JP2009007443A - 接着フィルム - Google Patents
接着フィルム Download PDFInfo
- Publication number
- JP2009007443A JP2009007443A JP2007168964A JP2007168964A JP2009007443A JP 2009007443 A JP2009007443 A JP 2009007443A JP 2007168964 A JP2007168964 A JP 2007168964A JP 2007168964 A JP2007168964 A JP 2007168964A JP 2009007443 A JP2009007443 A JP 2009007443A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- adhesive
- conductive particles
- terminals
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J9/02—Electrically-conducting adhesives
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract
【解決手段】本発明の接着フィルム10は第一、第二の接着剤層11、12を有しており、第一の接着剤層11に導電性粒子15が分散され、第一の接着剤層11の膜厚が導電性粒子15の粒径の2倍未満になっている。導電性粒子15は第一の接着剤層11中で2個以上積み重ならないので、第一、第二の端子35、45が導電性粒子15を挟み込む時に、導電性粒子15が横方向に移動しない。従って、隣接する第一、第二の端子35、45間の導電性粒子15密度が高くならず、短絡が起こらない。
【選択図】図3
Description
基板の端子が配置された面と、電気部品の端子が配置された面の間に異方導電性接着剤を配置し、加熱押圧すると、軟化したバインダーが基板の端子と電気部品の端子の間から押し退けられ、導電性粒子が基板の端子と電気部品の端子の間に挟みこまれ、基板と電気部品が電気的に接続される。
また、導電性粒子が基板の端子と電気部品の端子との間から押し退けられると、基板の端子と電気部品の端子とで、導電性粒子が挟み込まれる数が少なくなり、導通信頼性も劣る。
本発明は接着フィルムであって、前記第二の接着剤層の前記最低粘度は、前記導電性粒子が含有された状態の前記第一の接着剤層の前記最低粘度の0.05倍以上0.2倍以下にされた接着フィルムである。
本発明は接着フィルムであって、前記第一の接着剤層が前記最低粘度となる温度と、前記第二の接着剤層が前記最低粘度となる温度の差が10℃以下である接着フィルムである。
熱硬化性樹脂を含有する接着剤が昇温すると、図5に示すように、接着剤はある温度範囲までは、温度が高くなる程粘度が低下するが、ある温度(ここでは約100℃)を超えると、熱硬化性樹脂の重合が開始して接着剤が硬化するため、粘度が上昇に転じる。
図5の符号Aは導電性粒子が分散された状態の接着剤(第一の接着剤層)の粘度と温度の関係を示し、同図の符号Nは導電性粒子が分散されていない接着剤(第二の接着剤層)の粘度と温度の関係を示している。
接着フィルム10は、第一の接着剤層11と、第一の接着剤層11の表面に配置された第二の接着剤層12と、第一の接着剤層11に分散された導電性粒子15とを有している。導電性粒子15は第一の接着剤層11だけに分散されており、第二の接着剤層12には導電性粒子は分散されていない。
切り出した接着フィルム10に剥離フィルム19が密着している場合は、仮貼り前、又は仮貼り後に、剥離フィルム19を剥離し、第二の接着剤層12表面を露出させる。
しかも、第一の接着剤層11の最低粘度は第二の接着剤層12の最低粘度よりも高いから、第一の接着剤層11はより一層隣接する第一の端子35間に流れ込み難い。
固形樹脂であるフェノキシ樹脂を溶剤(トルエン/酢酸エチル=1/1)に溶解させて固形分30重量%の溶解品を得た。
次いで、溶解品に、硬化剤と、エポキシ樹脂と、無機フィラーと、シランカップリング剤と、導電性粒子とを、フェノキシ樹脂に対する配合割合が、下記表1の「ACF」の欄に記載した配合割合になるように添加、混合し、最終的に固形分が40重量%になるようトルエンで調整した接続材料の溶解品を作成した。
上記表1のACF、NCF−1、NCF−2に示す配合割合で作成した接着剤層をそれぞれ重ね合わせて100μm厚にした物を用いて、応力制御型レオメーター(Haake社製RS150)を用い、最低粘度と、最低粘度に到達するときの温度(到達温度)とを測定した。尚、コーンとしては直径8mm、角度2度のものを使用し、測定範囲は30℃〜250℃とした。測定結果を下記表2に記載する。
膜厚4μmのACFと、膜厚14μmのNCF−1、NCF−2を、下記表3の組み合わせで貼り合わせて、実施例1、比較例2の接着フィルムを作成した。
被着体として、ICチップ(評価用IC、材質:シリコン、寸法:6.0mm×6.0mm、厚さ:0.4mm、バンプ:金スタッド、バンプ厚:20μm、バンプ面積:60μm×60μm、バンプ間スペース20μm、ピッチ:80μm)と、ITOコーティングガラス(評価用ITOガラス、コーニング社製、品名:1737F、ガラスサイズ:縦50mm×横30mm×厚さ0.5mm、ITOパッドサイズ:60μm×60μm、ピッチ:80μm)を用意した。
尚、バンプとITOパッドは表面の大きさが60μm×60μmであるから、バンプとITOパッドが接続される接続面積は3600μm2である。
本圧着後に、20個のバンプについて、各バンプの下に残っている導電性粒子を数えた。
捕捉効率は、本圧着後に何個の粒子がどれだけ捕捉されたかをパーセンテージで示した値である。具体的には、ICチップを仮固定した際に、20個のバンプについて、各バンプ下に存在する導電性粒子の数(平均)を調べ、その導電性粒子の数と、本圧着後の粒子捕捉数(平均)とを下記式(1)に代入し、求めた。
[導通抵抗]
本圧着後に、ICチップのバンプとITOパッド間の導通抵抗(単位:Ω)を求めた。「粒子捕捉数」の最大値、最小値、平均と、「捕捉効率」と、「導通抵抗」の測定結果を下記表4に記載する。
