HK1141826A1 - Adhesive film, connecting method, and joined structure - Google Patents
Adhesive film, connecting method, and joined structureInfo
- Publication number
- HK1141826A1 HK1141826A1 HK10108212.3A HK10108212A HK1141826A1 HK 1141826 A1 HK1141826 A1 HK 1141826A1 HK 10108212 A HK10108212 A HK 10108212A HK 1141826 A1 HK1141826 A1 HK 1141826A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- adhesive film
- connecting method
- joined structure
- joined
- adhesive
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007168964A JP5311772B2 (ja) | 2007-06-27 | 2007-06-27 | 接着フィルム |
PCT/JP2008/061320 WO2009001771A1 (ja) | 2007-06-27 | 2008-06-20 | 接着フィルム、接続方法及び接合体 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1141826A1 true HK1141826A1 (en) | 2010-11-19 |
Family
ID=40185588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK10108212.3A HK1141826A1 (en) | 2007-06-27 | 2010-08-30 | Adhesive film, connecting method, and joined structure |
Country Status (7)
Country | Link |
---|---|
US (1) | US8796557B2 (ja) |
JP (1) | JP5311772B2 (ja) |
KR (2) | KR101263623B1 (ja) |
CN (1) | CN101755022B (ja) |
HK (1) | HK1141826A1 (ja) |
TW (1) | TWI386475B (ja) |
WO (1) | WO2009001771A1 (ja) |
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JP5140816B2 (ja) * | 2009-03-31 | 2013-02-13 | デクセリアルズ株式会社 | 接合体及びその製造方法 |
JP5560032B2 (ja) * | 2009-12-17 | 2014-07-23 | 株式会社タムラ製作所 | はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法 |
JP2012169263A (ja) * | 2011-01-24 | 2012-09-06 | Sekisui Chem Co Ltd | 異方性導電材料、接続構造体の製造方法及び接続構造体 |
AT511655B1 (de) * | 2011-10-20 | 2013-02-15 | Prelonic Technologies Gmbh | Verfahren zum verkleben von schaltungselementen und kleber |
TWI494391B (zh) * | 2011-11-14 | 2015-08-01 | Lg Chemical Ltd | 結合膜及封裝有機電子裝置之方法 |
WO2013073846A1 (ko) * | 2011-11-14 | 2013-05-23 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
JP5912741B2 (ja) * | 2012-03-27 | 2016-04-27 | 日東電工株式会社 | 接合シート、電子部品およびその製造方法 |
EP2851406A4 (en) * | 2012-05-14 | 2015-12-23 | Lg Chemical Ltd | METHOD FOR PRODUCING AN ADHESIVE ARTICLE |
KR20140139902A (ko) * | 2013-05-28 | 2014-12-08 | 삼성디스플레이 주식회사 | 이방성 도전 필름 적층체, 이를 포함하는 표시 장치 및 표시 장치 제조 방법 |
JP6307308B2 (ja) * | 2014-03-06 | 2018-04-04 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
JP6297381B2 (ja) * | 2014-03-26 | 2018-03-20 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続体の製造方法 |
US20150371916A1 (en) * | 2014-06-23 | 2015-12-24 | Rohm And Haas Electronic Materials Llc | Pre-applied underfill |
US9439326B1 (en) * | 2015-05-28 | 2016-09-06 | Hana Micron, Inc. | Electronic components |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
KR102422077B1 (ko) * | 2015-11-05 | 2022-07-19 | 삼성디스플레이 주식회사 | 도전성 접착 필름 및 이를 이용한 전자기기의 접착 방법 |
US10103069B2 (en) | 2016-04-01 | 2018-10-16 | X-Celeprint Limited | Pressure-activated electrical interconnection by micro-transfer printing |
US10222698B2 (en) | 2016-07-28 | 2019-03-05 | X-Celeprint Limited | Chiplets with wicking posts |
US11064609B2 (en) | 2016-08-04 | 2021-07-13 | X Display Company Technology Limited | Printable 3D electronic structure |
JP6524283B2 (ja) * | 2018-02-21 | 2019-06-05 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続体の製造方法 |
DE102018107853B3 (de) * | 2018-04-03 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Schalteinrichtung und Verfahren zur Herstellung einer Schalteinrichtung |
US10796971B2 (en) | 2018-08-13 | 2020-10-06 | X Display Company Technology Limited | Pressure-activated electrical interconnection with additive repair |
JP7256022B2 (ja) * | 2019-02-05 | 2023-04-11 | 日東シンコー株式会社 | 熱硬化性接着剤、及び、接着シート |
EP4050067A1 (en) | 2021-02-25 | 2022-08-31 | Henkel AG & Co. KGaA | Photocurable (meth)acrylate based adhesive |
CN112599426B (zh) * | 2021-03-05 | 2021-05-25 | 成都先进功率半导体股份有限公司 | 一种芯片刷胶方法 |
KR20240032918A (ko) * | 2021-09-22 | 2024-03-12 | 데쿠세리아루즈 가부시키가이샤 | 접속 구조체의 제조 방법 |
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JP3912515B2 (ja) * | 2002-07-18 | 2007-05-09 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
US20060240198A1 (en) * | 2003-06-04 | 2006-10-26 | Sekisui Chemical Co., Ltd. | Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
JP2005146044A (ja) * | 2003-11-12 | 2005-06-09 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
JP5196703B2 (ja) | 2004-01-15 | 2013-05-15 | デクセリアルズ株式会社 | 接着フィルム |
KR100601341B1 (ko) * | 2004-06-23 | 2006-07-14 | 엘에스전선 주식회사 | 이방 도전성 접착제 및 이를 이용한 접착필름 |
JP2006032335A (ja) | 2005-07-06 | 2006-02-02 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
-
2007
- 2007-06-27 JP JP2007168964A patent/JP5311772B2/ja active Active
-
2008
- 2008-06-20 KR KR1020127013969A patent/KR101263623B1/ko active IP Right Grant
- 2008-06-20 CN CN200880021279.4A patent/CN101755022B/zh active Active
- 2008-06-20 KR KR1020107001236A patent/KR101193735B1/ko active IP Right Grant
- 2008-06-20 WO PCT/JP2008/061320 patent/WO2009001771A1/ja active Application Filing
- 2008-06-24 TW TW097123600A patent/TWI386475B/zh active
-
2009
- 2009-12-23 US US12/645,883 patent/US8796557B2/en active Active
-
2010
- 2010-08-30 HK HK10108212.3A patent/HK1141826A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
WO2009001771A1 (ja) | 2008-12-31 |
CN101755022B (zh) | 2014-04-30 |
US8796557B2 (en) | 2014-08-05 |
KR20100021530A (ko) | 2010-02-24 |
KR101263623B1 (ko) | 2013-05-10 |
JP2009007443A (ja) | 2009-01-15 |
TW200914569A (en) | 2009-04-01 |
KR20120060923A (ko) | 2012-06-12 |
KR101193735B1 (ko) | 2012-10-22 |
US20100096175A1 (en) | 2010-04-22 |
JP5311772B2 (ja) | 2013-10-09 |
CN101755022A (zh) | 2010-06-23 |
TWI386475B (zh) | 2013-02-21 |
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