 2018-09-12 ニッタ・ハース株式会社 研磨用組成物
JP6314019B2 (ja) 2014-03-31 2018-04-18 ニッタ・ハース株式会社 半導体基板の研磨方法
JP6389630B2 (ja) 2014-03-31 2018-09-12 ニッタ・ハース株式会社 研磨用組成物
JP2014239228A (ja) * 2014-06-27 2014-12-18 日立化成株式会社 Ｃｍｐ研磨液
JP6206360B2 (ja) * 2014-08-29 2017-10-04 株式会社Sumco シリコンウェーハの研磨方法
US10748778B2 (en) 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
EP3258483A4 (en) 2015-02-12 2018-02-28 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
EP3546542A4 (en) 2016-11-22 2020-07-22 Fujimi Incorporated POLISHING COMPOSITION
US20180301852A1 (en) * 2017-04-18 2018-10-18 Maria Galkowski Power-saving outlet
JP6690606B2 (ja) 2017-07-14 2020-04-28 信越半導体株式会社 研磨方法
KR20200111488A (ko) 2019-03-19 2020-09-29 케이피엑스케미칼 주식회사 반도체 연마용 린스 조성물
CN113631679B (zh) 2019-03-26 2023-08-08 福吉米株式会社 研磨用组合物
JP6884898B1 (ja) 2020-01-22 2021-06-09 日本酢ビ・ポバール株式会社 研磨用組成物
JP6761554B1 (ja) 2020-01-22 2020-09-23 日本酢ビ・ポバール株式会社 研磨用組成物
JP7531320B2 (ja) * 2020-06-11 2024-08-09 株式会社フジミインコーポレーテッド ヒドロキシエチルセルロース溶液の製造方法、該製造方法により製造されたヒドロキシエチルセルロース溶液、および該ヒドロキシエチルセルロース溶液を含む半導体用濡れ剤ならびに研磨用組成物
JP7720137B2 (ja) * 2020-09-30 2025-08-07 株式会社フジミインコーポレーテッド ポリビニルアルコール組成物を含む半導体用濡れ剤の製造方法
JP7603441B2 (ja) 2020-12-23 2024-12-20 ニッタ・デュポン株式会社 研磨用組成物及びシリコンウェーハの研磨方法
EP4405428A4 (en) * 2021-09-23 2025-07-30 Cmc Mat Llc SILICA-BASED SLURRY COMPOSITIONS CONTAINING HIGH MOLECULAR WEIGHT POLYMERS FOR USE IN CHEMICAL-MECHANICAL POLISHING OF DIELECTRICS

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715842A (en) 1970-07-02 1973-02-13 Tizon Chem Corp Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces
US4169337A (en) 1978-03-30 1979-10-02 Nalco Chemical Company Process for polishing semi-conductor materials
US4462188A (en) 1982-06-21 1984-07-31 Nalco Chemical Company Silica sol compositions for polishing silicon wafers
US4588421A (en) 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US5352277A (en) 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
US5230833A (en) 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
US5916819A (en) 1996-07-17 1999-06-29 Micron Technology, Inc. Planarization fluid composition chelating agents and planarization method using same
US6099604A (en) 1997-08-21 2000-08-08 Micron Technology, Inc. Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto
AU2080999A (en) 1997-12-23 1999-07-12 Akzo Nobel N.V. A composition for chemical mechanical polishing
JP3810588B2 (ja) 1998-06-22 2006-08-16 株式会社フジミインコーポレーテッド 研磨用組成物
US7208049B2 (en) * 2003-10-20 2007-04-24 Air Products And Chemicals, Inc. Process solutions containing surfactants used as post-chemical mechanical planarization treatment
US6454820B2 (en) 2000-02-03 2002-09-24 Kao Corporation Polishing composition
JP3440419B2 (ja) 2001-02-02 2003-08-25 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
US6685757B2 (en) 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
JP4593064B2 (ja) 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP4212861B2 (ja) * 2002-09-30 2009-01-21 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法
WO2004042812A1 (ja) 2002-11-08 2004-05-21 Fujimi Incorporated 研磨用組成物及びリンス用組成物
KR100516886B1 (ko) 2002-12-09 2005-09-23 제일모직주식회사 실리콘 웨이퍼의 최종 연마용 슬러리 조성물
JP4668528B2 (ja) 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP2005336705A (ja) 2004-05-24 2005-12-08 Matsushita Electric Works Ltd 階段
JP2006005246A (ja) * 2004-06-18 2006-01-05 Fujimi Inc リンス用組成物及びそれを用いたリンス方法
JP5026665B2 (ja) * 2004-10-15 2012-09-12 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP5121128B2 (ja) 2005-06-20 2013-01-16 ニッタ・ハース株式会社 半導体研磨用組成物
KR101406487B1 (ko) * 2006-10-06 2014-06-12 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 반도체 장치의 화학 기계연마 방법

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