実施例1、2、比較例1、2の接着フィルムを用いて、上記ICチップとITOコーティングガラスを接続する際に、バンプとITOパッドとが水平方向に10μm離れるようにミスアライメントした以外は、上記「実装工程」と同じ条件で接続体を作成した。隣接するITOパッド間に30Vの電圧を加え絶縁抵抗を測定し、絶縁抵抗が1.0×10-6Ω以下をショートとし、ショート発生数を数えた(初期)。
例えば、第二の接着剤層12の材料を溶剤に溶解又は分散させた塗液を作成し、該塗液を第一の接着剤層11の表面に塗布後、乾燥すれば、第二の接着剤層12を第一の接着剤層11表面に密着配置することができる。
第一、第二の接着剤層11、12は、同じ剥離フィルム19の表面と裏面に密着する場合に限定されず、それぞれ別々の剥離フィルム19に密着させてもよい。
第一、第二の接着剤層11、12の材料は、上記表1に記載されたものに限定されない。例えば、熱硬化性樹脂としては、エポキシ樹脂以外にも、ウレタン樹脂、熱硬化性ポリエステル樹脂等種々のものを用いることができる。
硬化剤も特に限定されず、例えば熱硬化性樹脂がエポキシ樹脂の場合、マイクロカプセル化されたアミン系硬化剤を用いればエポキシ樹脂がアニオン重合し、オニウム塩やオキセタンを硬化剤に用いればエポキシ樹脂がカチオン重合し、また熱硬化性ポリエステルの場合は有機過酸化物を硬化剤に用いればラジカル重合する。
導電性粒子15も特に限定されず、金属粒子、樹脂粒子の表面に金属メッキ層が形成されたもの等種々のものを用いることができる。
第一の接着剤層11の膜厚は特に限定されないが、導電性粒子15の平均粒径の2倍未満が望ましく、特に導電性粒子15の平均粒径の50%以上150%以下が望ましい。
Claims (3)
- 熱硬化性樹脂を含有し、互いに密着された第一、第二の接着剤層を有し、
前記第一の接着剤層は、硬化が開始する硬化開始温度以下での最低粘度が、
前記第二の接着剤層の、硬化が開始する硬化開始温度以下での最低粘度よりも高くされ、
前記第一、第二の接着剤層を基板と電気部品側にそれぞれ向け、前記基板と前記電気部品同士を加熱押圧すると、前記電気部品が前記基板に接続される接着フィルムであって、
前記第一の接着剤層には導電性粒子が分散され、
前記第一の接着剤層の膜厚は、前記導電性粒子の平均粒径の2倍未満にされた接着フィルム。 - 前記第二の接着剤層の前記最低粘度は、前記導電性粒子が含有された状態の前記第一の接着剤層の前記最低粘度の0.05倍以上0.2倍以下にされた請求項1記載の接着フィルム。
- 前記第一の接着剤層が前記最低粘度となる温度と、前記第二の接着剤層が前記最低粘度となる温度の差が10℃以下である請求項1又は請求項2のいずれか1項記載の接着フィルム。
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CN200880021279.4A CN101755022B (zh) | 2007-06-27 | 2008-06-20 | 粘合薄膜、连接方法及接合体 |
KR1020107001236A KR101193735B1 (ko) | 2007-06-27 | 2008-06-20 | 접착필름, 접속방법 및 접합체 |
PCT/JP2008/061320 WO2009001771A1 (ja) | 2007-06-27 | 2008-06-20 | 接着フィルム、接続方法及び接合体 |
TW097123600A TWI386475B (zh) | 2007-06-27 | 2008-06-24 | 接著薄膜、連接方法及接合體 |
US12/645,883 US8796557B2 (en) | 2007-06-27 | 2009-12-23 | Adhesive film, connecting method, and joined structure |
HK10108212.3A HK1141826A1 (en) | 2007-06-27 | 2010-08-30 | Adhesive film, connecting method, and joined structure |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011129694A (ja) * | 2009-12-17 | 2011-06-30 | Tamura Seisakusho Co Ltd | はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法 |
JP2012169263A (ja) * | 2011-01-24 | 2012-09-06 | Sekisui Chem Co Ltd | 異方性導電材料、接続構造体の製造方法及び接続構造体 |
WO2013073847A1 (ko) * | 2011-11-14 | 2013-05-23 | 주식회사 엘지화학 | 접착 필름 |
JP2015170694A (ja) * | 2014-03-06 | 2015-09-28 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
WO2023048148A1 (ja) * | 2021-09-22 | 2023-03-30 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5140816B2 (ja) * | 2009-03-31 | 2013-02-13 | デクセリアルズ株式会社 | 接合体及びその製造方法 |
AT511655B1 (de) * | 2011-10-20 | 2013-02-15 | Prelonic Technologies Gmbh | Verfahren zum verkleben von schaltungselementen und kleber |
TWI494391B (zh) * | 2011-11-14 | 2015-08-01 | Lg Chemical Ltd | 結合膜及封裝有機電子裝置之方法 |
