JP2009512369A5 - - Google Patents

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Publication number
JP2009512369A5
JP2009512369A5 JP2008535876A JP2008535876A JP2009512369A5 JP 2009512369 A5 JP2009512369 A5 JP 2009512369A5 JP 2008535876 A JP2008535876 A JP 2008535876A JP 2008535876 A JP2008535876 A JP 2008535876A JP 2009512369 A5 JP2009512369 A5 JP 2009512369A5
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JP
Japan
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component
holder
housing part
housing
contact
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JP2008535876A
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English (en)
Japanese (ja)
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JP2009512369A (ja
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Priority claimed from DE102005050398A external-priority patent/DE102005050398A1/de
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Publication of JP2009512369A5 publication Critical patent/JP2009512369A5/ja
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JP2008535876A 2005-10-20 2006-09-29 機械的に敏感な電子構成素子のための中空室を備えたハウジングおよび該ハウジングを製造するための方法 Pending JP2009512369A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005050398A DE102005050398A1 (de) 2005-10-20 2005-10-20 Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung
PCT/DE2006/001736 WO2007045204A1 (de) 2005-10-20 2006-09-29 Gehäuse mit hohlraum für ein mechanisch empfindliches elektronisches bauelement und verfahren zur herstellung

Publications (2)

Publication Number Publication Date
JP2009512369A JP2009512369A (ja) 2009-03-19
JP2009512369A5 true JP2009512369A5 (enExample) 2012-08-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008535876A Pending JP2009512369A (ja) 2005-10-20 2006-09-29 機械的に敏感な電子構成素子のための中空室を備えたハウジングおよび該ハウジングを製造するための方法

Country Status (4)

Country Link
US (1) US20090127697A1 (enExample)
JP (1) JP2009512369A (enExample)
DE (2) DE102005050398A1 (enExample)
WO (1) WO2007045204A1 (enExample)

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DE102014008839B4 (de) * 2014-06-20 2021-09-30 Kunststoff-Zentrum In Leipzig Gemeinnützige Gmbh Dehnungskompensierendes Verbindungselement für ein Mikroelektroniksystem
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CN108358160B (zh) * 2018-04-18 2023-08-01 中国兵器工业集团第二一四研究所苏州研发中心 吊装式可释放应力的mems器件封装结构
JP7401200B2 (ja) * 2019-06-14 2023-12-19 太陽誘電株式会社 電子デバイスの製造方法
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US11616027B2 (en) 2019-12-17 2023-03-28 Analog Devices International Unlimited Company Integrated circuit packages to minimize stress on a semiconductor die
CN116097426B (zh) * 2020-09-25 2025-05-13 华为技术有限公司 芯片及其制作方法、电子设备
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