JP2009512369A - 機械的に敏感な電子構成素子のための中空室を備えたハウジングおよび該ハウジングを製造するための方法 - Google Patents

機械的に敏感な電子構成素子のための中空室を備えたハウジングおよび該ハウジングを製造するための方法 Download PDF

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Publication number
JP2009512369A
JP2009512369A JP2008535876A JP2008535876A JP2009512369A JP 2009512369 A JP2009512369 A JP 2009512369A JP 2008535876 A JP2008535876 A JP 2008535876A JP 2008535876 A JP2008535876 A JP 2008535876A JP 2009512369 A JP2009512369 A JP 2009512369A
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component
housing part
holder
housing
contact
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Pending
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JP2008535876A
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Japanese (ja)
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JP2009512369A5 (enExample
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パール ヴォルフガング
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TDK Electronics AG
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Epcos AG
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Publication of JP2009512369A publication Critical patent/JP2009512369A/ja
Publication of JP2009512369A5 publication Critical patent/JP2009512369A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0054—Packages or encapsulation for reducing stress inside of the package structure between other parts not provided for in B81B7/0048 - B81B7/0051
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2008535876A 2005-10-20 2006-09-29 機械的に敏感な電子構成素子のための中空室を備えたハウジングおよび該ハウジングを製造するための方法 Pending JP2009512369A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005050398A DE102005050398A1 (de) 2005-10-20 2005-10-20 Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung
PCT/DE2006/001736 WO2007045204A1 (de) 2005-10-20 2006-09-29 Gehäuse mit hohlraum für ein mechanisch empfindliches elektronisches bauelement und verfahren zur herstellung

Publications (2)

Publication Number Publication Date
JP2009512369A true JP2009512369A (ja) 2009-03-19
JP2009512369A5 JP2009512369A5 (enExample) 2012-08-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008535876A Pending JP2009512369A (ja) 2005-10-20 2006-09-29 機械的に敏感な電子構成素子のための中空室を備えたハウジングおよび該ハウジングを製造するための方法

Country Status (4)

Country Link
US (1) US20090127697A1 (enExample)
JP (1) JP2009512369A (enExample)
DE (2) DE102005050398A1 (enExample)
WO (1) WO2007045204A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016525946A (ja) * 2013-05-24 2016-09-01 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ 微小電気機械システムデバイスパッケージおよび微小電気機械システムデバイスパッケージを製造するための方法
JP2020205500A (ja) * 2019-06-14 2020-12-24 太陽誘電株式会社 電子デバイスおよびその製造方法

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DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
US8011082B2 (en) * 2005-11-09 2011-09-06 Koninklijke Philips Electronics N.V. Method of manufacturing a package carrier
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
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DE102007028288B4 (de) * 2007-06-20 2013-06-06 Epcos Ag Mit akustischen Wellen arbeitendes MEMS Bauelement und Verfahren zur Herstellung
DE102008028299B3 (de) 2008-06-13 2009-07-30 Epcos Ag Systemträger für elektronische Komponente und Verfahren für dessen Herstellung
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DE102010055627A1 (de) * 2010-12-22 2012-06-28 Epcos Ag Elektrisches Modul zur Aufnahme durch Bestückungsautomaten mittels Erzeugung eines Vakuums
DE102011004577B4 (de) * 2011-02-23 2023-07-27 Robert Bosch Gmbh Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger
JP2013046167A (ja) * 2011-08-23 2013-03-04 Seiko Epson Corp 振動デバイス、及び振動デバイスの製造方法
US8436433B1 (en) * 2011-10-13 2013-05-07 Rosemount Aerospace Inc. Unattached contained semiconductor devices
DE102012108106B4 (de) * 2012-08-31 2016-06-16 Epcos Ag MEMS Bauteil und Verfahren zur Herstellung eines mit akustischen Wellen arbeitenden MEMS Bauteils
DE102013100197A1 (de) * 2013-01-10 2014-07-10 Continental Automotive Gmbh Sensoreinheit für ein Kraftfahrzeug zur Montage auf einer Leiterplatte und Mitteln zum Dämpfen der Übertragung hochfrequenter Störungen
DE102013100388B4 (de) 2013-01-15 2014-07-24 Epcos Ag Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung
DE102013103494A1 (de) * 2013-04-08 2014-10-09 Pro-Micron Gmbh & Co. Kg Dehnungsmesssensor
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
DE102014106503B4 (de) 2014-05-08 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Mikrofons
DE102014008839B4 (de) * 2014-06-20 2021-09-30 Kunststoff-Zentrum In Leipzig Gemeinnützige Gmbh Dehnungskompensierendes Verbindungselement für ein Mikroelektroniksystem
US10442683B2 (en) * 2016-04-14 2019-10-15 Akustica, Inc. Corrugated package for microelectromechanical system (MEMS) device
WO2018009543A1 (en) * 2016-07-07 2018-01-11 Molex, Llc Molded interconnect device and method of making same
US10028411B2 (en) * 2016-07-26 2018-07-17 Continental Automotive Systems, Inc. Electronic controller with laser weld sealed housing
TWI660487B (zh) * 2017-12-19 2019-05-21 英屬開曼群島商錼創科技股份有限公司 微型元件結構
CN108358160B (zh) * 2018-04-18 2023-08-01 中国兵器工业集团第二一四研究所苏州研发中心 吊装式可释放应力的mems器件封装结构
DE102019214478A1 (de) * 2019-09-23 2021-03-25 Infineon Technologies Ag Photoakustischer gassensor
US11616027B2 (en) 2019-12-17 2023-03-28 Analog Devices International Unlimited Company Integrated circuit packages to minimize stress on a semiconductor die
CN116097426B (zh) * 2020-09-25 2025-05-13 华为技术有限公司 芯片及其制作方法、电子设备
CN114337586A (zh) * 2021-11-05 2022-04-12 深圳市科瀚电子有限公司 一种贴片音叉谐振器的结构及加工方法
WO2023129468A1 (en) * 2021-12-31 2023-07-06 Sitime Corporation Suspension for resonators and mems devices

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Publication number Priority date Publication date Assignee Title
JP2016525946A (ja) * 2013-05-24 2016-09-01 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ 微小電気機械システムデバイスパッケージおよび微小電気機械システムデバイスパッケージを製造するための方法
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JP7401200B2 (ja) 2019-06-14 2023-12-19 太陽誘電株式会社 電子デバイスの製造方法

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DE102005050398A1 (de) 2007-04-26
DE112006002336A5 (de) 2008-06-05
US20090127697A1 (en) 2009-05-21
WO2007045204A1 (de) 2007-04-26

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