JP5912741B2 (ja) * | 2012-03-27 | 2016-04-27 | 日東電工株式会社 | 接合シート、電子部品およびその製造方法 |
EP2851406A4 (en) * | 2012-05-14 | 2015-12-23 | Lg Chemical Ltd | METHOD FOR PRODUCING AN ADHESIVE ARTICLE |
KR20140139902A (ko) * | 2013-05-28 | 2014-12-08 | 삼성디스플레이 주식회사 | 이방성 도전 필름 적층체, 이를 포함하는 표시 장치 및 표시 장치 제조 방법 |
JP6297381B2 (ja) * | 2014-03-26 | 2018-03-20 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続体の製造方法 |
US20150371916A1 (en) * | 2014-06-23 | 2015-12-24 | Rohm And Haas Electronic Materials Llc | Pre-applied underfill |
US9439326B1 (en) * | 2015-05-28 | 2016-09-06 | Hana Micron, Inc. | Electronic components |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
KR102422077B1 (ko) * | 2015-11-05 | 2022-07-19 | 삼성디스플레이 주식회사 | 도전성 접착 필름 및 이를 이용한 전자기기의 접착 방법 |
US10103069B2 (en) | 2016-04-01 | 2018-10-16 | X-Celeprint Limited | Pressure-activated electrical interconnection by micro-transfer printing |
US10222698B2 (en) | 2016-07-28 | 2019-03-05 | X-Celeprint Limited | Chiplets with wicking posts |
US11064609B2 (en) | 2016-08-04 | 2021-07-13 | X Display Company Technology Limited | Printable 3D electronic structure |
JP6524283B2 (ja) * | 2018-02-21 | 2019-06-05 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続体の製造方法 |
DE102018107853B3 (de) * | 2018-04-03 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Schalteinrichtung und Verfahren zur Herstellung einer Schalteinrichtung |
US10796971B2 (en) | 2018-08-13 | 2020-10-06 | X Display Company Technology Limited | Pressure-activated electrical interconnection with additive repair |
JP7256022B2 (ja) * | 2019-02-05 | 2023-04-11 | 日東シンコー株式会社 | 熱硬化性接着剤、及び、接着シート |
EP4050067A1 (en) | 2021-02-25 | 2022-08-31 | Henkel AG & Co. KGaA | Photocurable (meth)acrylate based adhesive |
CN112599426B (zh) * | 2021-03-05 | 2021-05-25 | 成都先进功率半导体股份有限公司 | 一种芯片刷胶方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001071854A1 (en) * | 2000-03-23 | 2001-09-27 | Sony Corporation | Electrical connection material and electrical connection method |
JP2005146044A (ja) * | 2003-11-12 | 2005-06-09 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
JP2005200521A (ja) * | 2004-01-15 | 2005-07-28 | Sony Chem Corp | 接着フィルム、接着フィルムの製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
JPH07230840A (ja) | 1994-02-17 | 1995-08-29 | Hitachi Chem Co Ltd | 接続部材及びこれを用いた電極の接続構造 |
WO1996042107A1 (en) * | 1995-06-13 | 1996-12-27 | Hitachi Chemical Company, Ltd. | Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device |
US6010768A (en) * | 1995-11-10 | 2000-01-04 | Ibiden Co., Ltd. | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
US6034331A (en) * | 1996-07-23 | 2000-03-07 | Hitachi Chemical Company, Ltd. | Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet |
