JP2009531858A5 - - Google Patents

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Publication number
JP2009531858A5
JP2009531858A5 JP2009502777A JP2009502777A JP2009531858A5 JP 2009531858 A5 JP2009531858 A5 JP 2009531858A5 JP 2009502777 A JP2009502777 A JP 2009502777A JP 2009502777 A JP2009502777 A JP 2009502777A JP 2009531858 A5 JP2009531858 A5 JP 2009531858A5
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JP
Japan
Prior art keywords
processing system
processing
pedestal
grooves
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009502777A
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English (en)
Japanese (ja)
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JP5148592B2 (ja
JP2009531858A (ja
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Publication date
Priority claimed from US11/390,199 external-priority patent/US8057633B2/en
Application filed filed Critical
Publication of JP2009531858A publication Critical patent/JP2009531858A/ja
Publication of JP2009531858A5 publication Critical patent/JP2009531858A5/ja
Application granted granted Critical
Publication of JP5148592B2 publication Critical patent/JP5148592B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009502777A 2006-03-28 2007-02-07 基板上の残留物を除去するための後エッチング処理システム Expired - Fee Related JP5148592B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/390,199 US8057633B2 (en) 2006-03-28 2006-03-28 Post-etch treatment system for removing residue on a substrate
US11/390,199 2006-03-28
PCT/US2007/003105 WO2007126468A1 (en) 2006-03-28 2007-02-07 Post-etch treatment system for removing residue on a substrate

Publications (3)

Publication Number Publication Date
JP2009531858A JP2009531858A (ja) 2009-09-03
JP2009531858A5 true JP2009531858A5 (enExample) 2010-02-12
JP5148592B2 JP5148592B2 (ja) 2013-02-20

Family

ID=38573893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009502777A Expired - Fee Related JP5148592B2 (ja) 2006-03-28 2007-02-07 基板上の残留物を除去するための後エッチング処理システム

Country Status (6)

Country Link
US (1) US8057633B2 (enExample)
JP (1) JP5148592B2 (enExample)
KR (1) KR101313426B1 (enExample)
CN (1) CN101410941B (enExample)
TW (1) TWI355688B (enExample)
WO (1) WO2007126468A1 (enExample)

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US20100130017A1 (en) * 2008-11-21 2010-05-27 Axcelis Technologies, Inc. Front end of line plasma mediated ashing processes and apparatus
US20110226280A1 (en) * 2008-11-21 2011-09-22 Axcelis Technologies, Inc. Plasma mediated ashing processes
US20120024314A1 (en) * 2010-07-27 2012-02-02 Axcelis Technologies, Inc. Plasma mediated ashing processes
CN102201336B (zh) * 2010-03-26 2013-03-06 中芯国际集成电路制造(上海)有限公司 半导体器件层上的氧化层刻蚀后残留物的去除方法
WO2011121508A1 (en) * 2010-03-29 2011-10-06 Koolerheadz Modular gas injection device
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US10192717B2 (en) * 2014-07-21 2019-01-29 Applied Materials, Inc. Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates
EP3334566B1 (en) * 2015-08-14 2021-11-24 M Cubed Technologies Inc. Wafer chuck featuring reduced friction support surface
KR102641441B1 (ko) 2016-09-28 2024-02-29 삼성전자주식회사 링 어셈블리 및 이를 포함하는 척 어셈블리
KR102806341B1 (ko) 2017-01-04 2025-05-12 삼성전자주식회사 포커스 링 및 이를 포함하는 플라즈마 처리 장치
US10766057B2 (en) 2017-12-28 2020-09-08 Micron Technology, Inc. Components and systems for cleaning a tool for forming a semiconductor device, and related methods
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KR102845724B1 (ko) * 2019-10-21 2025-08-13 에이에스엠 아이피 홀딩 비.브이. 막을 선택적으로 에칭하기 위한 장치 및 방법
US11710777B2 (en) * 2020-10-27 2023-07-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method for manufacture
KR20220148735A (ko) * 2021-04-29 2022-11-07 에이에스엠 아이피 홀딩 비.브이. 반응기 시스템 및 반응기 시스템을 세정하기 위한 방법

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