JP2009152428A - 光トランシーバの放熱装置 - Google Patents
光トランシーバの放熱装置 Download PDFInfo
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- JP2009152428A JP2009152428A JP2007329668A JP2007329668A JP2009152428A JP 2009152428 A JP2009152428 A JP 2009152428A JP 2007329668 A JP2007329668 A JP 2007329668A JP 2007329668 A JP2007329668 A JP 2007329668A JP 2009152428 A JP2009152428 A JP 2009152428A
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- heat
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- optical transceiver
- transceiver
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- 230000003287 optical effect Effects 0.000 title claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 title abstract description 15
- 238000003780 insertion Methods 0.000 claims abstract description 16
- 230000037431 insertion Effects 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000005855 radiation Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000971 Silver steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- SJKRCWUQJZIWQB-UHFFFAOYSA-N azane;chromium Chemical compound N.[Cr] SJKRCWUQJZIWQB-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】ホスト基板11に設置されたケージ12の上部に配置されるヒートシンク15とトランシーバ筐体14との接触面のいずれかに軟質な熱伝導シート18が貼り付けられる。ヒートシンク15はケージ12に対して下方に弾性的に所定の範囲で移動可能に支持され、トランシーバ筐体14の接触面14a側にヒートシンク15の接触面15aから所定の範囲で離間させるカム突起19が設けられる。トランシーバ筐体14は、熱伝導シート18の接触面を擦ることなく挿入され、トランシーバ筐体14の最終挿入位置で、熱伝導シート18を挟んでヒートシンク15とトランシーバ筐体14との接触面が互いに圧接される。
【選択図】図1
Description
光トランシーバ13がケージ内に挿入されていない状態のときは、図1で説明したようにヒートシンク15は、押下げバネ17(図1参照)により下方位置に付勢されている。光トランシーバ13を挿入するに際しては、ヒートシンク15を押下げバネ17に抗して上方に押し上げる必要がある。
図3(D)は、図3(C)の状態から、トランシーバ筐体14が僅かに押込まれることにより、第1のカム突起19aがカム溝20dに落ち込んだ状態を示し、ヒートシンク15が傾いた状態になる。
また、反対に光トランシーバを引き出すときは、図3(E)から図3(A)への状態になるように、逆の操作を行うことで実施される。
Claims (1)
- ホスト基板に設置されたケージの上部にヒートシンクを配置し、該ヒートシンクによりケージ内に挿抜可能に挿着される光トランシーバからの発熱を放熱する光トランシーバの放熱装置であって、
前記ヒートシンクと前記トランシーバ筐体との接触面のいずれかに軟質な熱伝導シートが貼り付けられ、前記ヒートシンクは前記ケージに対して下方に弾性的に所定の範囲で移動可能に支持され、前記トランシーバ筐体の接触面側に前記ヒートシンクの接触面から所定の範囲で離間させるカム突起が設けられ、
前記熱伝導シートの接触面を擦ることなく前記光トランシーバ筐体が挿入され、前記トランシーバ筐体の最終挿入位置で、前記熱伝導シートを挟んで前記ヒートシンクと前記トランシーバ筐体との接触面が互いに圧接されることを特徴とする光トランシーバの放熱装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007329668A JP4915342B2 (ja) | 2007-12-21 | 2007-12-21 | 光トランシーバの放熱装置 |
US12/332,199 US7974098B2 (en) | 2007-12-11 | 2008-12-10 | Mechanism to make a heat sink in contact with a pluggable transceiver, a pluggable optical transceiver and a cage assembly providing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007329668A JP4915342B2 (ja) | 2007-12-21 | 2007-12-21 | 光トランシーバの放熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009152428A true JP2009152428A (ja) | 2009-07-09 |
JP4915342B2 JP4915342B2 (ja) | 2012-04-11 |
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JP2007329668A Active JP4915342B2 (ja) | 2007-12-11 | 2007-12-21 | 光トランシーバの放熱装置 |
Country Status (2)
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US (1) | US7974098B2 (ja) |
JP (1) | JP4915342B2 (ja) |
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JP2012168253A (ja) * | 2011-02-10 | 2012-09-06 | Yamaichi Electronics Co Ltd | 光モジュール接続装置 |
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JP2016156916A (ja) * | 2015-02-24 | 2016-09-01 | 住友電気工業株式会社 | 光データリンク |
JP2018136437A (ja) * | 2017-02-22 | 2018-08-30 | 日本電気株式会社 | プラガブル光モジュール、及びプラガブル光モジュールの接続構造 |
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JP2019168214A (ja) * | 2018-03-22 | 2019-10-03 | 廣達電腦股▲ふん▼有限公司Quanta Computer Inc. | 熱交換構造及びそれを有する伝熱システム |
KR20200042966A (ko) * | 2017-09-21 | 2020-04-24 | 몰렉스 엘엘씨 | 보호 램프를 갖는 히트 싱크 |
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JP2021507288A (ja) * | 2017-12-18 | 2021-02-22 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | 光トランシーバモジュールのための熱界面構造体 |
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Also Published As
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US20090296351A1 (en) | 2009-12-03 |
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