ID19337A (id) * | 1996-12-26 | 1998-07-02 | Ajinomoto Kk | Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini |
CN1103803C (zh) * | 1997-02-27 | 2003-03-26 | 精工爱普生株式会社 | 粘接剂、液晶装置、液晶装置的制造方法和电子装置 |
US20010046021A1 (en) * | 1997-08-28 | 2001-11-29 | Takeshi Kozuka | A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device |
JP2000195584A (ja) * | 1998-12-25 | 2000-07-14 | Sony Corp | 電気的接続装置と電気的接続方法 |
US6512031B1 (en) * | 1999-04-15 | 2003-01-28 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition, laminate film using the same, and semiconductor device |
US7244675B2 (en) * | 2000-03-23 | 2007-07-17 | Sony Corporation | Electrical connection materials and electrical connection method |
JP3912515B2 (ja) * | 2002-07-18 | 2007-05-09 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
US20060240198A1 (en) * | 2003-06-04 | 2006-10-26 | Sekisui Chemical Co., Ltd. | Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
KR100601341B1 (ko) * | 2004-06-23 | 2006-07-14 | 엘에스전선 주식회사 | 이방 도전성 접착제 및 이를 이용한 접착필름 |
JP2006032335A (ja) | 2005-07-06 | 2006-02-02 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
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- 2010-08-30 HK HK10108212.3A patent/HK1141826A1/xx unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001071854A1 (en) * | 2000-03-23 | 2001-09-27 | Sony Corporation | Electrical connection material and electrical connection method |
JP2005146044A (ja) * | 2003-11-12 | 2005-06-09 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
JP2005200521A (ja) * | 2004-01-15 | 2005-07-28 | Sony Chem Corp | 接着フィルム、接着フィルムの製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011129694A (ja) * | 2009-12-17 | 2011-06-30 | Tamura Seisakusho Co Ltd | はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法 |
JP2012169263A (ja) * | 2011-01-24 | 2012-09-06 | Sekisui Chem Co Ltd | 異方性導電材料、接続構造体の製造方法及び接続構造体 |
WO2013073847A1 (ko) * | 2011-11-14 | 2013-05-23 | 주식회사 엘지화학 | 접착 필름 |
US9391293B2 (en) | 2011-11-14 | 2016-07-12 | Lg Chem, Ltd. | Adhesive film |
JP2015170694A (ja) * | 2014-03-06 | 2015-09-28 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
WO2023048148A1 (ja) * | 2021-09-22 | 2023-03-30 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5311772B2 (ja) | 2013-10-09 |
HK1141826A1 (en) | 2010-11-19 |
KR101193735B1 (ko) | 2012-10-22 |
US20100096175A1 (en) | 2010-04-22 |
TW200914569A (en) | 2009-04-01 |
WO2009001771A1 (ja) | 2008-12-31 |
US8796557B2 (en) | 2014-08-05 |
KR20120060923A (ko) | 2012-06-12 |
TWI386475B (zh) | 2013-02-21 |
KR101263623B1 (ko) | 2013-05-10 |
CN101755022A (zh) | 2010-06-23 |
CN101755022B (zh) | 2014-04-30 |
KR20100021530A (ko) | 2010-02-24 |
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